Rapidus to Get $3.9 Billion in Government Aid for 2nm, Multi-Chiplet Technologies <a href="https://www.anandtech.com/show/21332/rapidus-to-get-39-billion-in-government-aid-for-2nm-multichiplet-technologies"><img src="https://images.anandtech.com/doci/21332/intel-foundry-wafer-semiconductor-fab-ifs-678_575px.jpg" alt="" /></a>Rapidus, a Japan-based company developing 2nm process technology and aiming to commercialize it in 2027, will receive a huge government grant for its ongoing projects. The Japanese government will support Rapidus with subsidies totaling ¥590 billion yen ($3.89 billion). In addition to developing its 2nm production node and spending on cleanroom equipment, Rapidus will also fund the development of multi-chiplet packaging technology. This extra funding will significantly help the company's ambitious plans. With the government's total support now at ¥920 billion ($6.068 billion), Rapidus is getting a solid push to become a significant player in the semiconductor industry. The whole project is expected to cost around ¥5 trillion ($32.983 billion), so the funding is not quite there yet. Meanwhile, the company may get enough financing with support from the Japanese government and large Japanese conglomerates like Toyota Motor and Nippon Telegraph and Telephone. According to Atsuyoshi Koike, Rapidus's chief executive, the company is on track to start testing its production by April 2025 and aims to begin large-scale production by 2027. Commercial production of 2nm chips is set to commence sometime in 2025. In addition to developing its 2nm fabrication process in collaboration with IBM and building its manufacturing facility, Rapidus is also working on advanced packaging technology for multi-chiplet system-in-packages (SiPs). The latest government subsidies include more than ¥50 billion ($329.85 million) for research and development in this area, the first time Japan has provided subsidies for such technologies. It is noteworthy that Rapidus will use a section of Seiko Epson Corporation's Chitose Plant (located in Chitose City, Hokkaido) for its back-end packaging processes. This plant is near the company's fab, which is currently being built in Bibi World, an industrial park in Chitose City. This space will be dedicated to pilot-stage research and development activities. Sources: <a href="https://www.rapidus.inc/news_topics/information/nedo-approves-rapidus-fy2024-plan-and-budget-for-research-and-development-of-2nm-generation-semiconductor-integration-technology-and-short-tat-manufacturing-technology-based-on-japan-us-col/">Rapidus</a>, <a href="https://asia.nikkei.com/Business/Tech/Semiconductors/Japan-chipmaker-Rapidus-to-receive-3.9bn-more-in-government-aid">Nikkei</a> Semiconductors

AMD Launching New CPUs for AM4: Ryzen 5000XT Series Coming in July <p align="center"><a href="https://www.anandtech.com/show/21420/amd-launching-new-cpus-for-am4-ryzen-5000xt-series-coming-in-july"><img src="https://images.anandtech.com/doci/21420/1 Carou_678x452_575px.jpg" alt="" /></a></p><p><p>During their opening keynote at Computex 2024, AMD announced their intention to launch a pair of new Ryzen 5000 processors for their legacy AM4 platform. The new chips, both getting the <em>XT</em> suffix, will be the Ryzen 9 5900XT, a 16 core Zen 3 part, while the Ryzen 7 5800XT will be an 8 core Zen 3.</p>

<p>The new chips are intended to underscore AMD's ongoing commitment to supporting their consumer platforms over several years. And while the specification changes are rather minor overall – the Zen 3 CPU architecture has long since been taken as far as it can reasonable go – it does give AMD a chance to refresh the platform by slinging hardware at new price points. AMD did something very similar for the Ryzen 3000 generation with the late-model <a href="https://www.anandtech.com/show/15897/new-amd-ryzen-3000xt-processors-available-today">Ryzen 3000 XT chips</a>.</p>

<table border="0" style="text-align:center" width="95%">
<tbody>
<tr class="tgrey">
<td colspan="7">AMD Ryzen 5000XT Series Processors<br />
(Zen 3)</td>
</tr>
<tr class="tlblue">
<td><i>AnandTech</i></td>
<td>Cores /<br />
Threads</td>
<td>Base<br />
Freq</td>
<td>Turbo<br />
Freq</td>
<td>L2<br />
Cache</td>
<td>L3<br />
Cache</td>
<td>TDP</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 9 5950X</td>
<td>16C / 32T</td>
<td>3.4 GHz</td>
<td>4.9 GHz</td>
<td>8 MB</td>
<td>64 MB</td>
<td>105 W</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 9 5900XT</td>
<td>16C / 32T</td>
<td>3.3 GHz</td>
<td>4.8 GHz</td>
<td>8 MB</td>
<td>64 MB</td>
<td>105 W</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 9 5900X</td>
<td>12C / 24T</td>
<td>3.7 GHz</td>
<td>4.8 GHz</td>
<td>6 MB</td>
<td>64 MB</td>
<td>105 W</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 7 5800XT</td>
<td>8C / 16T</td>
<td>3.8 GHz</td>
<td>4.8 GHz</td>
<td>4 MB</td>
<td>32 MB</td>
<td>105 W</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 7 5800X</td>
<td>8C / 16T</td>
<td>3.8 GHz</td>
<td>4.7 GHz</td>
<td>4 MB</td>
<td>32 MB</td>
<td>105 W</td>
</tr>
</tbody>
</table>

<p>We've dedicated <a href="https://www.anandtech.com/show/16214/amd-zen-3-ryzen-deep-dive-review-5950x-5900x-5800x-and-5700x-tested">many column inches covering Zen 3 and the Ryzen 5000 series since they launched in late 2020</a>, so there isn't anything new to add here. Zen 3 is no longer AMD's latest and greatest, but the platform as a whole is quite cheap to produce, making it a viable budget offering for new builds, or offering one last upgrade for old builds.</p>

<p>The Ryzen 9 5900XT is a 16 core part, and isn't to be confused with the Ryzen 9 5900X, which is a 12 core part. It ships with a peak turbo clockspeed of 4.8GHz, 100 MHz lower than the top-tier Ryzen 9 5950X. This makes it's XT designation somewhat of a misnomer compared to previous generations of XT chips, although it's clear that AMD has boxed themselves into a corner with their naming scheme, as they both need a way to designate that this is a new chip, and yet still place it below the 5950X.</p>

<p align="center"><a href="https://www.anandtech.com/show/21420/amd-launching-new-cpus-for-am4-ryzen-5000xt-series-coming-in-july"><img alt="" src="https://images.anandtech.com/doci/21420/AMD%20COMPUTEX%20CLIENT%20PRESS%20DECK-01-01%20%2819%29.png" style="width: 100%;" /></a></p>

<p>Looking at the second chip, we have the Ryzen 7 5800XT. This is an 8 core part that does improve on its predecessor, offering a 4.8GHz max turbo clock that is 100MHz higher than the Ryzen 7 5800X's. Both chips otherwise share the same characteristics, including 6 MB of L2 cache and 32 MB of L3 cache, and all four of the chips – including the two new XT series and the corresponding X series chips – all come with a 105 Watt TDP.</p>

<p>In terms of motherboard compatibility, all of the AM4 motherboards that currently support the Ryzen 5000 series are also compatible with the Ryzen 5000XT series, although users are likely to need to perform a firmware update to ensure maximum compatibility; they are the same chips, but the microcodes are likely different.</p>

<p align="center"><a href="https://www.anandtech.com/show/21420/amd-launching-new-cpus-for-am4-ryzen-5000xt-series-coming-in-july"><img alt="" src="https://images.anandtech.com/doci/21420/AMD%20COMPUTEX%20CLIENT%20PRESS%20DECK-01-01%20%2820%29.png" style="width: 100%;" /></a></p>

<p>AMD has provided some gaming performance figures comparing the Ryzen 9 5900XT to Intel's 13th Gen Core i7-13700K. It does offer very modest yet marginal gains in games by up to 4%; it's not mind-blowing, but the... CPUs

AMD Launching New CPUs for AM4: Ryzen 5000XT Series Coming in July
During their opening keynote at Computex 2024, AMD announced their intention to launch a pair of new Ryzen 5000 processors for their legacy AM4 platform. The new chips, both getting the XT suffix, will be the Ryzen 9 5900XT, a 16 core Zen 3 part, while the Ryzen 7 5800XT will be an 8 core Zen 3.

The new chips are intended to underscore AMD's ongoing commitment to supporting their consumer platforms over several years. And while the specification changes are rather minor overall – the Zen 3 CPU architecture has long since been taken as far as it can reasonable go – it does give AMD a chance to refresh the platform by slinging hardware at new price points. AMD did something very similar for the Ryzen 3000 generation with the late-model Ryzen 3000 XT chips.

AMD Ryzen 5000XT Series Processors
(Zen 3)

AnandTech Cores /
Threads Base
Freq Turbo
Freq L2
Cache L3
Cache TDP

Ryzen 9 5950X 16C / 32T 3.4 GHz 4.9 GHz 8 MB 64 MB 105 W

Ryzen 9 5900XT 16C / 32T 3.3 GHz 4.8 GHz 8 MB 64 MB 105 W

Ryzen 9 5900X 12C / 24T 3.7 GHz 4.8 GHz 6 MB 64 MB 105 W

Ryzen 7 5800XT 8C / 16T 3.8 GHz 4.8 GHz 4 MB 32 MB 105 W

Ryzen 7 5800X 8C / 16T 3.8 GHz 4.7 GHz 4 MB 32 MB 105 W

We've dedicated many column inches covering Zen 3 and the Ryzen 5000 series since they launched in late 2020, so there isn't anything new to add here. Zen 3 is no longer AMD's latest and greatest, but the platform as a whole is quite cheap to produce, making it a viable budget offering for new builds, or offering one last upgrade for old builds.

The Ryzen 9 5900XT is a 16 core part, and isn't to be confused with the Ryzen 9 5900X, which is a 12 core part. It ships with a peak turbo clockspeed of 4.8GHz, 100 MHz lower than the top-tier Ryzen 9 5950X. This makes it's XT designation somewhat of a misnomer compared to previous generations of XT chips, although it's clear that AMD has boxed themselves into a corner with their naming scheme, as they both need a way to designate that this is a new chip, and yet still place it below the 5950X.

Looking at the second chip, we have the Ryzen 7 5800XT. This is an 8 core part that does improve on its predecessor, offering a 4.8GHz max turbo clock that is 100MHz higher than the Ryzen 7 5800X's. Both chips otherwise share the same characteristics, including 6 MB of L2 cache and 32 MB of L3 cache, and all four of the chips – including the two new XT series and the corresponding X series chips – all come with a 105 Watt TDP.

In terms of motherboard compatibility, all of the AM4 motherboards that currently support the Ryzen 5000 series are also compatible with the Ryzen 5000XT series, although users are likely to need to perform a firmware update to ensure maximum compatibility; they are the same chips, but the microcodes are likely different.

AMD has provided some gaming performance figures comparing the Ryzen 9 5900XT to Intel's 13th Gen Core i7-13700K. It does offer very modest yet marginal gains in games by up to 4%; it's not mind-blowing, but the... CPUs

June 08, 2024

$XPG Demos "Nia" Handheld Gaming PC With Foveated Rendering, Swappable DRAM <a href="https://www.anandtech.com/show/21432/xpg-demos-nia-handheld-gaming-pc-foveated-rendering-swappable-dram"><img src="https://images.anandtech.com/doci/21432/IMG_9822_car_575px.jpg" alt="" /></a>With the rise of the handheld gaming PC market, we've seen PC vendors and their partners toy with a number of tricks and tweaks to improve improve framerates in games, with some of their latest efforts on display at this year's Computex trade show. Perhaps the most interesting find thus far comes from ADATA sub-brand XPG, who is demoing their prototype "Nia" handheld PC, which uses eye tracking and dynamic foveated rendering to further improve their rendering performance. For those unfamiliar, dynamic foveated rendering is a graphics technique that is sometimes used to boost performance in virtual reality (VR) and augmented reality (AR) applications by taking advantage of how human vision works. Typically, humans can only perceive detailed imagery in the relatively small central area of our vision called the fovea, while our peripheral vision is much less detailed. Dynamic foveated rendering, in turn, exploits this by using real-time eye tracking to determine where the user is looking, and then rendering just that area in high/full resolution, while rendering the peripheral areas in lower resolution. The net result is that only a fraction of the screen is rendered at full detail, which cuts down on the total amount of rendering work required and boosting framerates on performance-limited devices. <a href="https://www.anandtech.com/show/21432/xpg-demos-nia-handheld-gaming-pc-foveated-rendering-swappable-dram"><img alt="" src="https://images.anandtech.com/doci/21432/IMG_9819_575px.jpg" /></a> As stated before, this technology is sometimes used in high-end AR/VR headsets, where high resolution displays are placed mere inches from one's face. This ends up being an ideal use case for the technique, since at those distances, only a small fraction of the screen is within the fovea. Using dynamic foveated rendering for a handheld, on the other hand, is a more novel application. All of the same visual principles apply, but the resolutions at play are lower, and the screen is farther from the users' eyes. This makes a handheld device a less ideal use case, at least on paper, as a larger portion of the screen is going to be in the fovea, and thus will need to be rendered at full resolution. None the less, it will be interesting to see how XPG's efforts pan out, and if dynamic foveated rendering is beneficial enough for handheld PCs. As we sometimes see with trade show demos, not everything makes it out of the prototype stage. <a href="https://www.anandtech.com/show/21432/xpg-demos-nia-handheld-gaming-pc-foveated-rendering-swappable-dram"><img alt="" src="https://images.anandtech.com/doci/21432/IMG_9823_575px.jpg" /></a> According to a press release put out by ADATA ahead of the trade show, the eye tracking technology is being provided by AMD collaborator <a href="https://beam.eyeware.tech/">Eyeware</a>. Notably, their software-based approach runs on top of standard webcams, rather than requiring IR cameras. So the camera hardware itself should be pretty straight-forward. Foveated rendering aside, XPG is making sure that the Nia won't be a one-trick pony. The handheld's other major claim to fame is its hardware swappability. The prototype handheld not only features a removable M.2-2230 SSD, but the company is also taking advantage of the recently-introduced LPCAMM2 memory module standard to introduce removable DRAM. Via a hatch in the back of the handheld, device owners would be able to swap out LPCAMM2 LPDDR5X modules for higher capacity versions. This would give the handheld an additional degree of future-proofness over current handhelds, which use non-replaceable soldered-down memory. Rounding out the package, the current prototype is based on an AMD's Zen 4 Phoenix APU, which is used across both of the company's current mobile lines (Ryzen Mobile 7000/8000 and Ryzen Z1). Meanwhile, the unit's display is adjustable, allowing it to be angled away from the body of the handheld. <a href="https://www.anandtech.com/show/21432/xpg-demos-nia-handheld-gaming-pc-foveated-rendering-swappable-dram"><img alt="" src="https://images.anandtech.com/doci/21432/IMG_9818-678-specs_575px.jpg" /></a> Assuming all goes well with the prototype, XPG aims to release a finished product in 2025. <a href="https://www.anandtech.com/show/21432/xpg-demos-nia-handheld-gaming-pc-foveated-rendering-swappable-dram"><img alt="" src="https://images.anandtech.com/doci/21432/IMG_9824_575px.jpg" /></a> ADATA$

XPG Demos "Nia" Handheld Gaming PC With Foveated Rendering, Swappable DRAM
With the rise of the handheld gaming PC market, we've seen PC vendors and their partners toy with a number of tricks and tweaks to improve improve framerates in games, with some of their latest efforts on display at this year's Computex trade show. Perhaps the most interesting find thus far comes from ADATA sub-brand XPG, who is demoing their prototype "Nia" handheld PC, which uses eye tracking and dynamic foveated rendering to further improve their rendering performance.

For those unfamiliar, dynamic foveated rendering is a graphics technique that is sometimes used to boost performance in virtual reality (VR) and augmented reality (AR) applications by taking advantage of how human vision works. Typically, humans can only perceive detailed imagery in the relatively small central area of our vision called the fovea, while our peripheral vision is much less detailed. Dynamic foveated rendering, in turn, exploits this by using real-time eye tracking to determine where the user is looking, and then rendering just that area in high/full resolution, while rendering the peripheral areas in lower resolution. The net result is that only a fraction of the screen is rendered at full detail, which cuts down on the total amount of rendering work required and boosting framerates on performance-limited devices.

As stated before, this technology is sometimes used in high-end AR/VR headsets, where high resolution displays are placed mere inches from one's face. This ends up being an ideal use case for the technique, since at those distances, only a small fraction of the screen is within the fovea.

Using dynamic foveated rendering for a handheld, on the other hand, is a more novel application. All of the same visual principles apply, but the resolutions at play are lower, and the screen is farther from the users' eyes. This makes a handheld device a less ideal use case, at least on paper, as a larger portion of the screen is going to be in the fovea, and thus will need to be rendered at full resolution. None the less, it will be interesting to see how XPG's efforts pan out, and if dynamic foveated rendering is beneficial enough for handheld PCs. As we sometimes see with trade show demos, not everything makes it out of the prototype stage.

According to a press release put out by ADATA ahead of the trade show, the eye tracking technology is being provided by AMD collaborator Eyeware. Notably, their software-based approach runs on top of standard webcams, rather than requiring IR cameras. So the camera hardware itself should be pretty straight-forward.

Foveated rendering aside, XPG is making sure that the Nia won't be a one-trick pony. The handheld's other major claim to fame is its hardware swappability. The prototype handheld not only features a removable M.2-2230 SSD, but the company is also taking advantage of the recently-introduced LPCAMM2 memory module standard to introduce removable DRAM. Via a hatch in the back of the handheld, device owners would be able to swap out LPCAMM2 LPDDR5X modules for higher capacity versions. This would give the handheld an additional degree of future-proofness over current handhelds, which use non-replaceable soldered-down memory.

Rounding out the package, the current prototype is based on an AMD's Zen 4 Phoenix APU, which is used across both of the company's current mobile lines (Ryzen Mobile 7000/8000 and Ryzen Z1). Meanwhile, the unit's display is adjustable, allowing it to be angled away from the body of the handheld.

Assuming all goes well with the prototype, XPG aims to release a finished product in 2025.

ADATA

June 25, 2024

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