One of the more subtle trends at this year's Computex was that the majority of high-end motherboards now come equipped with a 5GbE network controller. At present, this might be considered a limited benefit as 5GbE and 10GbE switches and routers are still pretty expensive. But Realtek is planning on tackling the issue from both ends, as the company is preparing a hardware platform for sub-$100 5GbE switches.
Realtek’s quad-port 5GbE switch platform consists of five key chips: one RTL9303 switch system-on-chip, and four RTL8251B 5GbE physical interfaces (PHYs). The chips are accompanied by various other components, such as power management ICs, but in general it relies solely on in-house developed components, which is why it can be made so cheap.
RealTek's platform is meant for home and small offices, which is reflected in the switch's feature set. This is a simple, unmanaged switch with a handful of ports, making it ideal for linking up a few systems, while enterprise users will likely find it a bit too basic.
Segmenting the market like this is ultimately critical for bringing down the price of hardware. The bulk of 5GbE/10GbE switches on the market today are more enterprise-focused managed switches, which carry more features and a price premium to match. So developing a stripped-down platform for cheaper consumer switches is a huge development that should finally make it economical for consumers to adopt faster networking hardware, similar to 2.5GbE a few years ago.
At present, 2.5GbE switches are running at around $20/port, so RealTek's sub-$100 target for a 4-port switch aims to bring 5GbE in at just a slightly higher price tag of $25/port. Or, compared to the handful of unmanaged 10GbE switches on the market, which average $60/port, this will be less than half the price (though at half the bandwidth).
The proliferation of cheap 5GbE network switches will also mark a notable inflection point in Ethernet hardware design, as it's the fastest standard that is rated to work the ubiquitous Cat 5e cable. The NBASE-T standard was penned almost a decade ago in order to cover the missing-middle between 1GbE and 10GbE, while getting more bandwidth out of existing, widely-deployed Cat 5e cabling. So with the release of consumer 5GbE gear, the standard's goals are finally coming to fruition – though it does mean we're finally reaching the end of the road for the oldest network cabling still widely in use.
For now, Realtek is only talking about one customer offering a sub-$100 5GbE switch this September, but something tells me that other partners of the company will come up with similar devices soon enough. As a result of the competition, prices could get even lower, which is always good for buyers.
These benefits should also funnel into Wi-Fi 7 routers, to a limited extent. Wired backhaul speeds need to keep pace with ever-faster Wi-Fi standards in order to keep those newer radios fed, so it's not a coincidence that cheaper 5GbE is finally coming right as Wi-Fi 7 is taking off.
Overall, the company's 5GbE switch platform is part of a larger ecosystem of 5GbE hardware that Realtek was showing off at Computex. In addition to RTL8251B 5GbE PHYs and RTL9303 switch SoC, the company is also preparing their RTL8126 PCIe 3.1 network controller, and RTL8157 NIC for USB dongles.
NetworkingIntel has divested its entire stake in Arm Holdings during the second quarter, raising approximately $147 million. Alongside this, Intel sold its stake in cybersecurity firm ZeroFox and reduced its holdings in Astera Labs, all as part of a broader effort to manage costs and recover cash amid significant financial challenges.
The sale of Intel's 1.18 million shares in Arm Holdings, as reported in a recent SEC filing, comes at a time when the company is struggling with substantial financial losses. Despite the $147 million generated from the sale, Intel reported a $120 million net loss on its equity investments for the quarter, which is a part of a larger $1.6 billion loss that Intel faced during this period.
In addition to selling its stake in Arm, Intel also exited its investment in ZeroFox and reduced its involvement with Astera Labs, a company known for developing connectivity platforms for enterprise hardware. These moves are in line with Intel's strategy to reduce costs and stabilize its financial position as it faces ongoing market challenges.
Despite the divestment, Intel's past investment in Arm was likely driven by strategic considerations. Arm Holdings is a significant force in the semiconductor industry, with its designs powering most mobile devices, and, for obvious reasons, Intel would like to address these. Intel and Arm are also collaborating on datacenter platforms tailored for Intel's 18A process technology. Additionally, Arm might view Intel as a potential licensee for its technologies and a valuable partner for other companies that license Arm's designs.
Intel's investment in Astera Labs was also a strategic one as the company probably wanted to secure steady supply of smart retimers, smart cable modems, and CXL memory controller, which are used in volumes in datacenters and Intel is certainly interested in selling as many datacenter CPUs as possible.
Intel's financial struggles were highlighted earlier this month when the company released a disappointing earnings report, which led to a 33% drop in its stock value, erasing billions of dollars of capitalization. To counter these difficulties, Intel announced plans to cut 15,000 jobs and implement other expense reductions. The company has also suspended its dividend, signaling the depth of its efforts to conserve cash and focus on recovery. When it comes to divestment of Arm stock, the need for immediate financial stabilization has presumably taken precedence, leading to the decision.
CPUsThe Ultra Ethernet Consortium (UEC) has announced this week that the next-generation interconnection consortium has grown to 55 members. And as the group works towards developing the initial version of their ultra-fast Ethernet standard, they have released some of the first technical details on the upcoming standard.
Formed in the summer of 2023, the UEC aims to develop a new standard for interconnection for AI and HPC datacenter needs, serving as a de-facto (if not de-jure) alternative to InfiniBand, which is largely under the control of NVIDIA these days. The UEC began to accept new members back in November, and just in five months' time it gained 45 new members, which highlights massive interest for the new technology. The consortium now boasts 55 members and 715 industry experts, who are working across eight technical groups.
There is a lot of work at hand for the UEC, as the group has laid out in their latest development blog post, as the consortium works to to build a unified Ethernet-based communication stack for high-performance networking supporting artificial intelligence and high-performance computing clusters. The consortium's technical objectives include developing specifications, APIs, and source code for Ultra Ethernet communications, updating existing protocols, and introducing new mechanisms for telemetry, signaling, security, and congestion management. In particular, Ultra Ethernet introduces the UEC Transport (UET) for higher network utilization and lower tail latency to speed up RDMA (Remote Direct Memory Access) operation over Ethernet. Key features include multi-path packet spraying, flexible ordering, and advanced congestion control, ensuring efficient and reliable data transfer.
These enhancements are designed to address the needs of large AI and HPC clusters — with separate profiles for each type of deployment — though everything is done in a surgical manner to enhance the technology, but reuse as much of the existing Ethernet as possible to maintain cost efficiency and interoperability.
The consortium's founding members include AMD, Arista, Broadcom, Cisco, Eviden (an Atos Business), HPE, Intel, Meta, and Microsoft. After the Ultra Ethernet Consortium (UEC) began to accept new members in October, 2023, numerous industry heavyweights have joined the group, including Baidu, Dell, Huawei, IBM, Nokia, Lenovo, Supermicro, and Tencent.
The consortium currently plans to release the initial 1.0 version of the UEC specification publicly sometime in the third quarter of 2024.
"There was always a recognition that UEC was meeting a need in the industry," said J Metz, Chair of the UEC Steering Committee. "There is a strong desire to have an open, accessible, Ethernet-based network specifically designed to accommodate AI and HPC workload requirements. This level of involvement is encouraging; it helps us achieve the goal of broad interoperability and stability."
While it is evident that then Ultra Ethernet Consortium is gaining support across the industry, it is still unclear where other industry behemoths like AWS and Google stand. While the hardware companies involved can design Ultra Ethernet support into their hardware and systems, the technology ultimately exists to serve large datacenter and HPC system operators. So it will be interesting to see what interest they take in (and how quickly they adopt) the nascent Ethernet backbone technology once hardware incorporating it is ready.
NetworkingThanks to the success of the burgeoning market for AI accelerators, NVIDIA has been on a tear this year. And the only place that’s even more apparent than the company’s rapidly growing revenues is in the company’s stock price and market capitalization. After breaking into the top 5 most valuable companies only earlier this year, NVIDIA has reached the apex of Wall Street, closing out today as the world’s most valuable company.
With a closing price of $135.58 on a day that saw NVIDIA’s stock pop up another 3.5%, NVIDIA has topped both Microsoft and Apple in valuation, reaching a market capitalization of $3.335 trillion. This follows a rapid rise in the company’s stock price, which has increased by 47% in the last month alone – particularly on the back of NVIDIA’s most recent estimates-beating earnings report – as well as a recent 10-for-1 stock split. And looking at the company’s performance over a longer time period, NVIDIA’s stock jumped a staggering 218% over the last year, or a mere 3,474% over the last 5 years.
NVIDIA’s ascension continues a trend over the last several years of tech companies all holding the top spots in the market capitalization rankings. Though this is the first time in quite a while that the traditional tech leaders of Apple and Microsoft have been pushed aside.
| Market Capitalization Rankings | ||
| Market Cap | Stock Price | |
| NVIDIA | $3.335T | $135.58 |
| Microsoft | $3.317T | $446.34 |
| Apple | $3.285T | $214.29 |
| Alphabet | $2.170T | $176.45 |
| Amazon | $1.902T | $182.81 |
Driving the rapid growth of NVIDIA and its market capitalization has been demand for AI accelerators from NVIDIA, particularly the company’s server-grade H100, H200, and GH200 accelerators for AI training. As the demand for these products has spiked, NVIDIA has been scaling up accordingly, repeatedly beating market expectations for how many of the accelerators they can ship – and what price they can charge. And despite all that growth, orders for NVIDIA’s high-end accelerators are still backlogged, underscoring how NVIDIA still isn’t meeting the full demands of hyperscalers and other enterprises.
Consequently, NVIDIA’s stock price and market capitalization have been on a tear on the basis of these future expectations. With a price-to-earnings (P/E) ratio of 76.7 – more than twice that of Microsoft or Apple – NVIDIA is priced more like a start-up than a 30-year-old tech company. But then it goes without saying that most 30-year-old tech companies aren’t tripling their revenue in a single year, placing NVIDIA in a rather unique situation at this time.
Like the stock market itself, market capitalizations are highly volatile. And historically speaking, it’s far from guaranteed that NVIDIA will be able to hold the top spot for long, never mind day-to-day fluctuations. NVIDIA, Apple, and Microsoft’s valuations are all within $50 billion (1.%) of each other, so for the moment at least, it’s still a tight race between all three companies. But no matter what happens from here, NVIDIA gets the exceptionally rare claim of having been the most valuable company in the world at some point.
(Carousel image courtesy MSN Money)
GPUsIntel has divested its entire stake in Arm Holdings during the second quarter, raising approximately $147 million. Alongside this, Intel sold its stake in cybersecurity firm ZeroFox and reduced its holdings in Astera Labs, all as part of a broader effort to manage costs and recover cash amid significant financial challenges.
The sale of Intel's 1.18 million shares in Arm Holdings, as reported in a recent SEC filing, comes at a time when the company is struggling with substantial financial losses. Despite the $147 million generated from the sale, Intel reported a $120 million net loss on its equity investments for the quarter, which is a part of a larger $1.6 billion loss that Intel faced during this period.
In addition to selling its stake in Arm, Intel also exited its investment in ZeroFox and reduced its involvement with Astera Labs, a company known for developing connectivity platforms for enterprise hardware. These moves are in line with Intel's strategy to reduce costs and stabilize its financial position as it faces ongoing market challenges.
Despite the divestment, Intel's past investment in Arm was likely driven by strategic considerations. Arm Holdings is a significant force in the semiconductor industry, with its designs powering most mobile devices, and, for obvious reasons, Intel would like to address these. Intel and Arm are also collaborating on datacenter platforms tailored for Intel's 18A process technology. Additionally, Arm might view Intel as a potential licensee for its technologies and a valuable partner for other companies that license Arm's designs.
Intel's investment in Astera Labs was also a strategic one as the company probably wanted to secure steady supply of smart retimers, smart cable modems, and CXL memory controller, which are used in volumes in datacenters and Intel is certainly interested in selling as many datacenter CPUs as possible.
Intel's financial struggles were highlighted earlier this month when the company released a disappointing earnings report, which led to a 33% drop in its stock value, erasing billions of dollars of capitalization. To counter these difficulties, Intel announced plans to cut 15,000 jobs and implement other expense reductions. The company has also suspended its dividend, signaling the depth of its efforts to conserve cash and focus on recovery. When it comes to divestment of Arm stock, the need for immediate financial stabilization has presumably taken precedence, leading to the decision.
CPUsThe Ultra Ethernet Consortium (UEC) has announced this week that the next-generation interconnection consortium has grown to 55 members. And as the group works towards developing the initial version of their ultra-fast Ethernet standard, they have released some of the first technical details on the upcoming standard.
Formed in the summer of 2023, the UEC aims to develop a new standard for interconnection for AI and HPC datacenter needs, serving as a de-facto (if not de-jure) alternative to InfiniBand, which is largely under the control of NVIDIA these days. The UEC began to accept new members back in November, and just in five months' time it gained 45 new members, which highlights massive interest for the new technology. The consortium now boasts 55 members and 715 industry experts, who are working across eight technical groups.
There is a lot of work at hand for the UEC, as the group has laid out in their latest development blog post, as the consortium works to to build a unified Ethernet-based communication stack for high-performance networking supporting artificial intelligence and high-performance computing clusters. The consortium's technical objectives include developing specifications, APIs, and source code for Ultra Ethernet communications, updating existing protocols, and introducing new mechanisms for telemetry, signaling, security, and congestion management. In particular, Ultra Ethernet introduces the UEC Transport (UET) for higher network utilization and lower tail latency to speed up RDMA (Remote Direct Memory Access) operation over Ethernet. Key features include multi-path packet spraying, flexible ordering, and advanced congestion control, ensuring efficient and reliable data transfer.
These enhancements are designed to address the needs of large AI and HPC clusters — with separate profiles for each type of deployment — though everything is done in a surgical manner to enhance the technology, but reuse as much of the existing Ethernet as possible to maintain cost efficiency and interoperability.
The consortium's founding members include AMD, Arista, Broadcom, Cisco, Eviden (an Atos Business), HPE, Intel, Meta, and Microsoft. After the Ultra Ethernet Consortium (UEC) began to accept new members in October, 2023, numerous industry heavyweights have joined the group, including Baidu, Dell, Huawei, IBM, Nokia, Lenovo, Supermicro, and Tencent.
The consortium currently plans to release the initial 1.0 version of the UEC specification publicly sometime in the third quarter of 2024.
"There was always a recognition that UEC was meeting a need in the industry," said J Metz, Chair of the UEC Steering Committee. "There is a strong desire to have an open, accessible, Ethernet-based network specifically designed to accommodate AI and HPC workload requirements. This level of involvement is encouraging; it helps us achieve the goal of broad interoperability and stability."
While it is evident that then Ultra Ethernet Consortium is gaining support across the industry, it is still unclear where other industry behemoths like AWS and Google stand. While the hardware companies involved can design Ultra Ethernet support into their hardware and systems, the technology ultimately exists to serve large datacenter and HPC system operators. So it will be interesting to see what interest they take in (and how quickly they adopt) the nascent Ethernet backbone technology once hardware incorporating it is ready.
NetworkingThanks to the success of the burgeoning market for AI accelerators, NVIDIA has been on a tear this year. And the only place that’s even more apparent than the company’s rapidly growing revenues is in the company’s stock price and market capitalization. After breaking into the top 5 most valuable companies only earlier this year, NVIDIA has reached the apex of Wall Street, closing out today as the world’s most valuable company.
With a closing price of $135.58 on a day that saw NVIDIA’s stock pop up another 3.5%, NVIDIA has topped both Microsoft and Apple in valuation, reaching a market capitalization of $3.335 trillion. This follows a rapid rise in the company’s stock price, which has increased by 47% in the last month alone – particularly on the back of NVIDIA’s most recent estimates-beating earnings report – as well as a recent 10-for-1 stock split. And looking at the company’s performance over a longer time period, NVIDIA’s stock jumped a staggering 218% over the last year, or a mere 3,474% over the last 5 years.
NVIDIA’s ascension continues a trend over the last several years of tech companies all holding the top spots in the market capitalization rankings. Though this is the first time in quite a while that the traditional tech leaders of Apple and Microsoft have been pushed aside.
| Market Capitalization Rankings | ||
| Market Cap | Stock Price | |
| NVIDIA | $3.335T | $135.58 |
| Microsoft | $3.317T | $446.34 |
| Apple | $3.285T | $214.29 |
| Alphabet | $2.170T | $176.45 |
| Amazon | $1.902T | $182.81 |
Driving the rapid growth of NVIDIA and its market capitalization has been demand for AI accelerators from NVIDIA, particularly the company’s server-grade H100, H200, and GH200 accelerators for AI training. As the demand for these products has spiked, NVIDIA has been scaling up accordingly, repeatedly beating market expectations for how many of the accelerators they can ship – and what price they can charge. And despite all that growth, orders for NVIDIA’s high-end accelerators are still backlogged, underscoring how NVIDIA still isn’t meeting the full demands of hyperscalers and other enterprises.
Consequently, NVIDIA’s stock price and market capitalization have been on a tear on the basis of these future expectations. With a price-to-earnings (P/E) ratio of 76.7 – more than twice that of Microsoft or Apple – NVIDIA is priced more like a start-up than a 30-year-old tech company. But then it goes without saying that most 30-year-old tech companies aren’t tripling their revenue in a single year, placing NVIDIA in a rather unique situation at this time.
Like the stock market itself, market capitalizations are highly volatile. And historically speaking, it’s far from guaranteed that NVIDIA will be able to hold the top spot for long, never mind day-to-day fluctuations. NVIDIA, Apple, and Microsoft’s valuations are all within $50 billion (1.%) of each other, so for the moment at least, it’s still a tight race between all three companies. But no matter what happens from here, NVIDIA gets the exceptionally rare claim of having been the most valuable company in the world at some point.
(Carousel image courtesy MSN Money)
GPUsIntrospect this week introduced its M5512 GDDR7 memory test system, which is designed for testing GDDR7 memory controllers, physical interface, and GDDR7 SGRAM chips. The tool will enable memory and processor manufacturers to verify that their products perform as specified by the standard.
One of the crucial phases of a processor design bring up is testing its standard interfaces, such as PCIe, DisplayPort, or GDDR is to ensure that they behave as specified both logically and electrically and achieve designated performance. Introspect's M5512 GDDR7 memory test system is designed to do just that: test new GDDR7 memory devices, troubleshoot protocol issues, assess signal integrity, and conduct comprehensive memory read/write stress tests.
The product will be quite useful for designers of GPUs/SoCs, graphics cards, PCs, network equipment and memory chips, which will speed up development of actual products that rely on GDDR7 memory. For now, GPU and SoC designers as well as memory makers use highly-custom setups consisting of many tools to characterize signal integrity as well as conduct detailed memory read/write functional stress testing, which are important things at this phase of development. But usage of a single tool greatly speeds up all the processes and gives a more comprehensive picture to specialists.
The M5512 GDDR7 Memory Test System is a desktop testing and measurement device that is equippped with 72 pins capable of functioning at up to 40 Gbps in PAM3 mode, as well as offering a virtual GDDR7 memory controller. The device features bidirectional circuitry for executing read and write operations, and every pin is equipped with an extensive range of analog characterization features, such as skew injection with femto-second resolution, voltage control with millivolt resolution, programmable jitter injection, and various eye margining features critical for AC characterization and conformance testing. Furthermore, the system integrates device power supplies with precise power sequencing and ramping controls, providing a comprehensive solution for both AC characterization and memory functional stress testing on any GDDR7 device.
Introspects M5512 has been designed in close collaboration with JEDEC members working on the GDDR7 specification, so it promises to meet all of their requirements for compliance testing. Notably, however, the device does not eliminate need for interoperability tests and still requires companies to develop their own test algorithms, but it's still a significant tool for bootstrapping device development and getting it to the point where chips can begin interop testing.
“In its quest to support the industry on GDDR7 deployment, Introspect Technology has worked tirelessly in the last few years with JEDEC members to develop the M5512 GDDR7 Memory Test System,” said Dr. Mohamed Hafed, CEO at Introspect Technology.
GPUsBeing the first company to ship HBM3E memory has its perks for Micron, as the company has revealed that is has managed to sell out the entire supply of its advanced high-bandwidth memory for 2024, while most of their 2025 production has been allocated, as well. Micron's HBM3E memory (or how Micron alternatively calls it, HBM3 Gen2) was one of the first to be qualified for NVIDIA's updated H200/GH200 accelerators, so it looks like the DRAM maker will be a key supplier to the green company.
"Our HBM is sold out for calendar 2024, and the overwhelming majority of our 2025 supply has already been allocated," said Sanjay Mehrotra, chief executive of Micron, in prepared remarks for the company's earnings call this week. "We continue to expect HBM bit share equivalent to our overall DRAM bit share sometime in calendar 2025."
Micron's first HBM3E product is an 8-Hi 24 GB stack with a 1024-bit interface, 9.2 GT/s data transfer rate, and a total bandwidth of 1.2 TB/s. NVIDIA's H200 accelerator for artificial intelligence and high-performance computing will use six of these cubes, providing a total of 141 GB of accessible high-bandwidth memory.
"We are on track to generate several hundred million dollars of revenue from HBM in fiscal 2024 and expect HBM revenues to be accretive to our DRAM and overall gross margins starting in the fiscal third quarter," said Mehrotra.
The company has also began sampling its 12-Hi 36 GB stacks that offer a 50% more capacity. These KGSDs will ramp in 2025 and will be used for next generations of AI products. Meanwhile, it does not look like NVIDIA's B100 and B200 are going to use 36 GB HBM3E stacks, at least initially.
Demand for artificial intelligence servers set records last year, and it looks like it is going to remain high this year as well. Some analysts believe that NVIDIA's A100 and H100 processors (as well as their various derivatives) commanded as much as 80% of the entire AI processor market in 2023. And while this year NVIDIA will face tougher competition from AMD, AWS, D-Matrix, Intel, Tenstorrent, and other companies on the inference front, it looks like NVIDIA's H200 will still be the processor of choice for AI training, especially for big players like Meta and Microsoft, who already run fleets consisting of hundreds of thousands of NVIDIA accelerators. With that in mind, being a primary supplier of HBM3E for NVIDIA's H200 is a big deal for Micron as it enables it to finally capture a sizeable chunk of the HBM market, which is currently dominated by SK Hynix and Samsung, and where Micron controlled only about 10% as of last year.
Meanwhile, since every DRAM device inside an HBM stack has a wide interface, it is physically bigger than regular DDR4 or DDR5 ICs. As a result, the ramp of HBM3E memory will affect bit supply of commodity DRAMs from Micron, the company said.
"The ramp of HBM production will constrain supply growth in non-HBM products," Mehrotra said. "Industrywide, HBM3E consumes approximately three times the wafer supply as DDR5 to produce a given number of bits in the same technology node."
MemoryKioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
StorageToday, Noctua announced the launch of its NH-D12L chromax.black CPU cooler, an all-black version of the existing NH-D12L. The cooler sports not only a coat of mattte black paint, but also a relatively short height of 145mm, which Noctua says makes the NH-D12L suitable for slimmer cases and 4U server racks.
Having launched in 2022, the NH-D12L is essentially a shorter version of the NH-U12A, which stands at 158mm tall. While plenty of cases have the room for a cooler that tall, not all do (especially small form factor cases). The NH-D12L exists to offer similar performance as the NH-U12A but for cases where 145mm would fit but 158mm wouldn’t. However, the NH-D12L has just a single 120mm NF-A12x25 fan, whereas the NH-U12A has two. Additionally, the NH-D12L has five heatpipes to the NH-U12A’s seven. These two factors mean the NH-D12L can’t quite catch up to the NH-U12A when it comes to cooling capacity.
The chromax.black model is practically identical to the original, but features Noctua’s popular black motif. It should perform the same, and its SecuFirm 2 mounting hardware supports the same sockets: AMD’s AM4 and AM5, and Intel’s LGA 1700 and LGA 1851 for upcoming Arrow Lake CPUs. Despite its compact design, the NH-D12L also has “100% RAM compatibility” for sticks with tall heatspreaders, which sometimes pose clearance issues with air coolers.
The NH-D12L chromax.black also comes with the usual Noctua accessories: a screwdriver, NH-T1 thermal paste, and a four-pin low-noise adapter for the NF-A12x25 fan. Additionally, the 120mm fan is mounted to the cooler via a bracket, meaning no screws are necessary and it can be removed or installed toollessly.
At $99/€109, the NH-D12L is positioned fairly high in the market, next to larger high-end air coolers such as Corsair’s A115, as well as 240mm to 360mm AIO liquid coolers. However, the NH-D12L holds a substantial advantage in its size and compatibility, and while many of these high-end air coolers are 160mm tall or more, the NH-D12L is just 145mm. In some cases, even 15mm could make a big difference.
CPU coolerIntrospect this week introduced its M5512 GDDR7 memory test system, which is designed for testing GDDR7 memory controllers, physical interface, and GDDR7 SGRAM chips. The tool will enable memory and processor manufacturers to verify that their products perform as specified by the standard.
One of the crucial phases of a processor design bring up is testing its standard interfaces, such as PCIe, DisplayPort, or GDDR is to ensure that they behave as specified both logically and electrically and achieve designated performance. Introspect's M5512 GDDR7 memory test system is designed to do just that: test new GDDR7 memory devices, troubleshoot protocol issues, assess signal integrity, and conduct comprehensive memory read/write stress tests.
The product will be quite useful for designers of GPUs/SoCs, graphics cards, PCs, network equipment and memory chips, which will speed up development of actual products that rely on GDDR7 memory. For now, GPU and SoC designers as well as memory makers use highly-custom setups consisting of many tools to characterize signal integrity as well as conduct detailed memory read/write functional stress testing, which are important things at this phase of development. But usage of a single tool greatly speeds up all the processes and gives a more comprehensive picture to specialists.
The M5512 GDDR7 Memory Test System is a desktop testing and measurement device that is equippped with 72 pins capable of functioning at up to 40 Gbps in PAM3 mode, as well as offering a virtual GDDR7 memory controller. The device features bidirectional circuitry for executing read and write operations, and every pin is equipped with an extensive range of analog characterization features, such as skew injection with femto-second resolution, voltage control with millivolt resolution, programmable jitter injection, and various eye margining features critical for AC characterization and conformance testing. Furthermore, the system integrates device power supplies with precise power sequencing and ramping controls, providing a comprehensive solution for both AC characterization and memory functional stress testing on any GDDR7 device.
Introspects M5512 has been designed in close collaboration with JEDEC members working on the GDDR7 specification, so it promises to meet all of their requirements for compliance testing. Notably, however, the device does not eliminate need for interoperability tests and still requires companies to develop their own test algorithms, but it's still a significant tool for bootstrapping device development and getting it to the point where chips can begin interop testing.
“In its quest to support the industry on GDDR7 deployment, Introspect Technology has worked tirelessly in the last few years with JEDEC members to develop the M5512 GDDR7 Memory Test System,” said Dr. Mohamed Hafed, CEO at Introspect Technology.
GPUsIntel has divested its entire stake in Arm Holdings during the second quarter, raising approximately $147 million. Alongside this, Intel sold its stake in cybersecurity firm ZeroFox and reduced its holdings in Astera Labs, all as part of a broader effort to manage costs and recover cash amid significant financial challenges.
The sale of Intel's 1.18 million shares in Arm Holdings, as reported in a recent SEC filing, comes at a time when the company is struggling with substantial financial losses. Despite the $147 million generated from the sale, Intel reported a $120 million net loss on its equity investments for the quarter, which is a part of a larger $1.6 billion loss that Intel faced during this period.
In addition to selling its stake in Arm, Intel also exited its investment in ZeroFox and reduced its involvement with Astera Labs, a company known for developing connectivity platforms for enterprise hardware. These moves are in line with Intel's strategy to reduce costs and stabilize its financial position as it faces ongoing market challenges.
Despite the divestment, Intel's past investment in Arm was likely driven by strategic considerations. Arm Holdings is a significant force in the semiconductor industry, with its designs powering most mobile devices, and, for obvious reasons, Intel would like to address these. Intel and Arm are also collaborating on datacenter platforms tailored for Intel's 18A process technology. Additionally, Arm might view Intel as a potential licensee for its technologies and a valuable partner for other companies that license Arm's designs.
Intel's investment in Astera Labs was also a strategic one as the company probably wanted to secure steady supply of smart retimers, smart cable modems, and CXL memory controller, which are used in volumes in datacenters and Intel is certainly interested in selling as many datacenter CPUs as possible.
Intel's financial struggles were highlighted earlier this month when the company released a disappointing earnings report, which led to a 33% drop in its stock value, erasing billions of dollars of capitalization. To counter these difficulties, Intel announced plans to cut 15,000 jobs and implement other expense reductions. The company has also suspended its dividend, signaling the depth of its efforts to conserve cash and focus on recovery. When it comes to divestment of Arm stock, the need for immediate financial stabilization has presumably taken precedence, leading to the decision.
CPUsThe Ultra Ethernet Consortium (UEC) has announced this week that the next-generation interconnection consortium has grown to 55 members. And as the group works towards developing the initial version of their ultra-fast Ethernet standard, they have released some of the first technical details on the upcoming standard.
Formed in the summer of 2023, the UEC aims to develop a new standard for interconnection for AI and HPC datacenter needs, serving as a de-facto (if not de-jure) alternative to InfiniBand, which is largely under the control of NVIDIA these days. The UEC began to accept new members back in November, and just in five months' time it gained 45 new members, which highlights massive interest for the new technology. The consortium now boasts 55 members and 715 industry experts, who are working across eight technical groups.
There is a lot of work at hand for the UEC, as the group has laid out in their latest development blog post, as the consortium works to to build a unified Ethernet-based communication stack for high-performance networking supporting artificial intelligence and high-performance computing clusters. The consortium's technical objectives include developing specifications, APIs, and source code for Ultra Ethernet communications, updating existing protocols, and introducing new mechanisms for telemetry, signaling, security, and congestion management. In particular, Ultra Ethernet introduces the UEC Transport (UET) for higher network utilization and lower tail latency to speed up RDMA (Remote Direct Memory Access) operation over Ethernet. Key features include multi-path packet spraying, flexible ordering, and advanced congestion control, ensuring efficient and reliable data transfer.
These enhancements are designed to address the needs of large AI and HPC clusters — with separate profiles for each type of deployment — though everything is done in a surgical manner to enhance the technology, but reuse as much of the existing Ethernet as possible to maintain cost efficiency and interoperability.
The consortium's founding members include AMD, Arista, Broadcom, Cisco, Eviden (an Atos Business), HPE, Intel, Meta, and Microsoft. After the Ultra Ethernet Consortium (UEC) began to accept new members in October, 2023, numerous industry heavyweights have joined the group, including Baidu, Dell, Huawei, IBM, Nokia, Lenovo, Supermicro, and Tencent.
The consortium currently plans to release the initial 1.0 version of the UEC specification publicly sometime in the third quarter of 2024.
"There was always a recognition that UEC was meeting a need in the industry," said J Metz, Chair of the UEC Steering Committee. "There is a strong desire to have an open, accessible, Ethernet-based network specifically designed to accommodate AI and HPC workload requirements. This level of involvement is encouraging; it helps us achieve the goal of broad interoperability and stability."
While it is evident that then Ultra Ethernet Consortium is gaining support across the industry, it is still unclear where other industry behemoths like AWS and Google stand. While the hardware companies involved can design Ultra Ethernet support into their hardware and systems, the technology ultimately exists to serve large datacenter and HPC system operators. So it will be interesting to see what interest they take in (and how quickly they adopt) the nascent Ethernet backbone technology once hardware incorporating it is ready.
Networking
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