SK Hynix Starts Mass Production of HBM3E: 9.2 GT/s
SK Hynix said that it had started volume production of its HBM3E memory and would supply it to a customer in late March. The South Korean company is the second DRAM producer to announce mass production of HBM3E, so the market of ultra-high-performance memory will have some competition, which is good for companies that plan to use HBM3E.
According to specifications, SK Hynix's HBM3E known good stack dies (KGSDs) feature data transfer rates up to 9.2 GT/s, a 1024-bit interface, and a bandwidth of 1.18 TB/s, which is massively higher than the 6.4 GT/s and 819 GB/s offered by HBM3. The company does not say whether it mass produces 8Hi 24GB HBM3E memory modules or 12Hi 36GB HBM3E devices, but it will likely begin its HBM3E ramp from lower-capacity products as they are easier to make.
We already know that SK Hynix's HBM3E stacks employ the company's advanced Mass Reflow Molded Underfill (MR-RUF) technology, which promises to reduce heat dissipation by 10%. This technology involves the use of an enhanced underfill between DRAM layers, which not only improves heat dissipation but also reduces the thickness of HBM stacks. As a result, 12-Hi HBM stacks can be constructed that are the same height as 8-Hi modules. However, this does not necessarily imply that the stacks currently in mass production are 12-Hi HBM3E stacks.
Although the memory maker does not officially confirm this, SK Hynix's 24GB HBM3E stacks will arrive just in time to address NVIDIA's Blackwell accelerator family for artificial intelligence and high-performance computing applications.
"With the success story of the HBM business and the strong partnership with customers that it has built for years, SK Hynix will cement its position as the total AI memory provider," said Sungsoo Ryu, Head of HBM business at SK Hynix. As a result, NVIDIA will have access to HBM3E memory from multiple suppliers with both Micron and SK Hynix.
Meanwhile, AMD recently confirmed that it was looking forward to expanding its Instinct MI300-series lineup for AI and HPC applications with higher-performance memory configurations, so SK Hynix's HBM3E memory could also be used for this.
DRAM
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![](https://twitter.com/share?url=https://compbuddey.blogspot.com/2024/04/sk-hynix-starts-mass-production-of.html&text=SK Hynix Starts Mass Production of HBM3E: 9.2 GT/s <p align="center"><a href="https://www.anandtech.com/show/21311/sk-hynix-starts-mass-production-of-hbm3e-92-gts"><img src="https://images.anandtech.com/doci/21311/SK-hynix-HBM3E_01-678_575px.jpg" alt="" /></a></p><p><p>SK Hynix said that it had started volume production of its HBM3E memory and would supply it to a customer in late March. The South Korean company is the second DRAM producer to announce mass production of HBM3E, so the market of ultra-high-performance memory will have some competition, which is good for companies that plan to use HBM3E.</p>
<p>According to specifications, SK Hynix's HBM3E known good stack dies (KGSDs) feature data transfer rates up to 9.2 GT/s, a 1024-bit interface, and a bandwidth of 1.18 TB/s, which is massively higher than the 6.4 GT/s and 819 GB/s offered by HBM3. The company does not say whether it mass produces 8Hi 24GB HBM3E memory modules or 12Hi 36GB HBM3E devices, but it will likely begin its HBM3E ramp from lower-capacity products as they are easier to make.</p>
<p>We already know that SK Hynix's HBM3E stacks employ the company's advanced Mass Reflow Molded Underfill (MR-RUF) technology, which promises to reduce heat dissipation by 10%. This technology involves the use of an enhanced underfill between DRAM layers, which not only improves heat dissipation but also reduces the thickness of HBM stacks. As a result, 12-Hi HBM stacks can be constructed that are the same height as 8-Hi modules. However, this does not necessarily imply that the stacks currently in mass production are 12-Hi HBM3E stacks.</p>
<p>Although the memory maker does not officially confirm this, SK Hynix's 24GB HBM3E stacks will arrive just in time to address NVIDIA's Blackwell accelerator family for artificial intelligence and high-performance computing applications.</p>
<p>"<em>With the success story of the HBM business and the strong partnership with customers that it has built for years, SK Hynix will cement its position as the total AI memory provider,</em>" said Sungsoo Ryu, Head of HBM business at SK Hynix. As a result, NVIDIA will have access to HBM3E memory from multiple suppliers with both Micron and SK Hynix.</p>
<p>Meanwhile, AMD recently confirmed that it was looking forward to expanding its Instinct MI300-series lineup for AI and HPC applications with higher-performance memory configurations, so SK Hynix's HBM3E memory could also be used for this.</p>
</p> DRAM){kind=link}
![](https://www.pinterest.com/pin/create/button/?url=https://compbuddey.blogspot.com/2024/04/sk-hynix-starts-mass-production-of.html&media=https://lh3.googleusercontent.com/blogger_img_proxy/AEn0k_ukZV1V_v8B6OO6ZYJh_pRcnXRWWGiezVCGLo1rDBW1s_d9BpoXlw-faUK2N4WW7Z5Fcon5ZrNC0cH3afAxfVDaygmXY8qG8KO1hYaDjw-IYeNn1QIhJzP_r3ucyvg6Haie7QSckmJ6vYE5&description=SK Hynix Starts Mass Production of HBM3E: 9.2 GT/s <p align="center"><a href="https://www.anandtech.com/show/21311/sk-hynix-starts-mass-production-of-hbm3e-92-gts"><img src="https://images.anandtech.com/doci/21311/SK-hynix-HBM3E_01-678_575px.jpg" alt="" /></a></p><p><p>SK Hynix said that it had started volume production of its HBM3E memory and would supply it to a customer in late March. The South Korean company is the second DRAM producer to announce mass production of HBM3E, so the market of ultra-high-performance memory will have some competition, which is good for companies that plan to use HBM3E.</p>
<p>According to specifications, SK Hynix's HBM3E known good stack dies (KGSDs) feature data transfer rates up to 9.2 GT/s, a 1024-bit interface, and a bandwidth of 1.18 TB/s, which is massively higher than the 6.4 GT/s and 819 GB/s offered by HBM3. The company does not say whether it mass produces 8Hi 24GB HBM3E memory modules or 12Hi 36GB HBM3E devices, but it will likely begin its HBM3E ramp from lower-capacity products as they are easier to make.</p>
<p>We already know that SK Hynix's HBM3E stacks employ the company's advanced Mass Reflow Molded Underfill (MR-RUF) technology, which promises to reduce heat dissipation by 10%. This technology involves the use of an enhanced underfill between DRAM layers, which not only improves heat dissipation but also reduces the thickness of HBM stacks. As a result, 12-Hi HBM stacks can be constructed that are the same height as 8-Hi modules. However, this does not necessarily imply that the stacks currently in mass production are 12-Hi HBM3E stacks.</p>
<p>Although the memory maker does not officially confirm this, SK Hynix's 24GB HBM3E stacks will arrive just in time to address NVIDIA's Blackwell accelerator family for artificial intelligence and high-performance computing applications.</p>
<p>"<em>With the success story of the HBM business and the strong partnership with customers that it has built for years, SK Hynix will cement its position as the total AI memory provider,</em>" said Sungsoo Ryu, Head of HBM business at SK Hynix. As a result, NVIDIA will have access to HBM3E memory from multiple suppliers with both Micron and SK Hynix.</p>
<p>Meanwhile, AMD recently confirmed that it was looking forward to expanding its Instinct MI300-series lineup for AI and HPC applications with higher-performance memory configurations, so SK Hynix's HBM3E memory could also be used for this.</p>
</p> DRAM){kind=link}
![](https://web.whatsapp.com/send?text=SK Hynix Starts Mass Production of HBM3E: 9.2 GT/s <p align="center"><a href="https://www.anandtech.com/show/21311/sk-hynix-starts-mass-production-of-hbm3e-92-gts"><img src="https://images.anandtech.com/doci/21311/SK-hynix-HBM3E_01-678_575px.jpg" alt="" /></a></p><p><p>SK Hynix said that it had started volume production of its HBM3E memory and would supply it to a customer in late March. The South Korean company is the second DRAM producer to announce mass production of HBM3E, so the market of ultra-high-performance memory will have some competition, which is good for companies that plan to use HBM3E.</p>
<p>According to specifications, SK Hynix's HBM3E known good stack dies (KGSDs) feature data transfer rates up to 9.2 GT/s, a 1024-bit interface, and a bandwidth of 1.18 TB/s, which is massively higher than the 6.4 GT/s and 819 GB/s offered by HBM3. The company does not say whether it mass produces 8Hi 24GB HBM3E memory modules or 12Hi 36GB HBM3E devices, but it will likely begin its HBM3E ramp from lower-capacity products as they are easier to make.</p>
<p>We already know that SK Hynix's HBM3E stacks employ the company's advanced Mass Reflow Molded Underfill (MR-RUF) technology, which promises to reduce heat dissipation by 10%. This technology involves the use of an enhanced underfill between DRAM layers, which not only improves heat dissipation but also reduces the thickness of HBM stacks. As a result, 12-Hi HBM stacks can be constructed that are the same height as 8-Hi modules. However, this does not necessarily imply that the stacks currently in mass production are 12-Hi HBM3E stacks.</p>
<p>Although the memory maker does not officially confirm this, SK Hynix's 24GB HBM3E stacks will arrive just in time to address NVIDIA's Blackwell accelerator family for artificial intelligence and high-performance computing applications.</p>
<p>"<em>With the success story of the HBM business and the strong partnership with customers that it has built for years, SK Hynix will cement its position as the total AI memory provider,</em>" said Sungsoo Ryu, Head of HBM business at SK Hynix. As a result, NVIDIA will have access to HBM3E memory from multiple suppliers with both Micron and SK Hynix.</p>
<p>Meanwhile, AMD recently confirmed that it was looking forward to expanding its Instinct MI300-series lineup for AI and HPC applications with higher-performance memory configurations, so SK Hynix's HBM3E memory could also be used for this.</p>
</p> DRAM | https://compbuddey.blogspot.com/2024/04/sk-hynix-starts-mass-production-of.html){kind=link}
![](mailto:?subject=SK Hynix Starts Mass Production of HBM3E: 9.2 GT/s <p align="center"><a href="https://www.anandtech.com/show/21311/sk-hynix-starts-mass-production-of-hbm3e-92-gts"><img src="https://images.anandtech.com/doci/21311/SK-hynix-HBM3E_01-678_575px.jpg" alt="" /></a></p><p><p>SK Hynix said that it had started volume production of its HBM3E memory and would supply it to a customer in late March. The South Korean company is the second DRAM producer to announce mass production of HBM3E, so the market of ultra-high-performance memory will have some competition, which is good for companies that plan to use HBM3E.</p>
<p>According to specifications, SK Hynix's HBM3E known good stack dies (KGSDs) feature data transfer rates up to 9.2 GT/s, a 1024-bit interface, and a bandwidth of 1.18 TB/s, which is massively higher than the 6.4 GT/s and 819 GB/s offered by HBM3. The company does not say whether it mass produces 8Hi 24GB HBM3E memory modules or 12Hi 36GB HBM3E devices, but it will likely begin its HBM3E ramp from lower-capacity products as they are easier to make.</p>
<p>We already know that SK Hynix's HBM3E stacks employ the company's advanced Mass Reflow Molded Underfill (MR-RUF) technology, which promises to reduce heat dissipation by 10%. This technology involves the use of an enhanced underfill between DRAM layers, which not only improves heat dissipation but also reduces the thickness of HBM stacks. As a result, 12-Hi HBM stacks can be constructed that are the same height as 8-Hi modules. However, this does not necessarily imply that the stacks currently in mass production are 12-Hi HBM3E stacks.</p>
<p>Although the memory maker does not officially confirm this, SK Hynix's 24GB HBM3E stacks will arrive just in time to address NVIDIA's Blackwell accelerator family for artificial intelligence and high-performance computing applications.</p>
<p>"<em>With the success story of the HBM business and the strong partnership with customers that it has built for years, SK Hynix will cement its position as the total AI memory provider,</em>" said Sungsoo Ryu, Head of HBM business at SK Hynix. As a result, NVIDIA will have access to HBM3E memory from multiple suppliers with both Micron and SK Hynix.</p>
<p>Meanwhile, AMD recently confirmed that it was looking forward to expanding its Instinct MI300-series lineup for AI and HPC applications with higher-performance memory configurations, so SK Hynix's HBM3E memory could also be used for this.</p>
</p> DRAM&body=https://compbuddey.blogspot.com/2024/04/sk-hynix-starts-mass-production-of.html){kind=link}
At FMS 2024, the technological requirements from the storage and memory subsystem took center stage. Both SSD and controller vendors had various demonstrations touting their suitability for different stages of the AI data pipeline - ingestion, preparation, training, checkpointing, and inference. Vendors like Solidigm have different types of SSDs optimized for different stages of the pipeline. At the same time, controller vendors have taken advantage of one of the features introduced recently in the NVM Express standard - Flexible Data Placement (FDP).
FDP involves the host providing information / hints about the areas where the controller could place the incoming write data in order to reduce the write amplification. These hints are generated based on specific block sizes advertised by the device. The feature is completely backwards-compatible, with non-FDP hosts working just as before with FDP-enabled SSDs, and vice-versa.
Silicon Motion's MonTitan Gen 5 Enterprise SSD Platform was announced back in 2022. Since then, Silicon Motion has been touting the flexibility of the platform, allowing its customers to incorporate their own features as part of the customization process. This approach is common in the enterprise space, as we have seen with Marvell's Bravera SC5 SSD controller in the DapuStor SSDs and Microchip's Flashtec controllers in the Longsys FORESEE enterprise SSDs.
At FMS 2024, the company was demonstrating the advantages of flexible data placement by allowing a single QLC SSD based on their MonTitan platform to take part in different stages of the AI data pipeline while maintaining the required quality of service (minimum bandwidth) for each process. The company even has a trademarked name (PerformaShape) for the firmware feature in the controller that allows the isolation of different concurrent SSD accesses (from different stages in the AI data pipeline) to guarantee this QoS. Silicon Motion claims that this scheme will enable its customers to get the maximum write performance possible from QLC SSDs without negatively impacting the performance of other types of accesses.
Silicon Motion and Phison have market leadership in the client SSD controller market with similar approaches. However, their enterprise SSD controller marketing couldn't be more different. While Phison has gone in for a turnkey solution with their Gen 5 SSD platform (to the extent of not adopting the white label route for this generation, and instead opting to get the SSDs qualified with different cloud service providers themselves), Silicon Motion is opting for a different approach. The flexibility and customization possibilities can make platforms like the MonTitan appeal to flash array vendors.
Storage
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