ASUS NUC14RVHv7 and ASRock Industrial NUC BOX-155H Review: Meteor Lake Brings Accelerated AI to UCFF PCs

Intel's Meteor Lake series of processors has had a drawn-out launch since its details were officially presented in September 2023. The series marks Intel's foray into the consumer market with a tile-based chiplet configuration held together with Foveros packaging. Similar to Tiger Lake, the focus of Meteor Lake has primarily been on the mobile market - ultraportables and notebooks. However, this has not prevented Intel and its partners from introducing it as a follow-up to Raptor Lake-P and Raptor Lake-H in the SFF / UCFF desktop market.

ASRock Industrial has consistently been the first to market with ultra-compact form-factor motherboards and mini-PCs, with product announcements coinciding with Intel's launch of its latest and greatest mobile processors. Meteor Lake has not been any different, with the NUC(S) Ultra 100 BOX series launching towards the end of Q4 2023. In the meanwhile, Intel's NUC business unit was purchased by ASUS and had its first major product announcement in the form of the Meteor Lake-based Revel Canyon NUCs at the 2024 CES.

The flagship NUC Ultra 100 BOX system is the NUC BOX-155H based on the Intel Core Ultra 7 155H. The Revel Canyon NUC lineup includes a model based on the Core Ultra 7 165H with vPro capabilities, with its claim to fame being the ability to hit 5 GHz on the performance cores. Read on for a detailed look at the features and performance profile of the ASRock Industrial NUC BOX-155H and the ASUS NUC14RVHv7. The analysis also helps in establishing the potential and benefits of Meteor Lake for the UCFF desktop market over its predecessors and the competition.

Systems

GEEKOM A7 mini-PC Review : Premium Phoenix in a Compact 4x4 Package

The introduction of the Intel NUC in the early 2010s kickstarted the ultra-compact form-factor (UCFF) trend for desktop systems. Processors with TDPs ranging from 6 - 15W formed the backbone of this segment in the initial years. The emergence of configurable TDPs for notebook processors has prompted some vendors to introduce UCFF systems with regular 45W TDP processors (albeit, in cTDP-down mode).

GEEKOM, the private label brand of Shenzhen Jiteng Network Technology Co., has emerged as a popular UCFF system vendor in the last couple of years. After starting off with systems based on older processors, the company has moved on to introducing units carrying the latest and greatest from both AMD and Intel. The company has also been innovating on the form-factor side with compact boards smaller than the traditional 4"x4" ones in the NUC clones. The GEEKOM A7 is one such system based on AMD's Phoenix lineup.

The system is available in two configurations - one with the Ryzen 7 7840HS, and the other with the Ryzen 9 7940HS. The company sent over the flagship configuration to put through our evaluation routine for small form-factor computing systems. Read on to explore the performance profile and value proposition of the system, along with a discussion of the trade-offs involved in cramming a powerful notebook processor inside a system smaller than the traditional NUC.

Systems

TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025

In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, TSMC also shared progress of its N2 node as part of its Symposiums 2024. The company's first 2nm-class fabrication node, and predominantly featuring gate-all-around transistors, according to TSMC N2 has almost achieved its target performance and yield goals, which places it on track to enter high-volume manufacturing in the second half of 2025.

TSMC states that 'N2 development is well on track and N2P is next.' In particular, gate-all-around nanosheet devices currently achieve over 90% of their expected performance, whereas yields of 256 Mb SRAM (32 MB) devices already exceeds 80%, depending on the batch. All of this for a node that is over a year away from mass production.

Meanwhile, average yield of a 256 Mb SRAM was around 70% as of March, 2024, up from around 35% in April, 2023. Device performance has also been improving with higher frequencies being achieved while keeping power consumption in check.

Chip designer interest towards TSMC's first 2nm-class gate-all-around nanosheet transistor-based technology is significant, too. The number of new tape-outs (NTOs) in the first year of N2 is over two-times higher than it was for N5. Though with that said, given TSMC's close working relationship with a handful of high-volume vendors – most notably Appe – NTOs can be a very misleading figure since the first year of a new node at TSMC is capacity constrained, and consequently the bulk of that capacity goes to TSMC's priority partners.

Meanwhile, there were considerably more N5 tapeouts in its second year (some where N5P, of course) and N2 promises to have 2.6X more NTOs in its second year. So the node indeed looks quite promising. In fact, based on TSMC's slides (which we're unfortunately not able to republish), N2 is more popular than N3 in terms of NTOs both in the first and the second years of existence.

When it comes to the second year of N2, in the second half of 2026 TSMC plans to roll out its N2P technology, which promises additional performance and power benefits. N2P is expected to improve frequency by 15% - 20%, reduce power consumption by 30% - 40%, and increase chip density by over 1.15 times compared to N3E, significant benefits to move to all-new GAA nanosheet transistors.

Finally, for those companies that need the best in performance, power, and density, TSMC is poised to offer their A16 process in 2026. That node will also bring in backside power delivery, which will add costs, but is expected to greatly improve performance efficiency and scaling.

Semiconductors

TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025

In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, TSMC also shared progress of its N2 node as part of its Symposiums 2024. The company's first 2nm-class fabrication node, and predominantly featuring gate-all-around transistors, according to TSMC N2 has almost achieved its target performance and yield goals, which places it on track to enter high-volume manufacturing in the second half of 2025.

TSMC states that 'N2 development is well on track and N2P is next.' In particular, gate-all-around nanosheet devices currently achieve over 90% of their expected performance, whereas yields of 256 Mb SRAM (32 MB) devices already exceeds 80%, depending on the batch. All of this for a node that is over a year away from mass production.

Meanwhile, average yield of a 256 Mb SRAM was around 70% as of March, 2024, up from around 35% in April, 2023. Device performance has also been improving with higher frequencies being achieved while keeping power consumption in check.

Chip designer interest towards TSMC's first 2nm-class gate-all-around nanosheet transistor-based technology is significant, too. The number of new tape-outs (NTOs) in the first year of N2 is over two-times higher than it was for N5. Though with that said, given TSMC's close working relationship with a handful of high-volume vendors – most notably Appe – NTOs can be a very misleading figure since the first year of a new node at TSMC is capacity constrained, and consequently the bulk of that capacity goes to TSMC's priority partners.

Meanwhile, there were considerably more N5 tapeouts in its second year (some where N5P, of course) and N2 promises to have 2.6X more NTOs in its second year. So the node indeed looks quite promising. In fact, based on TSMC's slides (which we're unfortunately not able to republish), N2 is more popular than N3 in terms of NTOs both in the first and the second years of existence.

When it comes to the second year of N2, in the second half of 2026 TSMC plans to roll out its N2P technology, which promises additional performance and power benefits. N2P is expected to improve frequency by 15% - 20%, reduce power consumption by 30% - 40%, and increase chip density by over 1.15 times compared to N3E, significant benefits to move to all-new GAA nanosheet transistors.

Finally, for those companies that need the best in performance, power, and density, TSMC is poised to offer their A16 process in 2026. That node will also bring in backside power delivery, which will add costs, but is expected to greatly improve performance efficiency and scaling.

Semiconductors

Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab

To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and with Intel joining the contract chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that Rapidus, a foundry startup backed by the Japanese government and several major Japanese companies, is going to enter in 2027, when its first fab comes online, just a few years from now.

In a fresh update on the status of bringing up the company's first leading-edge fab, Rapidus has revealed that they are intending to get in to the chip packaging game as well. Once complete, the ¥5 trillion ($32 billion) fab will be offering both chip lithography on a 2nm node, as well as packaging services for chips produced within the facility – a notable distinction in an industry where, even if packaging isn't outsourced entirely (OSAT), it's still normally handled at dedicated facilities.

Ultimately, while the company wants to serve the same clients as TSMC, Samsung, and Intel Foundry, the firm plans to do things almost completely differently than its competitors in a bid to speed up chipmaking from finishing design to getting a working chip out of the fab.

"We are very proud of being Japanese," said Henri Richard, general manager and president of Rapidus's subsidiary in the U.S. "[…] I know that some people may be looking at this thinking [that] Japan is known for quality, attention to detail, but not necessarily for speed, or flexibility. But I will tell you that Atsuyoshi Koike (the head of Rapidus) is a very special executive. That is, he has all the quality of Japan, with a lot of American thinking. So he is quite a unique guy, and certainly extraordinarily focused on creating a company that will be extremely flexible and extremely quick on its feet."

2nm Only, At First

Perhaps the most significant difference between Rapidus and traditional foundries is that the company will offer only leading-edge manufacturing technologies to its clients: 2 nm in 2027 (phase 1) and then 1.4 nm in the future (phase 2). This is a stark contrast with other contract fabs, including Intel, which tend to offer their customers a full range of fabrication processes to land more clients and produce more chips. Apparently, Rapidus hopes that that there will be enough Japanese and American chip developers that are inclined to use its 2 nm fabrication process to produce their designs. With that said, the number of chip designers that are using the most advanced production node at any given time is relatively small – limited to large firms who need first-mover advantage and have the margins to justify taking the risk – so it remains to be seen whether Rapidus's business model becomes successful. The company believes it will, since the market of chips made on advanced nodes is growing rapidly.

"Until recently IDC was giving a an estimation of the 2nm and below market as about $80 billion and I think we are going to see soon a revision of the potential to $150 billion," said Richard. "[…] TSMC is the 800 pound gorilla in the space. Samsung is there and Intel is going to enter that space. But the market growth is so significant and the demand is so high, that it does not take a lot of market share for Rapidus to be successful. One of the things that gives me great comfort is that when I talk to our EDA partners, when I talk to our potential clients, it is obvious that the entire industry is looking for alternative supply from a fully independent foundry. There is a place for Samsung in this industry, there is a place for Intel in this industry, the industry is currently owned by TSMC. But another totally independent foundry is more than welcome by all of the ecosystem partners and by the customers. So, I feel really, really good about Rapidus's positioning."

Speaking of advanced process technologies, it is notable that Rapidus does not plan to use ASML's High-NA Twinscan EXE lithography scanners for 2 nm production. Instead, Rapidus is sticking to ASML's proven Low-NA scanners, which will reduce costs of Rapidus's fab, though it will entail usage of EUV double patterning, which brings up costs and lengthens the production cycle in other ways. Even with those trade-offs, SemiAnalysis analysts believe that given the cost of High-NA EUV litho tools and halved imaging field, ... Semiconductors

Intel Core i9-14900KS Review: The Swan Song of Raptor Lake With A Super Fast 6.2 GHz Turbo

For numerous generations of their desktop processor releases, Intel has made available a selection of high-performance special edition "KS" CPUs that add a little extra compared to their flagship chip. With a lot of interest, primarily from the enthusiasts looking for the fastest processors, Intel's latest Core i9-14900KS represents a super-fast addition to its 14th Generation Core lineup with out-of-the-box turbo clock speeds of up to 6.2 GHz and represents the last processor to end an era as Intel is removing the 'i' from its legendary nomenclature for future desktop chip releases.

Reaching speeds of up to 6.2 GHz, this sets up the Core i9-14900KS as the fastest desktop CPU in the world right now, at least in terms of frequencies out of the box. Building on their 'regular' flagship chip, the Core i9-14900, the Core i9-14900KS is also using their refreshed Raptor Lake (RPL-R) 8P+16E core chip design with a 200 MHz higher boost clock speed and also has a 100 MHz bump on P-Core base frequency. 

This new KS series SKU shows Intel's drive to offer an even faster alternative to their desktop regular K series offerings, and with the Core i9-14900KS, they look to provide the best silicon from their Raptor Lake Refresh series with more performance available to unlock to those who can. The caveat is that achieving these ridiculously fast clock speeds of 6.2 GHz on the P-Core comes at the cost of power and heat; keeping a processor pulling upwards of 350 W is a challenge in its own right, and users need to factor this in if even contemplating a KS series SKU.

In our previous KS series review, the Core i9-13900KS reached 360 W at its peak, considerably more than the Core i9-13900K. The Core i9-14900KS, built on the same core architecture, is expected to surpass that even further than the Core i9-14900K. We aim to compare Intel's final Core i series processor to the best of what both Intel and AMD have available, and it will be interesting to see how much performance can be extrapolated from the KS compared to the regular K series SKU.

CPUs

Arm Unveils 2024 CPU Core Designs, Cortex X925, A725 and A520: Arm v9.2 Redefined For 3nm

As the semiconductor industry continues to evolve, Arm stands at the forefront of innovation for its core and IP architecture, especially in the mobile space, by pushing the boundaries of technology to deliver cutting-edge solutions for end users. For 2024, Arm's year-on-year strategic advancements focus on enhancing last year's Armv9.2 architecture with a new twist. Arm has rebranded and re-strategized its efforts by introducing Arm Compute Subsystem (CSS), the direct successor to last year's Total Compute Solutions (TSC2023) platform.

Arm is also transitioning its latest IP and Cortex core designs, including the largest Cortex X925, the middle Cortex A725, and the refreshed and smaller Cortex A520 to the more advanced 3 nm process technology. Arm promises that the 3 nm process node will deliver unprecedented performance gains compared to last year's designs, power efficiency and scalability improvements, and new front and back-end refinements to its Cortex series of cores. Arms' new solutions look to power the next-generation mobile and AI applications as Arm, along with its complete AArch64 64-bit instruction execution and approach to solutions geared towards mobile and notebooks, look set to redefine end users' expectations within the Android and Windows on Arm products.

CPUs

Arm Unveils 2024 CPU Core Designs, Cortex X925, A725 and A520: Arm v9.2 Redefined For 3nm

As the semiconductor industry continues to evolve, Arm stands at the forefront of innovation for its core and IP architecture, especially in the mobile space, by pushing the boundaries of technology to deliver cutting-edge solutions for end users. For 2024, Arm's year-on-year strategic advancements focus on enhancing last year's Armv9.2 architecture with a new twist. Arm has rebranded and re-strategized its efforts by introducing Arm Compute Subsystem (CSS), the direct successor to last year's Total Compute Solutions (TSC2023) platform.

Arm is also transitioning its latest IP and Cortex core designs, including the largest Cortex X925, the middle Cortex A725, and the refreshed and smaller Cortex A520 to the more advanced 3 nm process technology. Arm promises that the 3 nm process node will deliver unprecedented performance gains compared to last year's designs, power efficiency and scalability improvements, and new front and back-end refinements to its Cortex series of cores. Arms' new solutions look to power the next-generation mobile and AI applications as Arm, along with its complete AArch64 64-bit instruction execution and approach to solutions geared towards mobile and notebooks, look set to redefine end users' expectations within the Android and Windows on Arm products.

CPUs

TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node

With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity for specialty technologies by 50% by 2027. As disclosed by the company during its European Technology Symposium this week, TSMC expects to need to not only convert existing capacity to meet demands for specialty processes, but even build new (greenfield) fab space just for this purpose. One of the big drivers for this demand, in turn, will be TSMC's next specialty node: N4e, a 4nm-class ultra-low-power production node.

"In the past, we always did the review phase [for upcoming fabs], but for the first time in a long time at TSMC, we started building greenfield fab that will address the future specialty technology requirements," said Dr. Kevin Zhang, Senior Vice President, Business Development and Overseas Operations Office, at the event. "In the next four to five years, we actually going to grow our specialty capacity by up to 1.5x. In doing so we actually expanding the footprint of our manufacturing network to improve the resiliency of the overall fab supply chain."

On top of its well-known major logic nodes like N5 and N3E, TSMC also offers a suite of specialty nodes for applications such as power semiconductors, mixed analog I/O, and ultra-low-power applications (e.g. IoT). These are typically based on the company's trailing manufacturing processes, but regardless of the underlying technology, the capacity demand for these nodes is growing right alongside the demand for TSMC's major logic nodes. All of which has required TSMC to reevaluate how they go about planning for capacity on their specialty nodes.

TSMC's expansion strategy in the recent years has pursued several goals. One of them has been to build new fabs outside of Taiwan; another has been to generally expand production capacity to meet future demand for all types of process technologies – which is why the company is building up capacity for specialty nodes.

At present, TSMC's most advanced specialty node is N6e, an N7/N6 variant that supports operating voltages between 0.4V and 0.9V. With N4e, TSMC is looking at voltages below 0.4V. Though for now, TSMC is not disclosing much in the way of technical details for the planned node; given the company's history here, we expect they'll have more to talk about next year once the new process is ready.

Semiconductors

Micron Ships Crucial-Branded LPCAMM2 Memory Modules: 64GB of LPDDR5X For $330

As LPCAMM2 adoption begins, the first retail memory modules are finally starting to hit the retail market, courtesy of Micron. The memory manufacturer has begun selling their LPDDR5X-based LPCAMM2 memory modules under their in-house Crucial brand, making them available on the latter's storefront. Timed to coincide with the release of Lenovo's ThinkPad P1 Gen 7 laptop – the first retail laptop designed to use the memory modules – this marks the de facto start of the eagerly-awaited modular LPDDR5X memory era.

Micron's Low Power Compression Attached Memory Module 2 (LPCAMM2) modules are available in capacities of 32 GB and 64 GB. These are dual-channel modules that feature a 128-bit wide interface, and are based around LPDDR5X memory running at data rates up to 7500 MT/s. This gives a single LPCAMM2 a peak bandwidth of 120 GB/s. Micron is not disclosing the latencies of its LPCAMM2 memory modules, but it says that high data transfer rates of LPDDR5X compensate for the extended timings.

Micron says that LPDDR5X memory offers significantly lower power consumption, with active power per 64-bit bus being 43-58% lower than DDR5 at the same speed, and standby power up to 80% lower. Meanwhile, similar to DDR5 modules, LPCAMM2 modules include a power management IC and voltage regulating circuitry, which provides module manufacturers additional opportunities to reduce power consumption of their products.

Source: Micron LPDDR5X LPCAMM2 Technical Brief

It's worth noting, however, that at least for the first generation of LPCAMM2 modules, system vendors will need to pick between modularity and performance. While soldered-down LPDDR5X memory is available at speeds up to 8533 MT/sec – and with 9600 MT/sec on the horizon – the fastest LPCAMM2 modules planned for this year by both Micron and rival Samsung will be running at 7500 MT/sec. So vendors will have to choose between the flexibility of offering modular LPDDR5X, or the higher bandwidth (and space savings) offered by soldering down their memory.

Micron, for its part, is projecting that 9600 MT/sec LPCAMM2 modules will be available by 2026. Though it's all but certain that faster memory will also be avaialble in the same timeframe.

Micron's Crucial LPDDR5X 32 GB module costs $174.99, whereas a 64 GB module costs $329.99.

Memory

Not Dead Yet: WD Releases New 6TB 2.5-Inch External Hard Drives - First Upgrade in Seven Years

UPDATE 5/17, 6 PM: Western Digital has confirmed that the new 2.5-inch T GB HDDs uses 6 SMR platters

The vast majority of laptops nowadays use solid-state drives, which is why the development of new, higher-capacity 2.5-inch hard drives has all but come to a halt. Or rather, it almost has. It seems that the 2.5-inch form factor has a bit more life left in it after all, as today Western Digital has released a slate of new external storage products based on a new, high-capacity 6 TB 2.5-inch hard drive.

WD's new 6 TB spinner is being used to offer upgraded versions of the company's My Passport, Black P10, and and G-DRIVE ArmorATD portable storage products. Notably, however, WD isn't selling the bare 2.5-inch drive on a standalone basis – at least not yet – so for the time being it's entirely reserved for use in external storage.

Consequently, WD isn't publishing much about the 6 TB hard drive itself. The maximum read speed for these products is listed at 130 MB/sec – the same as WD's existing externals – and write performance goes unmentioned.

Notably, all of these 6 TB devices are thicker than their existing 5 TB counterparts, which strongly suggests that WD has increased their storage capacity not by improving their areal density, but by adding another platter to their existing drive platform (which WD has since confirmed). This, in turn, would help to explain why these new drives are being used in external storage products, as WD's 5 TB 2.5-inch drives are already 15mm thick and using 5 platters. 15mm is the highest standard thickness for a 2.5-inch form-factor, and already incompatible with a decent number of portable devices. External drives, in turn, are the only place these even thicker 2.5-inch drives would fit.

WD's specifications also gloss over whether these drives are based on shingled magnetic recording (SMR) technology. The company was already using SMR for their 5 TB drives in order to hit the necessary storage density there, and WD has since confirmed that this is exactly the case. Which is likely why the company isn't publishing write performance specifications for the drives, as we've seen device-managed SMR drives bottom out as low as 10 MB/second in our testing when the drive needs to rewrite data.

Depending on the specific drive model, all of the external storage drives use either a USB-C connector, or the very quaint USB Micro-B 3.0 connector. Though regardless of the physical connector used, all of the drives feature a USB 3.2 Gen 1 (5Gbps) electrical interface, which is more than ample given the drives' physically-limited transfer speeds.

Wrapping things up, according to WD the new drives are available at retail immediately. The WD My Passport Ultra and WD My Passport Ultra for Mac with USB-C both retail for $199.99; the WD My Passport and WD My Passport for Mac are $179.99; the WD My Passport Works With USB-C is $184.99; the gaming-focused WD_Black P10 Game Drive sells for $184.99, and the SanDisk Professional G-Drive ArmorATD is $229.99. All of Western Digital's external storage drives are backed with a three-year limited warranty.

Storage

Intel Issues Official Statement Regarding 14th and 13th Gen Instability, Recommends Intel Default Settings

Further to our last piece which we detailed Intel's issue to motherboard vendors to follow with stock power settings for Intel's 14th and 13th Gen Core series processors, Intel has now issued a follow-up statement to this. Over the last week or so, motherboard vendors quickly released firmware updates with a new profile called 'Intel Baseline', which motherboard vendors assumed would address the instability issues. 

As it turns out, Intel doesn't seem to accept this as technically, these Intel Baseline profiles are not to be confused with Intel's default specifications. This means that Intel's Baseline profiles seemingly give the impression that they are operating at default settings, hence the terminology 'baseline' used, but this still opens motherboard vendors to use their interpretations of MCE or Multi-Core Enhancement.

To clarify things for consumers, Intel has sent us the following statement:

Several motherboard manufacturers have released BIOS profiles labeled ‘Intel Baseline Profile’. However, these BIOS profiles are not the same as the 'Intel Default Settings' recommendations that Intel has recently shared with its partners regarding the instability issues reported on 13th and 14th gen K SKU processors.

These ‘Intel Baseline Profile’ BIOS settings appear to be based on power delivery guidance previously provided by Intel to manufacturers describing the various power delivery options for 13th and 14th Generation K SKU processors based on motherboard capabilities.

Intel is not recommending motherboard manufacturers to use ‘baseline’ power delivery settings on boards capable of higher values.

Intel’s recommended ‘Intel Default Settings’ are a combination of thermal and power delivery features along with a selection of possible power delivery profiles based on motherboard capabilities.

Intel recommends customers to implement the highest power delivery profile compatible with each individual motherboard design as noted in the table below:

Click to Enlarge Intel's Default Settings

What Intel's statement is effectively saying to consumers, is that users shouldn't be using the Baseline Power Delivery profiles which are offered by motherboard vendors through a plethora of firmware updates. Instead, Intel is recommending users opt for Intel Default Settings, which follows what the specific processor is rated for by Intel out of the box to achieve the clock speeds advertised, without users having to worry about firmware 'over' optimization which can cause instability as there have been many reports of happening.

Not only this, but the Intel Default settings offer a combination of thermal specifications and power capabilities, including voltage and frequency curve settings that apply to the capability of the motherboard used, and the power delivery equipped on the motherboard. At least for the most part, Intel is recommending users with 14th and 13th-Gen Core series K, KF, and KS SKUs that they do not recommend users opt in using the Baseline profiles offered by motherboard vendors.

Digesting the contrast between the two statements, the key differential is that Intel's priority is reducing the current going through the processor, which for both the 14th and 13th Gen Core series processors is a maximum of 400 A, even when using the Extreme profile. We know those motherboard vendors on their Z790 and Z690 motherboards opt for an unrestricted power profile, which is essentially 'unlimited' power and current to maximize performance at the cost of power consumption and heat, which does exacerbate problems and can lead to frequent bouts of instability, especially on high-intensity workloads.

Another variable Intel is recommending is that the AC Load Line must match the design target of the processor, with a maximum value of 1.1 mOhm, and that the DC Load Line must be ... CPUs

Lexar ARMOR 700 Portable SSD Review: Power-Efficient 2 GBps in an IP66 Package

Lexar has a long history of serving the flash-based consumer storage market in the form of SSDs, memory cards, and USB flash drives. After having started out as a Micron brand, the company was acquired by Longsys which has diversified its product lineup with regular introduction of new products. Recently, the company announced a number of portable SSDs targeting different market segments. The Lexar ARMOR 700 Portable SSD makes its entry as the new flagship in the 20 Gbps PSSD segment.

Despite its flagship positioning and rugged nature, the ARMOR 700 is reasonably priced thanks to the use of a native USB flash controller - the Silicon Motion SM2320. Similar to the SL500, the product uses YMTC 3D TLC NAND (compared to the usual Micron or BiCS NAND that we have seen in SM2320-based PSSDs from other vendors). Read on for a detailed look at the ARMOR 700, including an analysis of its internals and evaluation of its performance consistency, power consumption, and thermal profile.

Storage

MSI Teases Z790 Project Zero Plus Motherboard With CAMM2 Memory Support

MSI on Thursday published the first image of a new desktop motherboard that supports the innovative DDR5 compression attached memory module (CAMM2). DDR5 CAMM2 modules are designed to improve upon the SO-DIMM form factor used for laptops, alleviating some of the high-speed signaling and capacity limitations of SO-DIMMs while also shaving down on the volume of space required. And while we're eagerly awaiting to see CAMM2 show up in more laptops, its introduction in a PC motherboard comes as a bit of a surprise, since PCs aren't nearly as space-constrained.

MSI's Z790 Project Zero Plus motherboard, which supports Intel's latest 14^th Generation Core processors, is to a large degree a proof-of-concept product that is showcasing several new technologies and atypical configuration options. Key among these, of course, is the CAMM2 connector. The single connector supports a 128-bit DDR5 memory bus, allowing for a system to be fully populated with RAM with just a single, horizontally-mounted CAMM2 module. And in terms of design, the Zero Plus also features backside power connectors for improved cable management.

CAMM2 is designed to replace traditional modules in an SO-DIMM form-factor and is meant to occupy up to 64% less space than two DDR5 SO-DIMMs. In addition, CAMM2 greatly optimizes signal and power traces inside the motherboard, primarily by ensuring all memory trace lengths are identical, reducing some of the signaling penalties that normally come from supporting multiple SO-DIMM slots in a system. With DDR5 being particularly sensitive here – to the point where 2 DIMM Per Channel (2DPC) configurations take a max frequency hit even on desktop systems – CAMM2 modules are expected to simplify and, to a degree, improve laptop designs to better match DDR5's limitations.

Though whether CAMM2 sees widespread adoption remains to be seen. Unlike it's LPDDR5X counterpart, LPCAMM2, DDR5 CAMM2 hasn't attracted the same interest from laptop vendors quite yet, in large part because it doesn't introduce any new functionality (e.g. socketed LPDDR5X).

Meanwhile CAMM2 in ATX desktops is all but unexplored right now, which is why we're seeing experimental products like MSI's motherboard. The space savings alone aren't as important in desktops due to their size – though CAMM2 does cut down on Z-height, keeping memory away from CPU coolers. But PC makers will be looking at other factors such as inventory, as equipping desktop boards with CAMM2 connectors would allow them to use the same memory modules in both laptops and desktops. And longer term there is the question of whether CAMM2 can deliver tangible signaling benefits over traditional DIMMs.

MSI plans to showcase its Z790 Project Zero Plus platform at Computex, alongside memory partner Kingston. The latter will be at the show to demonstrate its Fury Impact CAMM2 memory module, which is one of the first DDR5 CAMM2 modules to be announced.

Motherboards

TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node

With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity for specialty technologies by 50% by 2027. As disclosed by the company during its European Technology Symposium this week, TSMC expects to need to not only convert existing capacity to meet demands for specialty processes, but even build new (greenfield) fab space just for this purpose. One of the big drivers for this demand, in turn, will be TSMC's next specialty node: N4e, a 4nm-class ultra-low-power production node.

"In the past, we always did the review phase [for upcoming fabs], but for the first time in a long time at TSMC, we started building greenfield fab that will address the future specialty technology requirements," said Dr. Kevin Zhang, Senior Vice President, Business Development and Overseas Operations Office, at the event. "In the next four to five years, we actually going to grow our specialty capacity by up to 1.5x. In doing so we actually expanding the footprint of our manufacturing network to improve the resiliency of the overall fab supply chain."

On top of its well-known major logic nodes like N5 and N3E, TSMC also offers a suite of specialty nodes for applications such as power semiconductors, mixed analog I/O, and ultra-low-power applications (e.g. IoT). These are typically based on the company's trailing manufacturing processes, but regardless of the underlying technology, the capacity demand for these nodes is growing right alongside the demand for TSMC's major logic nodes. All of which has required TSMC to reevaluate how they go about planning for capacity on their specialty nodes.

TSMC's expansion strategy in the recent years has pursued several goals. One of them has been to build new fabs outside of Taiwan; another has been to generally expand production capacity to meet future demand for all types of process technologies – which is why the company is building up capacity for specialty nodes.

At present, TSMC's most advanced specialty node is N6e, an N7/N6 variant that supports operating voltages between 0.4V and 0.9V. With N4e, TSMC is looking at voltages below 0.4V. Though for now, TSMC is not disclosing much in the way of technical details for the planned node; given the company's history here, we expect they'll have more to talk about next year once the new process is ready.

Semiconductors

Intel Issues Official Statement Regarding 14th and 13th Gen Instability, Recommends Intel Default Settings

Further to our last piece which we detailed Intel's issue to motherboard vendors to follow with stock power settings for Intel's 14th and 13th Gen Core series processors, Intel has now issued a follow-up statement to this. Over the last week or so, motherboard vendors quickly released firmware updates with a new profile called 'Intel Baseline', which motherboard vendors assumed would address the instability issues. 

As it turns out, Intel doesn't seem to accept this as technically, these Intel Baseline profiles are not to be confused with Intel's default specifications. This means that Intel's Baseline profiles seemingly give the impression that they are operating at default settings, hence the terminology 'baseline' used, but this still opens motherboard vendors to use their interpretations of MCE or Multi-Core Enhancement.

To clarify things for consumers, Intel has sent us the following statement:

Several motherboard manufacturers have released BIOS profiles labeled ‘Intel Baseline Profile’. However, these BIOS profiles are not the same as the 'Intel Default Settings' recommendations that Intel has recently shared with its partners regarding the instability issues reported on 13th and 14th gen K SKU processors.

These ‘Intel Baseline Profile’ BIOS settings appear to be based on power delivery guidance previously provided by Intel to manufacturers describing the various power delivery options for 13th and 14th Generation K SKU processors based on motherboard capabilities.

Intel is not recommending motherboard manufacturers to use ‘baseline’ power delivery settings on boards capable of higher values.

Intel’s recommended ‘Intel Default Settings’ are a combination of thermal and power delivery features along with a selection of possible power delivery profiles based on motherboard capabilities.

Intel recommends customers to implement the highest power delivery profile compatible with each individual motherboard design as noted in the table below:

Click to Enlarge Intel's Default Settings

What Intel's statement is effectively saying to consumers, is that users shouldn't be using the Baseline Power Delivery profiles which are offered by motherboard vendors through a plethora of firmware updates. Instead, Intel is recommending users opt for Intel Default Settings, which follows what the specific processor is rated for by Intel out of the box to achieve the clock speeds advertised, without users having to worry about firmware 'over' optimization which can cause instability as there have been many reports of happening.

Not only this, but the Intel Default settings offer a combination of thermal specifications and power capabilities, including voltage and frequency curve settings that apply to the capability of the motherboard used, and the power delivery equipped on the motherboard. At least for the most part, Intel is recommending users with 14th and 13th-Gen Core series K, KF, and KS SKUs that they do not recommend users opt in using the Baseline profiles offered by motherboard vendors.

Digesting the contrast between the two statements, the key differential is that Intel's priority is reducing the current going through the processor, which for both the 14th and 13th Gen Core series processors is a maximum of 400 A, even when using the Extreme profile. We know those motherboard vendors on their Z790 and Z690 motherboards opt for an unrestricted power profile, which is essentially 'unlimited' power and current to maximize performance at the cost of power consumption and heat, which does exacerbate problems and can lead to frequent bouts of instability, especially on high-intensity workloads.

Another variable Intel is recommending is that the AC Load Line must match the design target of the processor, with a maximum value of 1.1 mOhm, and that the DC Load Line must be ... CPUs

The Arctic Cooling Freezer 36 ARGB CPU Cooler Review: Budget Cooling Done Well

As modern high-performance CPUs generate more heat, there's been a noticeable increase in the demand for powerful air coolers capable of managing these thermal challenges. Traditional stock air coolers, while sufficient for regular use, are typically designed to be cheap and relatively compact, leaving further improvements to noise control and peak cooling efficiency on the table. This gap has long prompted advanced users and system builders to opt for high-quality aftermarket coolers that designed to better handle the heat output from top-tier processors.

Known for their innovative approach to PC hardware, Arctic Cooling has stepped into this competitive market with a product aimed at delivering effective cooling at a very low retail price. The Freezer 36 A-RGB, a dual fan tower cooler, is designed to support the cooling demands of the latest CPUs while also offering customizable RGB lighting for visual flair. This review will explore the features, performance, and value of the Arctic Cooling Freezer 36 A-RGB, comparing it with other leading products in the market to see how it stacks up in providing efficient and effective cooling for modern CPUs.

Cases/Cooling/PSUs

TSMC Offers a Peek at 'Global Gigafab' Process Replication Program

At its European Technology Symposium last week TSMC revealed some of the details about its Global Gigafab Manufacturing program, the company's strategy to replicate its manufacturing processes across its multiple gigafab sites.

The need for large-scale multi-national fabs to have a process in place to replicate their facilities is well-documented at this point. As scaling-up at at the gigafab size means scaling-out instead, chip makers need to be able to quickly get new and updated manufacturing processes ported to other facilities in order to hit their necessary throughput – and to avoid a multi-quarter bottlenecks that come from having to freshly-tune a fab.

Intel, for their part, has a well-known Copy Exactly program, which is one of the company's major competitive advantages, allowing it to share process recipes across its fabs around the world to maximize yields and reduce performance variability. Meanwhile, as Taiwan Semiconductor Manufacturing Co. is building additional capacity in different parts of the world, it has reached the point where it needs a similar program in order to quickly maximize its yields and productivity at its new fabs in Japan and the U.S. And in some respects, TSMC's program goes even further than Intel's, with an additional focus on sustainability and social responsibility.

"As mentioned at last year's symposium, [Global Gigafab manufacturing] is a powerful global manufacturing and management platform," said Y.L. Wang, Vice President of Fab Operations TSMC. "We realise one fab management to ensure our Gigafab to achieve consistent operation efficiency as well as production quality on a global scale. Moreover, we also pursue sustainability across our global footprint covering green manufacturing, global talent development, supply chain localization, as well as social responsibility."

TSMC's Global GigaFab Manufacturing Data by TSMC (Compiled by AnandTech)
Manufacturing Excellence	Sustainability
Global One Fab Manufacturing	Green Manufacturing
ML-based Process Control	Global Talent Development
Manufacturing Agility and Quality	Supply Chain Localization
Maximum Productivity	Social Responsibility

When it comes to improvements of process technology, there are two main mechanisms: the continuous process improvements (CPI) to improve yields, as well as statistical process control (SPC) reduce performance variations. To do so, the company has multiple internal techniques that rely on machine learning-based process control, constant quality measuring, and various productivity improving methods. With Global Gigafab manufacturing TSMC can use CPI and SPC to improve yields and performance on the global scale by sharing knowledge between different sites.

"When we port a technology from Taiwan to Arizona, the fab set up, the process control system, everything is actually a copy from Taiwan," said Kevin Zhang, Senior Vice President, Business Development and Overseas Operations Office, and Deputy Co-COO at TSMC.

TSMC yet has to start making chips at its fabs in Germany, Japan, and the United States, so it remains to be seen how fast the foundry will increase yields to Taiwanese levels at its Fab 23 (in Kumamoto, Japan) and Fab 21 (in Arizona) when they begin operations in 2024 and 2025, but with Global Gigafab Manufacturing program in place, this is likely set to happen rather sooner than later.

Semiconductors

Intel Core i9-14900KS Review: The Swan Song of Raptor Lake With A Super Fast 6.2 GHz Turbo

For numerous generations of their desktop processor releases, Intel has made available a selection of high-performance special edition "KS" CPUs that add a little extra compared to their flagship chip. With a lot of interest, primarily from the enthusiasts looking for the fastest processors, Intel's latest Core i9-14900KS represents a super-fast addition to its 14th Generation Core lineup with out-of-the-box turbo clock speeds of up to 6.2 GHz and represents the last processor to end an era as Intel is removing the 'i' from its legendary nomenclature for future desktop chip releases.

Reaching speeds of up to 6.2 GHz, this sets up the Core i9-14900KS as the fastest desktop CPU in the world right now, at least in terms of frequencies out of the box. Building on their 'regular' flagship chip, the Core i9-14900, the Core i9-14900KS is also using their refreshed Raptor Lake (RPL-R) 8P+16E core chip design with a 200 MHz higher boost clock speed and also has a 100 MHz bump on P-Core base frequency. 

This new KS series SKU shows Intel's drive to offer an even faster alternative to their desktop regular K series offerings, and with the Core i9-14900KS, they look to provide the best silicon from their Raptor Lake Refresh series with more performance available to unlock to those who can. The caveat is that achieving these ridiculously fast clock speeds of 6.2 GHz on the P-Core comes at the cost of power and heat; keeping a processor pulling upwards of 350 W is a challenge in its own right, and users need to factor this in if even contemplating a KS series SKU.

In our previous KS series review, the Core i9-13900KS reached 360 W at its peak, considerably more than the Core i9-13900K. The Core i9-14900KS, built on the same core architecture, is expected to surpass that even further than the Core i9-14900K. We aim to compare Intel's final Core i series processor to the best of what both Intel and AMD have available, and it will be interesting to see how much performance can be extrapolated from the KS compared to the regular K series SKU.

CPUs

ASUS NUC14RVHv7 and ASRock Industrial NUC BOX-155H Review: Meteor Lake Brings Accelerated AI to UCFF PCs

Intel's Meteor Lake series of processors has had a drawn-out launch since its details were officially presented in September 2023. The series marks Intel's foray into the consumer market with a tile-based chiplet configuration held together with Foveros packaging. Similar to Tiger Lake, the focus of Meteor Lake has primarily been on the mobile market - ultraportables and notebooks. However, this has not prevented Intel and its partners from introducing it as a follow-up to Raptor Lake-P and Raptor Lake-H in the SFF / UCFF desktop market.

ASRock Industrial has consistently been the first to market with ultra-compact form-factor motherboards and mini-PCs, with product announcements coinciding with Intel's launch of its latest and greatest mobile processors. Meteor Lake has not been any different, with the NUC(S) Ultra 100 BOX series launching towards the end of Q4 2023. In the meanwhile, Intel's NUC business unit was purchased by ASUS and had its first major product announcement in the form of the Meteor Lake-based Revel Canyon NUCs at the 2024 CES.

The flagship NUC Ultra 100 BOX system is the NUC BOX-155H based on the Intel Core Ultra 7 155H. The Revel Canyon NUC lineup includes a model based on the Core Ultra 7 165H with vPro capabilities, with its claim to fame being the ability to hit 5 GHz on the performance cores. Read on for a detailed look at the features and performance profile of the ASRock Industrial NUC BOX-155H and the ASUS NUC14RVHv7. The analysis also helps in establishing the potential and benefits of Meteor Lake for the UCFF desktop market over its predecessors and the competition.

Systems

TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026

Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC's chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely meeting the current demand for this packaging method – never mind future demand – which is why last year the company announced plans to more than double CoWoS capacity by the end of 2024. But as it turns out, just doubling capacity once won't be enough, and the world's largest contract maker of chips is going to have to keep scaling up at a rapid pace.

At its European Technology Symposium last week TSMC announced plans to expand CoWoS capacity at a compound annual growth rate (CAGR) of over 60% till at least 2026. As a result, TSMC's CoWoS capacity will more than quadruple from 2023 levels by the end of that period. And keeping in mind that TSMC is prepping additional versions of CoWoS (namely CoWoS-L) that will enable building system-in-packages (SiPs) of up to eight reticle sizes, increasing CoWoS capacity by four-fold in three years may still not be enough. The good news is that the various third-party off-site assembly and testing (OSAT) providers are also expanding their CoWoS-like capacity, so the demand for advanced packing isn't a problem that TSMC is facing (or resolving) on their own.

And CoWoS isn't the only advanced packaging technology line whose capacity TSMC is looking to rapidly expand. The company also has its system-on-integrated chips (SoIC) 3D stacking technology which adoption is poised to grow in the coming years. To meet demand for its SoIC packaging methods TSMC will expand SoIC capacity at a 100% compound annual growth rate by the end of 2026. As a result, SoIC capacity will grow by eight-fold from 2023 levels by late 2026.

Overall, TSMC itself expects leading-edge SiPs for demanding applications like AI and HPC will adopt both CoWoS and SoIC 3D stacking technologies in the coming years, which is why it needs to increase capacity for both methods to be able to build those highly-complex processors.

Semiconductors

TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025

In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, TSMC also shared progress of its N2 node as part of its Symposiums 2024. The company's first 2nm-class fabrication node, and predominantly featuring gate-all-around transistors, according to TSMC N2 has almost achieved its target performance and yield goals, which places it on track to enter high-volume manufacturing in the second half of 2025.

TSMC states that 'N2 development is well on track and N2P is next.' In particular, gate-all-around nanosheet devices currently achieve over 90% of their expected performance, whereas yields of 256 Mb SRAM (32 MB) devices already exceeds 80%, depending on the batch. All of this for a node that is over a year away from mass production.

Meanwhile, average yield of a 256 Mb SRAM was around 70% as of March, 2024, up from around 35% in April, 2023. Device performance has also been improving with higher frequencies being achieved while keeping power consumption in check.

Chip designer interest towards TSMC's first 2nm-class gate-all-around nanosheet transistor-based technology is significant, too. The number of new tape-outs (NTOs) in the first year of N2 is over two-times higher than it was for N5. Though with that said, given TSMC's close working relationship with a handful of high-volume vendors – most notably Appe – NTOs can be a very misleading figure since the first year of a new node at TSMC is capacity constrained, and consequently the bulk of that capacity goes to TSMC's priority partners.

Meanwhile, there were considerably more N5 tapeouts in its second year (some where N5P, of course) and N2 promises to have 2.6X more NTOs in its second year. So the node indeed looks quite promising. In fact, based on TSMC's slides (which we're unfortunately not able to republish), N2 is more popular than N3 in terms of NTOs both in the first and the second years of existence.

When it comes to the second year of N2, in the second half of 2026 TSMC plans to roll out its N2P technology, which promises additional performance and power benefits. N2P is expected to improve frequency by 15% - 20%, reduce power consumption by 30% - 40%, and increase chip density by over 1.15 times compared to N3E, significant benefits to move to all-new GAA nanosheet transistors.

Finally, for those companies that need the best in performance, power, and density, TSMC is poised to offer their A16 process in 2026. That node will also bring in backside power delivery, which will add costs, but is expected to greatly improve performance efficiency and scaling.

Semiconductors

Upcoming AMD Ryzen AI 9 HX 170 Processor Leaked By ASUS?

In what appears to be a mistake or a jump of the gun by ASUS, they have seemingly published a list of specifications for one of its key notebooks that all but allude to the next generation of AMD's mobile processors. While we saw AMD toy with a new nomenclature for their Phoenix silicon (Ryzen 7040 series), it seems as though AMD is once again changing things around where their naming scheme for processors is concerned.

The ASUS listing, which has now since been deleted, but as of writing is still available through Google's cache, highlights a model that is already in existence, the VivoBook S 16 OLED (M5606), but is listed with an unknown AMD Ryzen AI 9 HX 170 processor. Which, based on its specificiations, is certainly not part of the current Hawk Point (Phoenix/Phoenix 2) platform.

The cache on Google shows the ASUS Vivobook S 16 OLED with a Ryzen AI 9 HX 170 Processor

While it does happen in this industry occasionally, what looks like an accidental leak by ASUS on one of their product pages has unearthed an unknown processor from AMD. This first came to our attention via a post on Twitter by user @harukaze5719. While we don't speculate on rumors, we confirmed this ourselves by digging through Google's cache. Sure enough, as the image above from Google highlights, it lists a newly unannounced model of Ryzen mobile processor. Under the listing via the product compare section for the ASUS Vivobook S 16 OLED (M5606) notebook, it is listed with the AMD Ryzen AI 9 HX 170, which appears to be one of AMD's upcoming Zen 5-based mobile chips codenamed Strix Point.

So with the seemingly new nomenclature that AMD has gone with, it has a clear focus on AI, or rather Ryzen AI, by including it in the name. The Ryzen AI 9 HX 170 looks set to be a 12C/24T Zen 5 mobile variant, with their Ryzen AI NPU or similar integrated within the chip. Given that Microsoft has defined that only processors with an NPU with 45 TOPS of performance or over constitute being considered an 'AI PC', it's likely the Xilinx (now AMD Xilinx) based NPU will meet these requirements as the listing states the chip has up to 77 TOPS of AI performance available. The HX series is strikingly similar to AMD's (and Intel's) previous HX naming series for their desktop replacement SKUs for laptops, so assuming any of the details of ASUS's error are correct, then this is presumably a very high-end, high-TDP part.

AMD Laptop Roadmap from Zen 2 in 2019 to Zen 5 on track for release in 2024

We've known for some time that AMD plans to release AMD's Zen 5-based Strix Point line-up sometime in 2024. Given the timing of Computex 2024, which is just over four weeks away, we still don't quite have the full picture of Zen 5's performance and its architectural shift over Zen 4. AMD CEO Dr. Lisa Su also confirmed that Zen 5 will come with enhanced RDNA graphics within the Strix Point SoC by stating "Strix combines our next-gen Zen 5 core with enhanced RDNA graphics and an updated Ryzen AI engine to significantly increase the performance, energy efficiency, and AI capabilities of PCs,"

While it's entirely possible as we lead up to Computex 2024 that AMD is prepared to announce more details about Zen 5, nothing is confirmed. We do know that the CEO of AMD, Dr. Lisa Su is scheduled to deliver the opening keynote of the show, Dr. Lisa Su unveiled their Zen 4 microarchitecture at Computex 2022 during AMD's keynote and even unveiled their 3D V-Cache stacking, which we know today as the Ryzen X3D CPUs back at Computex 2021.

With that in mind, AMD and Dr. Lisa Su love to announce new products and ... CPUs

Intel Issues Official Statement Regarding 14th and 13th Gen Instability, Recommends Intel Default Settings

Further to our last piece which we detailed Intel's issue to motherboard vendors to follow with stock power settings for Intel's 14th and 13th Gen Core series processors, Intel has now issued a follow-up statement to this. Over the last week or so, motherboard vendors quickly released firmware updates with a new profile called 'Intel Baseline', which motherboard vendors assumed would address the instability issues. 

As it turns out, Intel doesn't seem to accept this as technically, these Intel Baseline profiles are not to be confused with Intel's default specifications. This means that Intel's Baseline profiles seemingly give the impression that they are operating at default settings, hence the terminology 'baseline' used, but this still opens motherboard vendors to use their interpretations of MCE or Multi-Core Enhancement.

To clarify things for consumers, Intel has sent us the following statement:

Several motherboard manufacturers have released BIOS profiles labeled ‘Intel Baseline Profile’. However, these BIOS profiles are not the same as the 'Intel Default Settings' recommendations that Intel has recently shared with its partners regarding the instability issues reported on 13th and 14th gen K SKU processors.

These ‘Intel Baseline Profile’ BIOS settings appear to be based on power delivery guidance previously provided by Intel to manufacturers describing the various power delivery options for 13th and 14th Generation K SKU processors based on motherboard capabilities.

Intel is not recommending motherboard manufacturers to use ‘baseline’ power delivery settings on boards capable of higher values.

Intel’s recommended ‘Intel Default Settings’ are a combination of thermal and power delivery features along with a selection of possible power delivery profiles based on motherboard capabilities.

Intel recommends customers to implement the highest power delivery profile compatible with each individual motherboard design as noted in the table below:

Click to Enlarge Intel's Default Settings

What Intel's statement is effectively saying to consumers, is that users shouldn't be using the Baseline Power Delivery profiles which are offered by motherboard vendors through a plethora of firmware updates. Instead, Intel is recommending users opt for Intel Default Settings, which follows what the specific processor is rated for by Intel out of the box to achieve the clock speeds advertised, without users having to worry about firmware 'over' optimization which can cause instability as there have been many reports of happening.

Not only this, but the Intel Default settings offer a combination of thermal specifications and power capabilities, including voltage and frequency curve settings that apply to the capability of the motherboard used, and the power delivery equipped on the motherboard. At least for the most part, Intel is recommending users with 14th and 13th-Gen Core series K, KF, and KS SKUs that they do not recommend users opt in using the Baseline profiles offered by motherboard vendors.

Digesting the contrast between the two statements, the key differential is that Intel's priority is reducing the current going through the processor, which for both the 14th and 13th Gen Core series processors is a maximum of 400 A, even when using the Extreme profile. We know those motherboard vendors on their Z790 and Z690 motherboards opt for an unrestricted power profile, which is essentially 'unlimited' power and current to maximize performance at the cost of power consumption and heat, which does exacerbate problems and can lead to frequent bouts of instability, especially on high-intensity workloads.

Another variable Intel is recommending is that the AC Load Line must match the design target of the processor, with a maximum value of 1.1 mOhm, and that the DC Load Line must be ... CPUs

Arm Unveils 2024 CPU Core Designs, Cortex X925, A725 and A520: Arm v9.2 Redefined For 3nm

As the semiconductor industry continues to evolve, Arm stands at the forefront of innovation for its core and IP architecture, especially in the mobile space, by pushing the boundaries of technology to deliver cutting-edge solutions for end users. For 2024, Arm's year-on-year strategic advancements focus on enhancing last year's Armv9.2 architecture with a new twist. Arm has rebranded and re-strategized its efforts by introducing Arm Compute Subsystem (CSS), the direct successor to last year's Total Compute Solutions (TSC2023) platform.

Arm is also transitioning its latest IP and Cortex core designs, including the largest Cortex X925, the middle Cortex A725, and the refreshed and smaller Cortex A520 to the more advanced 3 nm process technology. Arm promises that the 3 nm process node will deliver unprecedented performance gains compared to last year's designs, power efficiency and scalability improvements, and new front and back-end refinements to its Cortex series of cores. Arms' new solutions look to power the next-generation mobile and AI applications as Arm, along with its complete AArch64 64-bit instruction execution and approach to solutions geared towards mobile and notebooks, look set to redefine end users' expectations within the Android and Windows on Arm products.

CPUs

Micron Ships Crucial-Branded LPCAMM2 Memory Modules: 64GB of LPDDR5X For $330

As LPCAMM2 adoption begins, the first retail memory modules are finally starting to hit the retail market, courtesy of Micron. The memory manufacturer has begun selling their LPDDR5X-based LPCAMM2 memory modules under their in-house Crucial brand, making them available on the latter's storefront. Timed to coincide with the release of Lenovo's ThinkPad P1 Gen 7 laptop – the first retail laptop designed to use the memory modules – this marks the de facto start of the eagerly-awaited modular LPDDR5X memory era.

Micron's Low Power Compression Attached Memory Module 2 (LPCAMM2) modules are available in capacities of 32 GB and 64 GB. These are dual-channel modules that feature a 128-bit wide interface, and are based around LPDDR5X memory running at data rates up to 7500 MT/s. This gives a single LPCAMM2 a peak bandwidth of 120 GB/s. Micron is not disclosing the latencies of its LPCAMM2 memory modules, but it says that high data transfer rates of LPDDR5X compensate for the extended timings.

Micron says that LPDDR5X memory offers significantly lower power consumption, with active power per 64-bit bus being 43-58% lower than DDR5 at the same speed, and standby power up to 80% lower. Meanwhile, similar to DDR5 modules, LPCAMM2 modules include a power management IC and voltage regulating circuitry, which provides module manufacturers additional opportunities to reduce power consumption of their products.

Source: Micron LPDDR5X LPCAMM2 Technical Brief

It's worth noting, however, that at least for the first generation of LPCAMM2 modules, system vendors will need to pick between modularity and performance. While soldered-down LPDDR5X memory is available at speeds up to 8533 MT/sec – and with 9600 MT/sec on the horizon – the fastest LPCAMM2 modules planned for this year by both Micron and rival Samsung will be running at 7500 MT/sec. So vendors will have to choose between the flexibility of offering modular LPDDR5X, or the higher bandwidth (and space savings) offered by soldering down their memory.

Micron, for its part, is projecting that 9600 MT/sec LPCAMM2 modules will be available by 2026. Though it's all but certain that faster memory will also be avaialble in the same timeframe.

Micron's Crucial LPDDR5X 32 GB module costs $174.99, whereas a 64 GB module costs $329.99.

Memory

TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node

With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity for specialty technologies by 50% by 2027. As disclosed by the company during its European Technology Symposium this week, TSMC expects to need to not only convert existing capacity to meet demands for specialty processes, but even build new (greenfield) fab space just for this purpose. One of the big drivers for this demand, in turn, will be TSMC's next specialty node: N4e, a 4nm-class ultra-low-power production node.

"In the past, we always did the review phase [for upcoming fabs], but for the first time in a long time at TSMC, we started building greenfield fab that will address the future specialty technology requirements," said Dr. Kevin Zhang, Senior Vice President, Business Development and Overseas Operations Office, at the event. "In the next four to five years, we actually going to grow our specialty capacity by up to 1.5x. In doing so we actually expanding the footprint of our manufacturing network to improve the resiliency of the overall fab supply chain."

On top of its well-known major logic nodes like N5 and N3E, TSMC also offers a suite of specialty nodes for applications such as power semiconductors, mixed analog I/O, and ultra-low-power applications (e.g. IoT). These are typically based on the company's trailing manufacturing processes, but regardless of the underlying technology, the capacity demand for these nodes is growing right alongside the demand for TSMC's major logic nodes. All of which has required TSMC to reevaluate how they go about planning for capacity on their specialty nodes.

TSMC's expansion strategy in the recent years has pursued several goals. One of them has been to build new fabs outside of Taiwan; another has been to generally expand production capacity to meet future demand for all types of process technologies – which is why the company is building up capacity for specialty nodes.

At present, TSMC's most advanced specialty node is N6e, an N7/N6 variant that supports operating voltages between 0.4V and 0.9V. With N4e, TSMC is looking at voltages below 0.4V. Though for now, TSMC is not disclosing much in the way of technical details for the planned node; given the company's history here, we expect they'll have more to talk about next year once the new process is ready.

Semiconductors

Intel Issues Official Statement Regarding 14th and 13th Gen Instability, Recommends Intel Default Settings

Further to our last piece which we detailed Intel's issue to motherboard vendors to follow with stock power settings for Intel's 14th and 13th Gen Core series processors, Intel has now issued a follow-up statement to this. Over the last week or so, motherboard vendors quickly released firmware updates with a new profile called 'Intel Baseline', which motherboard vendors assumed would address the instability issues. 

As it turns out, Intel doesn't seem to accept this as technically, these Intel Baseline profiles are not to be confused with Intel's default specifications. This means that Intel's Baseline profiles seemingly give the impression that they are operating at default settings, hence the terminology 'baseline' used, but this still opens motherboard vendors to use their interpretations of MCE or Multi-Core Enhancement.

To clarify things for consumers, Intel has sent us the following statement:

Several motherboard manufacturers have released BIOS profiles labeled ‘Intel Baseline Profile’. However, these BIOS profiles are not the same as the 'Intel Default Settings' recommendations that Intel has recently shared with its partners regarding the instability issues reported on 13th and 14th gen K SKU processors.

These ‘Intel Baseline Profile’ BIOS settings appear to be based on power delivery guidance previously provided by Intel to manufacturers describing the various power delivery options for 13th and 14th Generation K SKU processors based on motherboard capabilities.

Intel is not recommending motherboard manufacturers to use ‘baseline’ power delivery settings on boards capable of higher values.

Intel’s recommended ‘Intel Default Settings’ are a combination of thermal and power delivery features along with a selection of possible power delivery profiles based on motherboard capabilities.

Intel recommends customers to implement the highest power delivery profile compatible with each individual motherboard design as noted in the table below:

Click to Enlarge Intel's Default Settings

What Intel's statement is effectively saying to consumers, is that users shouldn't be using the Baseline Power Delivery profiles which are offered by motherboard vendors through a plethora of firmware updates. Instead, Intel is recommending users opt for Intel Default Settings, which follows what the specific processor is rated for by Intel out of the box to achieve the clock speeds advertised, without users having to worry about firmware 'over' optimization which can cause instability as there have been many reports of happening.

Not only this, but the Intel Default settings offer a combination of thermal specifications and power capabilities, including voltage and frequency curve settings that apply to the capability of the motherboard used, and the power delivery equipped on the motherboard. At least for the most part, Intel is recommending users with 14th and 13th-Gen Core series K, KF, and KS SKUs that they do not recommend users opt in using the Baseline profiles offered by motherboard vendors.

Digesting the contrast between the two statements, the key differential is that Intel's priority is reducing the current going through the processor, which for both the 14th and 13th Gen Core series processors is a maximum of 400 A, even when using the Extreme profile. We know those motherboard vendors on their Z790 and Z690 motherboards opt for an unrestricted power profile, which is essentially 'unlimited' power and current to maximize performance at the cost of power consumption and heat, which does exacerbate problems and can lead to frequent bouts of instability, especially on high-intensity workloads.

Another variable Intel is recommending is that the AC Load Line must match the design target of the processor, with a maximum value of 1.1 mOhm, and that the DC Load Line must be ... CPUs

SK hynix Reports That 2025 HBM Memory Supply Has Nearly Sold Out

Demand for high-performance processors for AI training is skyrocketing, and consequently so is the demand for the components that go into these processors. So much so that SK hynix this week is very publicly announcing that the company's high-bandwidth memory (HBM) production capacity has already sold out for the rest of 2024, and even most of 2025 has already sold out as well.

SK hynix currently produces various types of HBM memory for customers like Amazon, AMD, Facebook, Google (Broadcom), Intel, Microsoft, and, of course, NVIDIA. The latter is an especially prolific consumer of HBM3 and HBM3E memory for its H100/H200/GH200 accelerators, as NVIDIA is also working to fill what remains an insatiable (and unmet) demand for its accelerators.

As a result, HBM memory orders, which are already placed months in advance, are now backlogging well into 2025 as chip vendors look to secure supplies of the memory stacks critical to their success.

This has made SK hynix the secnd HBM memory vendor in recent months to announce that they've sold out into 2025, following an earlier announcement from Micron regarding its HBM3E production. But of the two announcements, SK hynix's is arguably the most significant yet, as the South Korean firm's HBM production capacity is far greater than Micron's. So while things were merely "interesting" with the smallest of the Big Three memory manufacturers being sold out into 2025, things are taking a more concerning (and constrained) outlook now that SK hynix is as well.

SK hynix currently controls roughly 46% - 49% of HBM market, and its share is not expected to drop significantly in 2025, according to market tracking firm TrendForce. By contrast, Micron's share on HBM memory market is between 4% and 6%. Since HBM supply of both companies is sold out through the most of 2025, we're likely looking at a scenario where over 50% of the industry's total HBM3/HBM3E supply for the coming quarters is already sold out.

This leaves Samsung as the only member of the group not to comment on HBM demand so far. Though with memory being a highly fungible commodity product, it would be surprising if Samsung wasn't facing similar demand. And, ultimately, all of this is pointing towards the indusry entering an HBM3 memory shortage.

Separately, SK hynix said that it is sampling 12-Hi 36GB HBM3E stacks with customers and will begin volume shipments in the third quarter.

Memory

Samsung Tapes Out Its First 3nm Smartphone SoC, Gets A Boost From Synopsys AI-Enabled Tools

This week Samsung Electronics and Synopsys announced that Samsung has taped out its first mobile system-on-chip on Samsung Foundry's 3nm gate-all-around (GAA) process technology. The announcement, coming from electronic design automation Synopsys, further notes that Samsung used the Synopsys.ai EDA suite to place-n-route the layout and verify design of the SoC, which in turn enabled higher performance.

Samsung's unnamed high-performance mobile SoC relies on 'flagship' general-purpose CPU and GPU architectures as well as various IP blocks from Synopsys. SoC designers used Synopsys.ai EDA software, including the Synopsys DSO.ai to fine-tune design and maximize yields as well as Synopsys Fusion Compiler RTL-to-GDSII solution to achieve higher performance, lower power, and optimize area (PPA).

And while the news that Samsung has developed a high-performance SoC using the Synopsys.ai suite is important, there is another, even more important dimension to this announcement: this means that Samsung has finally taped out an advanced smartphone application processor on its cutting-edge 3nm GAAFET process.

Although Samsung Foundry has been producing chips on its GAA-equipped SF3E (3 nm-class, 'early' node) process for almost two years now, Samsung Electronics has never used this technology for its own system-on-chips for smartphones or other complex devices. To date, SF3E has been used mainly for cryptocurrency mining chips, presumably due to the inevitable early teething and yield issues that come with being the industry's first commercial GAAFET process.

For now, Samsung isn't disclosing what specific process node is being used for the SoC; the official Samsung/Synposys announcement only notes that it's for a GAA process node. Along with their first-generation 3nm-class SF3E, Samsung Foundry has a considerably more sophisticated SF3 manufacturing technology that offers numerous improvements over SF3E, and is due to be used for mass production in the coming quarters. Given the timing of the announcement, the reasonable bet is that they're using SF3.

As for Samsung's tooling partnership with Synopsys, the latter's tools are being credited for delivering some significant performance improvements to the chip's design. In particular, the two firms are crediting those tools for improving the chip's peak clockspeed by 300MHz while cutting down on dynamic power usage by 10%. To accomplish that, Samsung Electronics' SoC developers used design partitioning optimization, multi-source clock tree synthesis (MSCTS), and smart wire optimization to reduce signal interference, along with a simpler hierarchical approach. And by using Synopsys Fusion Compiler, they did all this while being able to skip weeks of 'manual' design work, according to the joint press release.

"Our longstanding collaboration has delivered leading-edge SoC designs," said Kijoon Hong, vice president of SLSI at Samsung Electronics. "This is a remarkable milestone to successfully achieve the highest performance, power and area on the most advanced mobile CPU cores and SoC designs in collaboration with Synopsys. Not only have we demonstrated that AI-driven solutions can help us achieve PPA targets for even the most advanced GAA process technologies, but through our partnership we have established an ultra-high-productivity design system that is consistently delivering impressive results."

Semiconductors

Intel Teases Lunar Lake CPU Ahead of Computex: Most Power Efficient x86 Chip Yet

The next few weeks in the PC industry are going to come fast and furious. Between today and mid-June are multiple conferences and trade-shows, including Microsoft Build and the king of PC trade shows: Computex Taiwan. With all three PC CPU vendors set to present, there’s a lot going on, and a lot of product announcements to be had. But even before those trade shows start, Intel is looking to make the first move this afternoon with an early preview on its next-gen mobile processor, Lunar Lake.

While Intel hasn’t said too much about what to expect from their Computex 2024 keynote thus far, it’s clear that Intel’s next-gen CPUs – Lunar Lake for mobile, and Arrow Lake for Mobile/Desktop – are going to be two of the major stars of the show. At this point Intel has previously teased and/or demoed both chips (Lunar more so than Arrow), and this afternoon the company is releasing a bit more information on Lunar Lake even before Computex kicks off.

Officially, today’s reveal is a preview of Intel’s next Tech Tour event, which is taking place at the end of May. Unofficially, this is the exact same date and time as the embargo on Qualcomm Snapdragon X laptop announcements, which are slated to hit retail shelves next month. Lunar Lake laptops, by contrast, will not hit retail shelves until Q4 of this year. So although the additional technical details from today’s disclosure are great to have, looking at the bigger picture it’s difficult to interpret this reveal as anything less than a bald-faced effort to interdict the Snapdragon X launch (not that Qualcomm hasn’t also been crowing about SDX for the last 7 months). Which, if nothing else, goes to show the current tumultuous state of the laptop CPU market, and that Intel isn’t nearly as secure in their position as they have traditionally been.

CPUs

TSMC's Roadmap at a Glance: N3X, N2P, A16 Coming in 2025/2026

As announced last week by TSMC, later this year the company is set to start high-volume manufacturing on its N3P fabrication process, and this will be the company's most advanced node for a while. Next year things will get a bit more interesting as TSMC will have two process technologies that could actually compete against each other when they enter high-volume manufacturing (HVM) in the second half of 2025.

Advertised PPA Improvements of New Process Technologies Data announced during conference calls, events, press briefings and press releases
Compiled by AnandTech	TSMC
	N3 vs N5	N3E vs N5	N3P vs N3E	N3X vs N3P	N2 vs N3E	N2P vs N3E	N2P vs N2	A16 vs N2P
Power	-25% -30%	-34%	-5% -10%	-7%***	-25% -30%	-30% -40%	-5% -10%	-15% -20%
Performance	+10% +15%	+18%	+5%	+5% Fmax @1.2V**	+10% +15%	+15% +20%	+5 +10%	+8% +10%
Density*	?	1.3x	1.04x	1.10x***	1.15x	1.15x	?	1.07x 1.10x
HVM	Q4 2022	Q4 2023	H2 2024	H2 2025	H2 2025	H2 2026	H2 2026	H2 2026

*Chip density published by TSMC reflects 'mixed' chip density consisting of 50% logic, 30% SRAM, and 20% analog.
**At the same area. 
***At the same speed.

The production nodes are N3X (3nm-class, extreme performance-focused) as well as N2 (2nm-class). TSMC says that when compared to N3P, chips made on N3X can either lower power consumption by 7% at the same frequency by lowering Vdd from 1.0V to 0.9V, increase performance by 5% at the same area, or increase transistor density by around 10% at the same frequency. Meanwhile, the key advantage of N3X compared to predecessors is its maximum voltage of 1.2V, which is important for ultra-high-performance applications, such as desktop or datacenter GPUs.

TSMC's N2 will be TSMC's first production node to use gate-all-around (GAA) nanosheet transistors and this will significantly enhance its performance, power, and are... Semiconductors

MSI Teases Z790 Project Zero Plus Motherboard With CAMM2 Memory Support

MSI on Thursday published the first image of a new desktop motherboard that supports the innovative DDR5 compression attached memory module (CAMM2). DDR5 CAMM2 modules are designed to improve upon the SO-DIMM form factor used for laptops, alleviating some of the high-speed signaling and capacity limitations of SO-DIMMs while also shaving down on the volume of space required. And while we're eagerly awaiting to see CAMM2 show up in more laptops, its introduction in a PC motherboard comes as a bit of a surprise, since PCs aren't nearly as space-constrained.

MSI's Z790 Project Zero Plus motherboard, which supports Intel's latest 14^th Generation Core processors, is to a large degree a proof-of-concept product that is showcasing several new technologies and atypical configuration options. Key among these, of course, is the CAMM2 connector. The single connector supports a 128-bit DDR5 memory bus, allowing for a system to be fully populated with RAM with just a single, horizontally-mounted CAMM2 module. And in terms of design, the Zero Plus also features backside power connectors for improved cable management.

CAMM2 is designed to replace traditional modules in an SO-DIMM form-factor and is meant to occupy up to 64% less space than two DDR5 SO-DIMMs. In addition, CAMM2 greatly optimizes signal and power traces inside the motherboard, primarily by ensuring all memory trace lengths are identical, reducing some of the signaling penalties that normally come from supporting multiple SO-DIMM slots in a system. With DDR5 being particularly sensitive here – to the point where 2 DIMM Per Channel (2DPC) configurations take a max frequency hit even on desktop systems – CAMM2 modules are expected to simplify and, to a degree, improve laptop designs to better match DDR5's limitations.

Though whether CAMM2 sees widespread adoption remains to be seen. Unlike it's LPDDR5X counterpart, LPCAMM2, DDR5 CAMM2 hasn't attracted the same interest from laptop vendors quite yet, in large part because it doesn't introduce any new functionality (e.g. socketed LPDDR5X).

Meanwhile CAMM2 in ATX desktops is all but unexplored right now, which is why we're seeing experimental products like MSI's motherboard. The space savings alone aren't as important in desktops due to their size – though CAMM2 does cut down on Z-height, keeping memory away from CPU coolers. But PC makers will be looking at other factors such as inventory, as equipping desktop boards with CAMM2 connectors would allow them to use the same memory modules in both laptops and desktops. And longer term there is the question of whether CAMM2 can deliver tangible signaling benefits over traditional DIMMs.

MSI plans to showcase its Z790 Project Zero Plus platform at Computex, alongside memory partner Kingston. The latter will be at the show to demonstrate its Fury Impact CAMM2 memory module, which is one of the first DDR5 CAMM2 modules to be announced.

Motherboards

The Arctic Cooling Freezer 36 ARGB CPU Cooler Review: Budget Cooling Done Well

As modern high-performance CPUs generate more heat, there's been a noticeable increase in the demand for powerful air coolers capable of managing these thermal challenges. Traditional stock air coolers, while sufficient for regular use, are typically designed to be cheap and relatively compact, leaving further improvements to noise control and peak cooling efficiency on the table. This gap has long prompted advanced users and system builders to opt for high-quality aftermarket coolers that designed to better handle the heat output from top-tier processors.

Known for their innovative approach to PC hardware, Arctic Cooling has stepped into this competitive market with a product aimed at delivering effective cooling at a very low retail price. The Freezer 36 A-RGB, a dual fan tower cooler, is designed to support the cooling demands of the latest CPUs while also offering customizable RGB lighting for visual flair. This review will explore the features, performance, and value of the Arctic Cooling Freezer 36 A-RGB, comparing it with other leading products in the market to see how it stacks up in providing efficient and effective cooling for modern CPUs.

Cases/Cooling/PSUs

TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node

With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity for specialty technologies by 50% by 2027. As disclosed by the company during its European Technology Symposium this week, TSMC expects to need to not only convert existing capacity to meet demands for specialty processes, but even build new (greenfield) fab space just for this purpose. One of the big drivers for this demand, in turn, will be TSMC's next specialty node: N4e, a 4nm-class ultra-low-power production node.

"In the past, we always did the review phase [for upcoming fabs], but for the first time in a long time at TSMC, we started building greenfield fab that will address the future specialty technology requirements," said Dr. Kevin Zhang, Senior Vice President, Business Development and Overseas Operations Office, at the event. "In the next four to five years, we actually going to grow our specialty capacity by up to 1.5x. In doing so we actually expanding the footprint of our manufacturing network to improve the resiliency of the overall fab supply chain."

On top of its well-known major logic nodes like N5 and N3E, TSMC also offers a suite of specialty nodes for applications such as power semiconductors, mixed analog I/O, and ultra-low-power applications (e.g. IoT). These are typically based on the company's trailing manufacturing processes, but regardless of the underlying technology, the capacity demand for these nodes is growing right alongside the demand for TSMC's major logic nodes. All of which has required TSMC to reevaluate how they go about planning for capacity on their specialty nodes.

TSMC's expansion strategy in the recent years has pursued several goals. One of them has been to build new fabs outside of Taiwan; another has been to generally expand production capacity to meet future demand for all types of process technologies – which is why the company is building up capacity for specialty nodes.

At present, TSMC's most advanced specialty node is N6e, an N7/N6 variant that supports operating voltages between 0.4V and 0.9V. With N4e, TSMC is looking at voltages below 0.4V. Though for now, TSMC is not disclosing much in the way of technical details for the planned node; given the company's history here, we expect they'll have more to talk about next year once the new process is ready.

Semiconductors

MSI Teases Z790 Project Zero Plus Motherboard With CAMM2 Memory Support

MSI on Thursday published the first image of a new desktop motherboard that supports the innovative DDR5 compression attached memory module (CAMM2). DDR5 CAMM2 modules are designed to improve upon the SO-DIMM form factor used for laptops, alleviating some of the high-speed signaling and capacity limitations of SO-DIMMs while also shaving down on the volume of space required. And while we're eagerly awaiting to see CAMM2 show up in more laptops, its introduction in a PC motherboard comes as a bit of a surprise, since PCs aren't nearly as space-constrained.

MSI's Z790 Project Zero Plus motherboard, which supports Intel's latest 14^th Generation Core processors, is to a large degree a proof-of-concept product that is showcasing several new technologies and atypical configuration options. Key among these, of course, is the CAMM2 connector. The single connector supports a 128-bit DDR5 memory bus, allowing for a system to be fully populated with RAM with just a single, horizontally-mounted CAMM2 module. And in terms of design, the Zero Plus also features backside power connectors for improved cable management.

CAMM2 is designed to replace traditional modules in an SO-DIMM form-factor and is meant to occupy up to 64% less space than two DDR5 SO-DIMMs. In addition, CAMM2 greatly optimizes signal and power traces inside the motherboard, primarily by ensuring all memory trace lengths are identical, reducing some of the signaling penalties that normally come from supporting multiple SO-DIMM slots in a system. With DDR5 being particularly sensitive here – to the point where 2 DIMM Per Channel (2DPC) configurations take a max frequency hit even on desktop systems – CAMM2 modules are expected to simplify and, to a degree, improve laptop designs to better match DDR5's limitations.

Though whether CAMM2 sees widespread adoption remains to be seen. Unlike it's LPDDR5X counterpart, LPCAMM2, DDR5 CAMM2 hasn't attracted the same interest from laptop vendors quite yet, in large part because it doesn't introduce any new functionality (e.g. socketed LPDDR5X).

Meanwhile CAMM2 in ATX desktops is all but unexplored right now, which is why we're seeing experimental products like MSI's motherboard. The space savings alone aren't as important in desktops due to their size – though CAMM2 does cut down on Z-height, keeping memory away from CPU coolers. But PC makers will be looking at other factors such as inventory, as equipping desktop boards with CAMM2 connectors would allow them to use the same memory modules in both laptops and desktops. And longer term there is the question of whether CAMM2 can deliver tangible signaling benefits over traditional DIMMs.

MSI plans to showcase its Z790 Project Zero Plus platform at Computex, alongside memory partner Kingston. The latter will be at the show to demonstrate its Fury Impact CAMM2 memory module, which is one of the first DDR5 CAMM2 modules to be announced.

Motherboards

The Arctic Cooling Freezer 36 ARGB CPU Cooler Review: Budget Cooling Done Well

As modern high-performance CPUs generate more heat, there's been a noticeable increase in the demand for powerful air coolers capable of managing these thermal challenges. Traditional stock air coolers, while sufficient for regular use, are typically designed to be cheap and relatively compact, leaving further improvements to noise control and peak cooling efficiency on the table. This gap has long prompted advanced users and system builders to opt for high-quality aftermarket coolers that designed to better handle the heat output from top-tier processors.

Known for their innovative approach to PC hardware, Arctic Cooling has stepped into this competitive market with a product aimed at delivering effective cooling at a very low retail price. The Freezer 36 A-RGB, a dual fan tower cooler, is designed to support the cooling demands of the latest CPUs while also offering customizable RGB lighting for visual flair. This review will explore the features, performance, and value of the Arctic Cooling Freezer 36 A-RGB, comparing it with other leading products in the market to see how it stacks up in providing efficient and effective cooling for modern CPUs.

Cases/Cooling/PSUs

Supermicro E102-13R-H Review: A Raptor Lake-P 3.5-inch SBC System for Embedded Applications

Single-board computers in the 3.5-inch form-factor have become extremely popular for embedded applications involving a mix of high performance requirements as well as extended peripherals support. Typical use-case scenarios include digital signage, edge inferencing solutions, retail applications, and IoT gateways. The requirements in these segments call for processors and components that can operate in a wide temperature range. The chassis and cooling solution handle other duties such as ruggedness and avoidance of moving parts. The Supermicro X13SRN-H-WOHS is a 3.5-inch SBC with a soldered-down Intel Core i7-1370PE - a Raptor Lake-P embedded processor with vPro support. It has plenty of I/O support, including a SlimSAS PCIe expansion slot. Supermicro also offers a ready-to-deploy solution using the SBC in the actively-cooled SYS-E102-13R-H box PC. This review takes a detailed look at the features and performance profile of the SYS-E102-13R-H, along with an evaluation of the thermal solution.

Systems

Intel Issues Official Statement Regarding 14th and 13th Gen Instability, Recommends Intel Default Settings

Further to our last piece which we detailed Intel's issue to motherboard vendors to follow with stock power settings for Intel's 14th and 13th Gen Core series processors, Intel has now issued a follow-up statement to this. Over the last week or so, motherboard vendors quickly released firmware updates with a new profile called 'Intel Baseline', which motherboard vendors assumed would address the instability issues. 

As it turns out, Intel doesn't seem to accept this as technically, these Intel Baseline profiles are not to be confused with Intel's default specifications. This means that Intel's Baseline profiles seemingly give the impression that they are operating at default settings, hence the terminology 'baseline' used, but this still opens motherboard vendors to use their interpretations of MCE or Multi-Core Enhancement.

To clarify things for consumers, Intel has sent us the following statement:

Several motherboard manufacturers have released BIOS profiles labeled ‘Intel Baseline Profile’. However, these BIOS profiles are not the same as the 'Intel Default Settings' recommendations that Intel has recently shared with its partners regarding the instability issues reported on 13th and 14th gen K SKU processors.

These ‘Intel Baseline Profile’ BIOS settings appear to be based on power delivery guidance previously provided by Intel to manufacturers describing the various power delivery options for 13th and 14th Generation K SKU processors based on motherboard capabilities.

Intel is not recommending motherboard manufacturers to use ‘baseline’ power delivery settings on boards capable of higher values.

Intel’s recommended ‘Intel Default Settings’ are a combination of thermal and power delivery features along with a selection of possible power delivery profiles based on motherboard capabilities.

Intel recommends customers to implement the highest power delivery profile compatible with each individual motherboard design as noted in the table below:

Click to Enlarge Intel's Default Settings

What Intel's statement is effectively saying to consumers, is that users shouldn't be using the Baseline Power Delivery profiles which are offered by motherboard vendors through a plethora of firmware updates. Instead, Intel is recommending users opt for Intel Default Settings, which follows what the specific processor is rated for by Intel out of the box to achieve the clock speeds advertised, without users having to worry about firmware 'over' optimization which can cause instability as there have been many reports of happening.

Not only this, but the Intel Default settings offer a combination of thermal specifications and power capabilities, including voltage and frequency curve settings that apply to the capability of the motherboard used, and the power delivery equipped on the motherboard. At least for the most part, Intel is recommending users with 14th and 13th-Gen Core series K, KF, and KS SKUs that they do not recommend users opt in using the Baseline profiles offered by motherboard vendors.

Digesting the contrast between the two statements, the key differential is that Intel's priority is reducing the current going through the processor, which for both the 14th and 13th Gen Core series processors is a maximum of 400 A, even when using the Extreme profile. We know those motherboard vendors on their Z790 and Z690 motherboards opt for an unrestricted power profile, which is essentially 'unlimited' power and current to maximize performance at the cost of power consumption and heat, which does exacerbate problems and can lead to frequent bouts of instability, especially on high-intensity workloads.

Another variable Intel is recommending is that the AC Load Line must match the design target of the processor, with a maximum value of 1.1 mOhm, and that the DC Load Line must be ... CPUs

Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab

To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and with Intel joining the contract chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that Rapidus, a foundry startup backed by the Japanese government and several major Japanese companies, is going to enter in 2027, when its first fab comes online, just a few years from now.

In a fresh update on the status of bringing up the company's first leading-edge fab, Rapidus has revealed that they are intending to get in to the chip packaging game as well. Once complete, the ¥5 trillion ($32 billion) fab will be offering both chip lithography on a 2nm node, as well as packaging services for chips produced within the facility – a notable distinction in an industry where, even if packaging isn't outsourced entirely (OSAT), it's still normally handled at dedicated facilities.

Ultimately, while the company wants to serve the same clients as TSMC, Samsung, and Intel Foundry, the firm plans to do things almost completely differently than its competitors in a bid to speed up chipmaking from finishing design to getting a working chip out of the fab.

"We are very proud of being Japanese," said Henri Richard, general manager and president of Rapidus's subsidiary in the U.S. "[…] I know that some people may be looking at this thinking [that] Japan is known for quality, attention to detail, but not necessarily for speed, or flexibility. But I will tell you that Atsuyoshi Koike (the head of Rapidus) is a very special executive. That is, he has all the quality of Japan, with a lot of American thinking. So he is quite a unique guy, and certainly extraordinarily focused on creating a company that will be extremely flexible and extremely quick on its feet."

2nm Only, At First

Perhaps the most significant difference between Rapidus and traditional foundries is that the company will offer only leading-edge manufacturing technologies to its clients: 2 nm in 2027 (phase 1) and then 1.4 nm in the future (phase 2). This is a stark contrast with other contract fabs, including Intel, which tend to offer their customers a full range of fabrication processes to land more clients and produce more chips. Apparently, Rapidus hopes that that there will be enough Japanese and American chip developers that are inclined to use its 2 nm fabrication process to produce their designs. With that said, the number of chip designers that are using the most advanced production node at any given time is relatively small – limited to large firms who need first-mover advantage and have the margins to justify taking the risk – so it remains to be seen whether Rapidus's business model becomes successful. The company believes it will, since the market of chips made on advanced nodes is growing rapidly.

"Until recently IDC was giving a an estimation of the 2nm and below market as about $80 billion and I think we are going to see soon a revision of the potential to $150 billion," said Richard. "[…] TSMC is the 800 pound gorilla in the space. Samsung is there and Intel is going to enter that space. But the market growth is so significant and the demand is so high, that it does not take a lot of market share for Rapidus to be successful. One of the things that gives me great comfort is that when I talk to our EDA partners, when I talk to our potential clients, it is obvious that the entire industry is looking for alternative supply from a fully independent foundry. There is a place for Samsung in this industry, there is a place for Intel in this industry, the industry is currently owned by TSMC. But another totally independent foundry is more than welcome by all of the ecosystem partners and by the customers. So, I feel really, really good about Rapidus's positioning."

Speaking of advanced process technologies, it is notable that Rapidus does not plan to use ASML's High-NA Twinscan EXE lithography scanners for 2 nm production. Instead, Rapidus is sticking to ASML's proven Low-NA scanners, which will reduce costs of Rapidus's fab, though it will entail usage of EUV double patterning, which brings up costs and lengthens the production cycle in other ways. Even with those trade-offs, SemiAnalysis analysts believe that given the cost of High-NA EUV litho tools and halved imaging field, ... Semiconductors

Intel Issues Official Statement Regarding 14th and 13th Gen Instability, Recommends Intel Default Settings

Further to our last piece which we detailed Intel's issue to motherboard vendors to follow with stock power settings for Intel's 14th and 13th Gen Core series processors, Intel has now issued a follow-up statement to this. Over the last week or so, motherboard vendors quickly released firmware updates with a new profile called 'Intel Baseline', which motherboard vendors assumed would address the instability issues. 

As it turns out, Intel doesn't seem to accept this as technically, these Intel Baseline profiles are not to be confused with Intel's default specifications. This means that Intel's Baseline profiles seemingly give the impression that they are operating at default settings, hence the terminology 'baseline' used, but this still opens motherboard vendors to use their interpretations of MCE or Multi-Core Enhancement.

To clarify things for consumers, Intel has sent us the following statement:

Several motherboard manufacturers have released BIOS profiles labeled ‘Intel Baseline Profile’. However, these BIOS profiles are not the same as the 'Intel Default Settings' recommendations that Intel has recently shared with its partners regarding the instability issues reported on 13th and 14th gen K SKU processors.

These ‘Intel Baseline Profile’ BIOS settings appear to be based on power delivery guidance previously provided by Intel to manufacturers describing the various power delivery options for 13th and 14th Generation K SKU processors based on motherboard capabilities.

Intel is not recommending motherboard manufacturers to use ‘baseline’ power delivery settings on boards capable of higher values.

Intel’s recommended ‘Intel Default Settings’ are a combination of thermal and power delivery features along with a selection of possible power delivery profiles based on motherboard capabilities.

Intel recommends customers to implement the highest power delivery profile compatible with each individual motherboard design as noted in the table below:

Click to Enlarge Intel's Default Settings

What Intel's statement is effectively saying to consumers, is that users shouldn't be using the Baseline Power Delivery profiles which are offered by motherboard vendors through a plethora of firmware updates. Instead, Intel is recommending users opt for Intel Default Settings, which follows what the specific processor is rated for by Intel out of the box to achieve the clock speeds advertised, without users having to worry about firmware 'over' optimization which can cause instability as there have been many reports of happening.

Not only this, but the Intel Default settings offer a combination of thermal specifications and power capabilities, including voltage and frequency curve settings that apply to the capability of the motherboard used, and the power delivery equipped on the motherboard. At least for the most part, Intel is recommending users with 14th and 13th-Gen Core series K, KF, and KS SKUs that they do not recommend users opt in using the Baseline profiles offered by motherboard vendors.

Digesting the contrast between the two statements, the key differential is that Intel's priority is reducing the current going through the processor, which for both the 14th and 13th Gen Core series processors is a maximum of 400 A, even when using the Extreme profile. We know those motherboard vendors on their Z790 and Z690 motherboards opt for an unrestricted power profile, which is essentially 'unlimited' power and current to maximize performance at the cost of power consumption and heat, which does exacerbate problems and can lead to frequent bouts of instability, especially on high-intensity workloads.

Another variable Intel is recommending is that the AC Load Line must match the design target of the processor, with a maximum value of 1.1 mOhm, and that the DC Load Line must be ... CPUs

Intel Teases Lunar Lake CPU Ahead of Computex: Most Power Efficient x86 Chip Yet

The next few weeks in the PC industry are going to come fast and furious. Between today and mid-June are multiple conferences and trade-shows, including Microsoft Build and the king of PC trade shows: Computex Taiwan. With all three PC CPU vendors set to present, there’s a lot going on, and a lot of product announcements to be had. But even before those trade shows start, Intel is looking to make the first move this afternoon with an early preview on its next-gen mobile processor, Lunar Lake.

While Intel hasn’t said too much about what to expect from their Computex 2024 keynote thus far, it’s clear that Intel’s next-gen CPUs – Lunar Lake for mobile, and Arrow Lake for Mobile/Desktop – are going to be two of the major stars of the show. At this point Intel has previously teased and/or demoed both chips (Lunar more so than Arrow), and this afternoon the company is releasing a bit more information on Lunar Lake even before Computex kicks off.

Officially, today’s reveal is a preview of Intel’s next Tech Tour event, which is taking place at the end of May. Unofficially, this is the exact same date and time as the embargo on Qualcomm Snapdragon X laptop announcements, which are slated to hit retail shelves next month. Lunar Lake laptops, by contrast, will not hit retail shelves until Q4 of this year. So although the additional technical details from today’s disclosure are great to have, looking at the bigger picture it’s difficult to interpret this reveal as anything less than a bald-faced effort to interdict the Snapdragon X launch (not that Qualcomm hasn’t also been crowing about SDX for the last 7 months). Which, if nothing else, goes to show the current tumultuous state of the laptop CPU market, and that Intel isn’t nearly as secure in their position as they have traditionally been.

CPUs

Intel Core i9-14900KS Review: The Swan Song of Raptor Lake With A Super Fast 6.2 GHz Turbo

For numerous generations of their desktop processor releases, Intel has made available a selection of high-performance special edition "KS" CPUs that add a little extra compared to their flagship chip. With a lot of interest, primarily from the enthusiasts looking for the fastest processors, Intel's latest Core i9-14900KS represents a super-fast addition to its 14th Generation Core lineup with out-of-the-box turbo clock speeds of up to 6.2 GHz and represents the last processor to end an era as Intel is removing the 'i' from its legendary nomenclature for future desktop chip releases.

Reaching speeds of up to 6.2 GHz, this sets up the Core i9-14900KS as the fastest desktop CPU in the world right now, at least in terms of frequencies out of the box. Building on their 'regular' flagship chip, the Core i9-14900, the Core i9-14900KS is also using their refreshed Raptor Lake (RPL-R) 8P+16E core chip design with a 200 MHz higher boost clock speed and also has a 100 MHz bump on P-Core base frequency. 

This new KS series SKU shows Intel's drive to offer an even faster alternative to their desktop regular K series offerings, and with the Core i9-14900KS, they look to provide the best silicon from their Raptor Lake Refresh series with more performance available to unlock to those who can. The caveat is that achieving these ridiculously fast clock speeds of 6.2 GHz on the P-Core comes at the cost of power and heat; keeping a processor pulling upwards of 350 W is a challenge in its own right, and users need to factor this in if even contemplating a KS series SKU.

In our previous KS series review, the Core i9-13900KS reached 360 W at its peak, considerably more than the Core i9-13900K. The Core i9-14900KS, built on the same core architecture, is expected to surpass that even further than the Core i9-14900K. We aim to compare Intel's final Core i series processor to the best of what both Intel and AMD have available, and it will be interesting to see how much performance can be extrapolated from the KS compared to the regular K series SKU.

CPUs

Micron Ships Crucial-Branded LPCAMM2 Memory Modules: 64GB of LPDDR5X For $330

As LPCAMM2 adoption begins, the first retail memory modules are finally starting to hit the retail market, courtesy of Micron. The memory manufacturer has begun selling their LPDDR5X-based LPCAMM2 memory modules under their in-house Crucial brand, making them available on the latter's storefront. Timed to coincide with the release of Lenovo's ThinkPad P1 Gen 7 laptop – the first retail laptop designed to use the memory modules – this marks the de facto start of the eagerly-awaited modular LPDDR5X memory era.

Micron's Low Power Compression Attached Memory Module 2 (LPCAMM2) modules are available in capacities of 32 GB and 64 GB. These are dual-channel modules that feature a 128-bit wide interface, and are based around LPDDR5X memory running at data rates up to 7500 MT/s. This gives a single LPCAMM2 a peak bandwidth of 120 GB/s. Micron is not disclosing the latencies of its LPCAMM2 memory modules, but it says that high data transfer rates of LPDDR5X compensate for the extended timings.

Micron says that LPDDR5X memory offers significantly lower power consumption, with active power per 64-bit bus being 43-58% lower than DDR5 at the same speed, and standby power up to 80% lower. Meanwhile, similar to DDR5 modules, LPCAMM2 modules include a power management IC and voltage regulating circuitry, which provides module manufacturers additional opportunities to reduce power consumption of their products.

Source: Micron LPDDR5X LPCAMM2 Technical Brief

It's worth noting, however, that at least for the first generation of LPCAMM2 modules, system vendors will need to pick between modularity and performance. While soldered-down LPDDR5X memory is available at speeds up to 8533 MT/sec – and with 9600 MT/sec on the horizon – the fastest LPCAMM2 modules planned for this year by both Micron and rival Samsung will be running at 7500 MT/sec. So vendors will have to choose between the flexibility of offering modular LPDDR5X, or the higher bandwidth (and space savings) offered by soldering down their memory.

Micron, for its part, is projecting that 9600 MT/sec LPCAMM2 modules will be available by 2026. Though it's all but certain that faster memory will also be avaialble in the same timeframe.

Micron's Crucial LPDDR5X 32 GB module costs $174.99, whereas a 64 GB module costs $329.99.

Memory

Arm Unveils 2024 CPU Core Designs, Cortex X925, A725 and A520: Arm v9.2 Redefined For 3nm

As the semiconductor industry continues to evolve, Arm stands at the forefront of innovation for its core and IP architecture, especially in the mobile space, by pushing the boundaries of technology to deliver cutting-edge solutions for end users. For 2024, Arm's year-on-year strategic advancements focus on enhancing last year's Armv9.2 architecture with a new twist. Arm has rebranded and re-strategized its efforts by introducing Client Compute Solutions (CSS), the direct successor to last year's Total Compute Solutions (TSC2023) platform.

Arm is also transitioning its latest IP and Cortex core designs, including the largest Cortex X925, the middle Cortex A725, and the refreshed and smaller Cortex A520 to the more advanced 3 nm process technology. Arm promises that the 3 nm process node will deliver unprecedented performance gains compared to last year's designs, power efficiency and scalability improvements, and new front and back-end refinements to its Cortex series of cores. Arms' new solutions look to power the next-generation mobile and AI applications as Arm, along with its complete AArch64 64-bit instruction execution and approach to solutions geared towards mobile and notebooks, look set to redefine end users' expectations within the Android and Windows on Arm products.

CPUs

SK hynix Reports That 2025 HBM Memory Supply Has Nearly Sold Out

Demand for high-performance processors for AI training is skyrocketing, and consequently so is the demand for the components that go into these processors. So much so that SK hynix this week is very publicly announcing that the company's high-bandwidth memory (HBM) production capacity has already sold out for the rest of 2024, and even most of 2025 has already sold out as well.

SK hynix currently produces various types of HBM memory for customers like Amazon, AMD, Facebook, Google (Broadcom), Intel, Microsoft, and, of course, NVIDIA. The latter is an especially prolific consumer of HBM3 and HBM3E memory for its H100/H200/GH200 accelerators, as NVIDIA is also working to fill what remains an insatiable (and unmet) demand for its accelerators.

As a result, HBM memory orders, which are already placed months in advance, are now backlogging well into 2025 as chip vendors look to secure supplies of the memory stacks critical to their success.

This has made SK hynix the secnd HBM memory vendor in recent months to announce that they've sold out into 2025, following an earlier announcement from Micron regarding its HBM3E production. But of the two announcements, SK hynix's is arguably the most significant yet, as the South Korean firm's HBM production capacity is far greater than Micron's. So while things were merely "interesting" with the smallest of the Big Three memory manufacturers being sold out into 2025, things are taking a more concerning (and constrained) outlook now that SK hynix is as well.

SK hynix currently controls roughly 46% - 49% of HBM market, and its share is not expected to drop significantly in 2025, according to market tracking firm TrendForce. By contrast, Micron's share on HBM memory market is between 4% and 6%. Since HBM supply of both companies is sold out through the most of 2025, we're likely looking at a scenario where over 50% of the industry's total HBM3/HBM3E supply for the coming quarters is already sold out.

This leaves Samsung as the only member of the group not to comment on HBM demand so far. Though with memory being a highly fungible commodity product, it would be surprising if Samsung wasn't facing similar demand. And, ultimately, all of this is pointing towards the indusry entering an HBM3 memory shortage.

Separately, SK hynix said that it is sampling 12-Hi 36GB HBM3E stacks with customers and will begin volume shipments in the third quarter.

Memory

SK hynix Reports That 2025 HBM Memory Supply Has Nearly Sold Out

Demand for high-performance processors for AI training is skyrocketing, and consequently so is the demand for the components that go into these processors. So much so that SK hynix this week is very publicly announcing that the company's high-bandwidth memory (HBM) production capacity has already sold out for the rest of 2024, and even most of 2025 has already sold out as well.

SK hynix currently produces various types of HBM memory for customers like Amazon, AMD, Facebook, Google (Broadcom), Intel, Microsoft, and, of course, NVIDIA. The latter is an especially prolific consumer of HBM3 and HBM3E memory for its H100/H200/GH200 accelerators, as NVIDIA is also working to fill what remains an insatiable (and unmet) demand for its accelerators.

As a result, HBM memory orders, which are already placed months in advance, are now backlogging well into 2025 as chip vendors look to secure supplies of the memory stacks critical to their success.

This has made SK hynix the secnd HBM memory vendor in recent months to announce that they've sold out into 2025, following an earlier announcement from Micron regarding its HBM3E production. But of the two announcements, SK hynix's is arguably the most significant yet, as the South Korean firm's HBM production capacity is far greater than Micron's. So while things were merely "interesting" with the smallest of the Big Three memory manufacturers being sold out into 2025, things are taking a more concerning (and constrained) outlook now that SK hynix is as well.

SK hynix currently controls roughly 46% - 49% of HBM market, and its share is not expected to drop significantly in 2025, according to market tracking firm TrendForce. By contrast, Micron's share on HBM memory market is between 4% and 6%. Since HBM supply of both companies is sold out through the most of 2025, we're likely looking at a scenario where over 50% of the industry's total HBM3/HBM3E supply for the coming quarters is already sold out.

This leaves Samsung as the only member of the group not to comment on HBM demand so far. Though with memory being a highly fungible commodity product, it would be surprising if Samsung wasn't facing similar demand. And, ultimately, all of this is pointing towards the indusry entering an HBM3 memory shortage.

Separately, SK hynix said that it is sampling 12-Hi 36GB HBM3E stacks with customers and will begin volume shipments in the third quarter.

Memory

TSMC's Roadmap at a Glance: N3X, N2P, A16 Coming in 2025/2026

As announced last week by TSMC, later this year the company is set to start high-volume manufacturing on its N3P fabrication process, and this will be the company's most advanced node for a while. Next year things will get a bit more interesting as TSMC will have two process technologies that could actually compete against each other when they enter high-volume manufacturing (HVM) in the second half of 2025.

Advertised PPA Improvements of New Process Technologies Data announced during conference calls, events, press briefings and press releases
Compiled by AnandTech	TSMC
	N3 vs N5	N3E vs N5	N3P vs N3E	N3X vs N3P	N2 vs N3E	N2P vs N3E	N2P vs N2	A16 vs N2P
Power	-25% -30%	-34%	-5% -10%	-7%***	-25% -30%	-30% -40%	-5% -10%	-15% -20%
Performance	+10% +15%	+18%	+5%	+5% Fmax @1.2V**	+10% +15%	+15% +20%	+5 +10%	+8% +10%
Density*	?	1.3x	1.04x	1.10x***	1.15x	1.15x	?	1.07x 1.10x
HVM	Q4 2022	Q4 2023	H2 2024	H2 2025	H2 2025	H2 2026	H2 2026	H2 2026

*Chip density published by TSMC reflects 'mixed' chip density consisting of 50% logic, 30% SRAM, and 20% analog.
**At the same area. 
***At the same speed.

The production nodes are N3X (3nm-class, extreme performance-focused) as well as N2 (2nm-class). TSMC says that when compared to N3P, chips made on N3X can either lower power consumption by 7% at the same frequency by lowering Vdd from 1.0V to 0.9V, increase performance by 5% at the same area, or increase transistor density by around 10% at the same frequency. Meanwhile, the key advantage of N3X compared to predecessors is its maximum voltage of 1.2V, which is important for ultra-high-performance applications, such as desktop or datacenter GPUs.

TSMC's N2 will be TSMC's first production node to use gate-all-around (GAA) nanosheet transistors and this will significantly enhance its performance, power, and are... Semiconductors

MSI Teases Z790 Project Zero Plus Motherboard With CAMM2 Memory Support

MSI on Thursday published the first image of a new desktop motherboard that supports the innovative DDR5 compression attached memory module (CAMM2). DDR5 CAMM2 modules are designed to improve upon the SO-DIMM form factor used for laptops, alleviating some of the high-speed signaling and capacity limitations of SO-DIMMs while also shaving down on the volume of space required. And while we're eagerly awaiting to see CAMM2 show up in more laptops, its introduction in a PC motherboard comes as a bit of a surprise, since PCs aren't nearly as space-constrained.

MSI's Z790 Project Zero Plus motherboard, which supports Intel's latest 14^th Generation Core processors, is to a large degree a proof-of-concept product that is showcasing several new technologies and atypical configuration options. Key among these, of course, is the CAMM2 connector. The single connector supports a 128-bit DDR5 memory bus, allowing for a system to be fully populated with RAM with just a single, horizontally-mounted CAMM2 module. And in terms of design, the Zero Plus also features backside power connectors for improved cable management.

CAMM2 is designed to replace traditional modules in an SO-DIMM form-factor and is meant to occupy up to 64% less space than two DDR5 SO-DIMMs. In addition, CAMM2 greatly optimizes signal and power traces inside the motherboard, primarily by ensuring all memory trace lengths are identical, reducing some of the signaling penalties that normally come from supporting multiple SO-DIMM slots in a system. With DDR5 being particularly sensitive here – to the point where 2 DIMM Per Channel (2DPC) configurations take a max frequency hit even on desktop systems – CAMM2 modules are expected to simplify and, to a degree, improve laptop designs to better match DDR5's limitations.

Though whether CAMM2 sees widespread adoption remains to be seen. Unlike it's LPDDR5X counterpart, LPCAMM2, DDR5 CAMM2 hasn't attracted the same interest from laptop vendors quite yet, in large part because it doesn't introduce any new functionality (e.g. socketed LPDDR5X).

Meanwhile CAMM2 in ATX desktops is all but unexplored right now, which is why we're seeing experimental products like MSI's motherboard. The space savings alone aren't as important in desktops due to their size – though CAMM2 does cut down on Z-height, keeping memory away from CPU coolers. But PC makers will be looking at other factors such as inventory, as equipping desktop boards with CAMM2 connectors would allow them to use the same memory modules in both laptops and desktops. And longer term there is the question of whether CAMM2 can deliver tangible signaling benefits over traditional DIMMs.

MSI plans to showcase its Z790 Project Zero Plus platform at Computex, alongside memory partner Kingston. The latter will be at the show to demonstrate its Fury Impact CAMM2 memory module, which is one of the first DDR5 CAMM2 modules to be announced.

Motherboards

ASUS NUC14RVHv7 and ASRock Industrial NUC BOX-155H Review: Meteor Lake Brings Accelerated AI to UCFF PCs

Intel's Meteor Lake series of processors has had a drawn-out launch since its details were officially presented in September 2023. The series marks Intel's foray into the consumer market with a tile-based chiplet configuration held together with Foveros packaging. Similar to Tiger Lake, the focus of Meteor Lake has primarily been on the mobile market - ultraportables and notebooks. However, this has not prevented Intel and its partners from introducing it as a follow-up to Raptor Lake-P and Raptor Lake-H in the SFF / UCFF desktop market.

ASRock Industrial has consistently been the first to market with ultra-compact form-factor motherboards and mini-PCs, with product announcements coinciding with Intel's launch of its latest and greatest mobile processors. Meteor Lake has not been any different, with the NUC(S) Ultra 100 BOX series launching towards the end of Q4 2023. In the meanwhile, Intel's NUC business unit was purchased by ASUS and had its first major product announcement in the form of the Meteor Lake-based Revel Canyon NUCs at the 2024 CES.

The flagship NUC Ultra 100 BOX system is the NUC BOX-155H based on the Intel Core Ultra 7 155H. The Revel Canyon NUC lineup includes a model based on the Core Ultra 7 165H with vPro capabilities, with its claim to fame being the ability to hit 5 GHz on the performance cores. Read on for a detailed look at the features and performance profile of the ASRock Industrial NUC BOX-155H and the ASUS NUC14RVHv7. The analysis also helps in establishing the potential and benefits of Meteor Lake for the UCFF desktop market over its predecessors and the competition.

Systems