AMD Quietly Launches Ryzen 7 8700F and Ryzen 5 8400F Processors
AMD has recently expanded its Ryzen 8000 series by introducing the Ryzen 7 8700F and Ryzen 5 8400F processors. Initially launched in China, these chips were added to AMD's global website, signaling they are available worldwide, apparently from April 1st. Built from the recent Zen 4-based Phoenix APUs using the TSMC 4nm node as their Zen 4 mobile chips, these new CPUs lack integrated graphics. However, the Ryzen 7 8700F does include the integrated Ryzen AI NPU for added capabilities in a world currently dominated by AI and moving it directly into the PC.
The company's decision to announce these chips in China aligns with its strategy to offer Ryzen solutions at every price point in the market. Although AMD didn't initially disclose the full specifications of these F-series models, and we did reach out to the company to ask about them, they refused to discuss them with us. Their listing on the website has now been updated with a complete list of specifications and features, with everything but the price mentioned.
| AMD Ryzen 8000G vs. Ryzen 8000F Series (Desktop) Zen 4 (Phoenix) |
|||||||||
| AnandTech | Cores/Threads | Base Freq |
Turbo Freq |
GPU | GPU Freq |
Ryzen AI (NPU) |
L3 Cache (MB) |
TDP | MSRP |
| Ryzen 7 | |||||||||
| Ryzen 7 8700G | 8/16 | 4200 | 5100 | R780M 12 CUs |
2900 | Y | 16 | 65W | $329 |
| Ryzen 7 8700F | 8/16 | 4100 | 5000 | - | - | Y | 16 | 65W | ? |
| Ryzen 5 | |||||||||
| Ryzen 5 8600G | 6/12 | 4300 | 5000 | R760M 8 CUs |
2800 | Y | 16 | 65W | $229 |
| Ryzen 5 8400F | 6/12 | 4200 | 4700 | - | - | N | 16 | 65W | ? |
The Ryzen 7 8700F features an 8C/16T design, with 16MB of L3 cache and the same 65W TDP as the Ryzen 7 8700G. Although the base clock speed is 4.1 GHz, it boosts to 5.0 GHz; this is 100 MHz less on both base/boost clocks than the 8700G. Meanwhile, the Ryzen 5 8400F is a slightly scaled-down version of the Ryzen 8600G APU, with 6C/12, 16MB of L3 cache, and again has a 100 MHz reduction to base clocks compared to the 8600G. Unlike the Ryzen 5 8400F, the Ryzen 7 8700F keeps AMD's Ryzen AI NPU, adding additional capability for generative AI.
The Ryzen 5 8400F can boost up to 4.7 GHz, 300 MHz slower than the Ryzen 5 8600G. AMD also allows overclocking for these new F-series chips, which means users could potentially boost the performance of these processors to match their G-series equivalents.
Pricing details are still pending, but to remain competitive, AMD will likely need to price these CPUs below the 8700G and 8600G, as well as the Ryzen 7 7700 and Ryzen 5 7600. These CPUs offer, albeit very limited, integrated graphics and have double the L3 cache capacity, along with higher boost clocks than the 8000F series chips, so pricing is something to consider whenever pricing becomes available.
CPUs
Posted by The Techinical Support
![TSMC to Expand Specialty Capacity by 50%, Introduce 4nm N4e Low-Power Node <p align="center"><a href="https://www.anandtech.com/show/21397/tsmc-to-expand-specialty-capacity-by-50-introduce-4nm-lowpower-node"><img src="https://images.anandtech.com/doci/21397/tsmc-semiconductor-fab-wafer-1-678_575px.jpg" alt="" /></a></p><p><p>With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity for specialty technologies by 50% by 2027. As disclosed by the company during its European Technology Symposium this week, TSMC expects to need to not only convert existing capacity to meet demands for specialty processes, but even build new (greenfield) fab space just for this purpose. One of the big drivers for this demand, in turn, will be TSMC's next specialty node: N4e, a 4nm-class ultra-low-power production node.</p>
<p>"In the past, we always did the review phase [for upcoming fabs], but for the first time in a long time at TSMC, we started building greenfield fab that will address the future specialty technology requirements," said Dr. Kevin Zhang, Senior Vice President, Business Development and Overseas Operations Office, at the event. "In the next four to five years, we actually going to grow our specialty capacity by up to 1.5x. In doing so we actually expanding the footprint of our manufacturing network to improve the resiliency of the overall fab supply chain."</p>
<p>On top of its well-known major logic nodes like N5 and N3E, TSMC also offers a suite of specialty nodes for applications such as power semiconductors, mixed analog I/O, and ultra-low-power applications (e.g. IoT). These are typically based on the company's trailing manufacturing processes, but regardless of the underlying technology, the capacity demand for these nodes is growing right alongside the demand for TSMC's major logic nodes. All of which has required TSMC to reevaluate how they go about planning for capacity on their specialty nodes.</p>
<p>TSMC's expansion strategy in the recent years has pursued several goals. One of them has been to build new fabs outside of Taiwan; another has been to generally expand production capacity to meet future demand for all types of process technologies – which is why the company is building up capacity for specialty nodes.</p>
<p>At present, TSMC's most advanced specialty node is N6e, an N7/N6 variant that supports operating voltages between 0.4V and 0.9V. With N4e, TSMC is looking at voltages below 0.4V. Though for now, TSMC is not disclosing much in the way of technical details for the planned node; given the company's history here, we expect they'll have more to talk about next year once the new process is ready.</p>
</p> Semiconductors](https://lh3.googleusercontent.com/blogger_img_proxy/AEn0k_t_RMZ_g73mvwpy6dTjyr2OjpXwo_T2aWPnQvX7HSxiesIkLqvXNptcXtAvX_mYs9Dub1UfvFgKw5tzWKM0cNXL093_mfsZr3f03rqF9vv0We_5Yt1fpjsrDQ3rHHEyb9wJKw8G8D-i7AkJF417Ja0FCztMh2nsUw=w72-h72-p-k-no-nu)
ASMedia Preps USB4 v2 Controller and PHY 
The USB Implementers Forum (USB-IF) introduced USB4 version 2.0 in fall 2022, and it expects systems and devices with the tech to emerge later this year and into next year. These upcoming products will largely rely on Intel's Barlow Ridge controller, a full-featured Thunderbolt 5 controller that goes above and beond the baseline USB4 v2 spec. And though extremely capable, Intel's Thunderbolt controllers are also quite expensive, and Barlow Ridge isn't expected to be any different. Fortunately, for system and device vendors that just need a basic USB4 v2 solution, ASMedia is also working on its own USB4 v2 controller.
At Computex 2024, ASMedia demonstrated a prototype of its upcoming USB4 v2 physical interface (PHY), which will support USB4 v2's new Gen 4 (160Gbps) data rates and the associated PAM-3 signal encoding. The prototype was implemented using an FPGA, as the company yet has to tape out the completed controller.
Ultimately, the purpose of showing off a FPGA-based PHY at Computex was to allow ASMedia to demonstrate their current PHY design. With the shift to PAM-3 encoding for USB4 v2, ASMedia (and the rest of the USB ecosystem) must develop significantly more complex controllers – and there's no part of that more critical than a solid and reliable PHY design.
As part of their demonstration, ASMedia had a classic eye diagram display. The eye diagram demoed has a clear opening in the center, which is indicative of good signal integrity, as the larger the eye opening, the less distortion and noise in the signal. The horizontal width of the eye opening represents the time window in which the signal can be sampled correctly, so the relatively narrow horizontal spread of the eye opening suggests that there is minimal jitter, meaning the signal transitions are consistent and predictable. Finally, the vertical height of the eye opening indicates the signal amplitude and the rather tall eye opening suggests a higher signal-to-noise ratio (SNR), meaning that the signal is strong compared to any noise present.
ASMedia itself is one of the major suppliers for discrete USB controllers, so the availability of ASMedia's USB4 v2 chip is crucial for adoption of the standard in general. While Intel will spearhead the industry with their Barlow Ridge Thunderbolt 5/USB4 v2 controller, ASMedia's controller is poised to end up in a far larger range of devices. So the importance of the company's USB4 v2 PHY demo is hard to overstate.
Demos aside, ASMedia is hoping to tape the chip out soon. If all goes well, the company expects their first USB4 v2 controllers to hit the market some time in the second half of 2025.
Peripherals
ASMedia Preps USB4 v2 Controller and PHY
The USB Implementers Forum (USB-IF) introduced USB4 version 2.0 in fall 2022, and it expects systems and devices with the tech to emerge later this year and into next year. These upcoming products will largely rely on Intel's Barlow Ridge controller, a full-featured Thunderbolt 5 controller that goes above and beond the baseline USB4 v2 spec. And though extremely capable, Intel's Thunderbolt controllers are also quite expensive, and Barlow Ridge isn't expected to be any different. Fortunately, for system and device vendors that just need a basic USB4 v2 solution, ASMedia is also working on its own USB4 v2 controller.
At Computex 2024, ASMedia demonstrated a prototype of its upcoming USB4 v2 physical interface (PHY), which will support USB4 v2's new Gen 4 (160Gbps) data rates and the associated PAM-3 signal encoding. The prototype was implemented using an FPGA, as the company yet has to tape out the completed controller.
Ultimately, the purpose of showing off a FPGA-based PHY at Computex was to allow ASMedia to demonstrate their current PHY design. With the shift to PAM-3 encoding for USB4 v2, ASMedia (and the rest of the USB ecosystem) must develop significantly more complex controllers – and there's no part of that more critical than a solid and reliable PHY design.
As part of their demonstration, ASMedia had a classic eye diagram display. The eye diagram demoed has a clear opening in the center, which is indicative of good signal integrity, as the larger the eye opening, the less distortion and noise in the signal. The horizontal width of the eye opening represents the time window in which the signal can be sampled correctly, so the relatively narrow horizontal spread of the eye opening suggests that there is minimal jitter, meaning the signal transitions are consistent and predictable. Finally, the vertical height of the eye opening indicates the signal amplitude and the rather tall eye opening suggests a higher signal-to-noise ratio (SNR), meaning that the signal is strong compared to any noise present.
ASMedia itself is one of the major suppliers for discrete USB controllers, so the availability of ASMedia's USB4 v2 chip is crucial for adoption of the standard in general. While Intel will spearhead the industry with their Barlow Ridge Thunderbolt 5/USB4 v2 controller, ASMedia's controller is poised to end up in a far larger range of devices. So the importance of the company's USB4 v2 PHY demo is hard to overstate.
Demos aside, ASMedia is hoping to tape the chip out soon. If all goes well, the company expects their first USB4 v2 controllers to hit the market some time in the second half of 2025.
Peripherals
Realtek Outlines SSD Controller Roadmap: High-End PCIe 5.0 x4 Platform in the Works 
While Realtek is best known in the enthusiast space for for its peripheral controllers such as audio codecs and network controllers, the company also has a small-but-respectable SSD controller business that tends to fly under the radar due to its focus on entry-level and mainstream drives. But Realtek's stature in the SSD space is on the rise, as the company is not only planning new PCIe Gen5 SSD controllers, but also their first high-end, DRAM-equipped SSD controller.
For this year's Computex trade show, Realtek laid out a new SSD controller roadmap that calls for the company to release a trio of new SSD controllers over the next couple of years. First up is a new four-channel entry-level PCIe 4.0 controller, the RTS5776DL, which will be joined a bit later by a PCIe 5.0 variant, the RTS5781DL. But most interesting on Realtek's new roadmap is the final chip being planned: the eight-channel, DRAM-equipped RTS5782, which would be the company's first high-end SSD controller, capable of hitting sequential read rates as high as 14GB/second.
| Realtek NVMe SSD Controller Comparison | |||||||||
| RTS5782 | RTS5781DL | RTS5776DL | RTS5772DL | RTS5766DL | |||||
| Market Segment | High-End | Mainstream | Entry-Level | ||||||
| Error Correction | 4K LDPC | 2K LDPC | |||||||
| DRAM | DDR4, LPDDR4(X) | No | No | No | No | ||||
| Host Interface | PCIe 5.0 x4 | PCIe 5.0 x4 | PCIe 4.0 x4 | PCIe 4.0 x4 | PCIe 3.0 x4 | ||||
| NVMe Version | NVMe 2.0 | NVMe 2.0 | NVMe 2.0 | NVMe 1.4 | NVMe 1.4 | ||||
| NAND Channels, Interface Speed | 8 ch, 3600 MT/s |
4 ch, 3600 MT/s |
4 ch, 3600 MT/s |
8 ch, 1600 MT/s |
4 ch, 1200 MT/s |
||||
| Sequential Read | 14 GB/s | 10 GB/s | 7.4 GB/s | 6 GB/s | 3.2 GB/s | ||||
| Sequential Write | 12 GB/s | 10 GB/s | 7.4 GB/s | 6 GB/s | 2.2 GB/s | ||||
| 4KB Random Read IOPS | 2500k | 1400k | 1200k | - | - | ||||
| 4KB Random Write IOPS | 2500k | 1400k | 1200k | - | - | ||||
Diving a bit deeper into Realtek's roadmap, the RTS5776DL is traditional DRAM-less PCIe Gen4 x4 controller with four NAND chann... SSDs
Samsung's 128 TB-Class BM1743 Enterprise SSD Displayed at FMS 2024 
Samsung had quietly launched its BM1743 enterprise QLC SSD last month with a hefty 61.44 TB SKU. At FMS 2024, the company had the even larger 122.88 TB version of that SSD on display, alongside a few recorded benchmarking sessions. Compared to the previous generation, the BM1743 comes with a 4.1x improvement in I/O performance, improvement in data retention, and a 45% improvement in power efficiency for sequential writes.
The 128 TB-class QLC SSD boasts of sequential read speeds of 7.5 GBps and write speeds of 3 GBps. Random reads come in at 1.6 M IOPS, while 16 KB random writes clock in at 45K IOPS. Based on the quoted random write access granularity, it appears that Samsung is using a 16 KB indirection unit (IU) to optimize flash management. This is similar to the strategy adopted by Solidigm with IUs larger than 4K in their high-capacity SSDs.
A recorded benchmark session on the company's PM9D3a 8-channel Gen 5 SSD was also on display.
The SSD family is being promoted as a mainstream option for datacenters, and boasts of sequential reads up to 12 GBps and writes up to 6.8 GBps. Random reads clock in at 2 M IOPS, and random writes at 400 K IOPS.
Available in multiple form-factors up to 32 TB (M.2 tops out at 2 TB), the drive's firmware includes optional support for flexible data placement (FDP) to help address the write amplification aspect.
The PM1753 is the current enterprise SSD flagship in Samsung's lineup. With support for 16 NAND channels and capacities up to 32 TB, this U.2 / E3.S SSD has advertised sequential read and write speeds of 14.8 GBps and 11 GBps respectively. Random reads and writes for 4 KB accesses are listed at 3.4 M and 600 K IOPS.
Samsung claims a 1.7x performance improvement and a 1.7x power efficiency improvement over the previous generation (PM1743), making this TLC SSD suitable for AI servers.
The 9th Gen. V-NAND wafer was also available for viewing, though photography was prohibited. Mass production of this flash memory began in April 2024.
Storage
Kioxia Demonstrates Optical Interface SSDs for Data Centers 
A few years back, the Japanese government's New Energy and Industrial Technology Development Organization (NEDO ) allocated funding for the development of green datacenter technologies. With the aim to obtain up to 40% savings in overall power consumption, several Japanese companies have been developing an optical interface for their enterprise SSDs. And at this year's FMS, Kioxia had their optical interface on display.
For this demonstration, Kioxia took its existing CM7 enterprise SSD and created an optical interface for it. A PCIe card with on-board optics developed by Kyocera is installed in the server slot. An optical interface allows data transfer over long distances (it was 40m in the demo, but Kioxia promises lengths of up to 100m for the cable in the future). This allows the storage to be kept in a separate room with minimal cooling requirements compared to the rack with the CPUs and GPUs. Disaggregation of different server components will become an option as very high throughput interfaces such as PCIe 7.0 (with 128 GT/s rates) become available.
The demonstration of the optical SSD showed a slight loss in IOPS performance, but a significant advantage in the latency metric over the shipping enterprise SSD behind a copper network link. Obviously, there are advantages in wiring requirements and signal integrity maintenance with optical links.
Being a proof-of-concept demonstration, we do see the requirement for an industry-standard approach if this were to gain adoption among different datacenter vendors. The PCI-SIG optical workgroup will need to get its act together soon to create a standards-based approach to this problem.
Storage
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling 
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
![](https://twitter.com/share?url=https://compbuddey.blogspot.com/2024/04/amd-quietly-launches-ryzen-7-8700f-and_30.html&text=AMD Quietly Launches Ryzen 7 8700F and Ryzen 5 8400F Processors <p align="center"><a href="https://www.anandtech.com/show/21348/amd-quietly-launches-ryzen-7-8700f-and-ryzen-5-8400f-processors"><img src="https://images.anandtech.com/doci/21348/upb9b2u8fKkAyCpt8EUHqf-970-80ddddd_575px.jpg" alt="" /></a></p><p><p>AMD has recently expanded its Ryzen 8000 series by introducing the Ryzen 7 8700F and Ryzen 5 8400F processors. Initially launched in China, these chips were added to AMD's global website, signaling they are available worldwide, apparently from April 1st. Built from the recent Zen 4-based Phoenix APUs using the TSMC 4nm node as their Zen 4 mobile chips, these new CPUs lack integrated graphics. However, the Ryzen 7 8700F does include the integrated Ryzen AI NPU for added capabilities in a world currently dominated by AI and moving it directly into the PC.</p>
<p>The company's decision to announce these chips in China aligns with its strategy to offer Ryzen solutions at every price point in the market. Although AMD didn't initially disclose the full specifications of these F-series models, and we did reach out to the company to ask about them, they refused to discuss them with us. Their listing on the website has now been updated with a complete list of specifications and features, with everything but the price mentioned.</p>
<table border="0" style="text-align:center" width="100%">
<tbody>
<tr class="tgrey">
<td colspan="10">AMD Ryzen 8000G vs. Ryzen 8000F Series (Desktop)<br />
Zen 4 (Phoenix)</td>
</tr>
<tr class="tlblue">
<td><em>AnandTech</em></td>
<td>Cores/Threads</td>
<td>Base<br />
Freq</td>
<td>Turbo<br />
Freq</td>
<td>GPU</td>
<td>GPU<br />
Freq</td>
<td>Ryzen AI<br />
(NPU)</td>
<td>L3 Cache<br />
(MB)</td>
<td>TDP</td>
<td>MSRP</td>
</tr>
<tr>
<td class="tlgrey" colspan="10">Ryzen 7</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 7 8700G</td>
<td>8/16</td>
<td>4200</td>
<td>5100</td>
<td>R780M<br />
12 CUs</td>
<td>2900</td>
<td>Y</td>
<td>16</td>
<td>65W</td>
<td>$329</td>
</tr>
<tr>
<td class="tlgrey"><strong>Ryzen 7 8700F</strong></td>
<td><strong>8/16</strong></td>
<td><strong>4100</strong></td>
<td><strong>5000</strong></td>
<td><strong>-</strong></td>
<td><strong>-</strong></td>
<td><strong>Y</strong></td>
<td><strong>16</strong></td>
<td><strong>65W</strong></td>
<td><strong>?</strong></td>
</tr>
<tr>
<td class="tlgrey" colspan="10">Ryzen 5</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 5 8600G</td>
<td>6/12</td>
<td>4300</td>
<td>5000</td>
<td>R760M<br />
8 CUs</td>
<td>2800</td>
<td>Y</td>
<td>16</td>
<td>65W</td>
<td>$229</td>
</tr>
<tr>
<td class="tlgrey"><strong>Ryzen 5 8400F</strong></td>
<td><strong>6/12</strong></td>
<td><strong>4200</strong></td>
<td><strong>4700</strong></td>
<td><strong>-</strong></td>
<td><strong>-</strong></td>
<td><strong>N</strong></td>
<td><strong>16</strong></td>
<td><strong>65W</strong></td>
<td><strong>?</strong></td>
</tr>
</tbody>
</table>
<p>The Ryzen 7 8700F features an 8C/16T design, with 16MB of L3 cache and the same 65W TDP as the Ryzen 7 8700G. Although the base clock speed is 4.1 GHz, it boosts to 5.0 GHz; this is 100 MHz less on both base/boost clocks than the 8700G. Meanwhile, the Ryzen 5 8400F is a slightly scaled-down version of the Ryzen 8600G APU, with 6C/12, 16MB of L3 cache, and again has a 100 MHz reduction to base clocks compared to the 8600G. Unlike the Ryzen 5 8400F, the Ryzen 7 8700F keeps AMD's Ryzen AI NPU, adding additional capability for generative AI. </p>
<p>The Ryzen 5 8400F can boost up to 4.7 GHz, 300 MHz slower than the Ryzen 5 8600G. AMD also allows overclocking for these new F-series chips, which means users could potentially boost the performance of these processors to match their G-series equivalents.</p>
<p>Pricing details are still pending, but to remain competitive, AMD will likely need to price these CPUs below the 8700G and 8600G, as well as the Ryzen 7 7700 and Ryzen 5 7600. These CPUs offer, albeit very limited, integrated graphics and have double the L3 cache capacity, along with higher boost clocks than the 8000F series chips, so pricing is something to consider whenever pricing becomes available.</p>
</p> CPUs){kind=link}
![](https://www.pinterest.com/pin/create/button/?url=https://compbuddey.blogspot.com/2024/04/amd-quietly-launches-ryzen-7-8700f-and_30.html&media=https://lh3.googleusercontent.com/blogger_img_proxy/AEn0k_t7rANysnqVxah4s547ujGxf3HpUiDTdA1d5Cm6Pwe6inupnHtiIC4vw9g8EssoM6ThDWSf_hf3xOzzUQPcHD5tQx0SF24-eJylcuhsf6l4AuqTc8KSKFKA5ifPwA92xr7Gzr1Vlif-G1BkrrPeuoWfpg&description=AMD Quietly Launches Ryzen 7 8700F and Ryzen 5 8400F Processors <p align="center"><a href="https://www.anandtech.com/show/21348/amd-quietly-launches-ryzen-7-8700f-and-ryzen-5-8400f-processors"><img src="https://images.anandtech.com/doci/21348/upb9b2u8fKkAyCpt8EUHqf-970-80ddddd_575px.jpg" alt="" /></a></p><p><p>AMD has recently expanded its Ryzen 8000 series by introducing the Ryzen 7 8700F and Ryzen 5 8400F processors. Initially launched in China, these chips were added to AMD's global website, signaling they are available worldwide, apparently from April 1st. Built from the recent Zen 4-based Phoenix APUs using the TSMC 4nm node as their Zen 4 mobile chips, these new CPUs lack integrated graphics. However, the Ryzen 7 8700F does include the integrated Ryzen AI NPU for added capabilities in a world currently dominated by AI and moving it directly into the PC.</p>
<p>The company's decision to announce these chips in China aligns with its strategy to offer Ryzen solutions at every price point in the market. Although AMD didn't initially disclose the full specifications of these F-series models, and we did reach out to the company to ask about them, they refused to discuss them with us. Their listing on the website has now been updated with a complete list of specifications and features, with everything but the price mentioned.</p>
<table border="0" style="text-align:center" width="100%">
<tbody>
<tr class="tgrey">
<td colspan="10">AMD Ryzen 8000G vs. Ryzen 8000F Series (Desktop)<br />
Zen 4 (Phoenix)</td>
</tr>
<tr class="tlblue">
<td><em>AnandTech</em></td>
<td>Cores/Threads</td>
<td>Base<br />
Freq</td>
<td>Turbo<br />
Freq</td>
<td>GPU</td>
<td>GPU<br />
Freq</td>
<td>Ryzen AI<br />
(NPU)</td>
<td>L3 Cache<br />
(MB)</td>
<td>TDP</td>
<td>MSRP</td>
</tr>
<tr>
<td class="tlgrey" colspan="10">Ryzen 7</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 7 8700G</td>
<td>8/16</td>
<td>4200</td>
<td>5100</td>
<td>R780M<br />
12 CUs</td>
<td>2900</td>
<td>Y</td>
<td>16</td>
<td>65W</td>
<td>$329</td>
</tr>
<tr>
<td class="tlgrey"><strong>Ryzen 7 8700F</strong></td>
<td><strong>8/16</strong></td>
<td><strong>4100</strong></td>
<td><strong>5000</strong></td>
<td><strong>-</strong></td>
<td><strong>-</strong></td>
<td><strong>Y</strong></td>
<td><strong>16</strong></td>
<td><strong>65W</strong></td>
<td><strong>?</strong></td>
</tr>
<tr>
<td class="tlgrey" colspan="10">Ryzen 5</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 5 8600G</td>
<td>6/12</td>
<td>4300</td>
<td>5000</td>
<td>R760M<br />
8 CUs</td>
<td>2800</td>
<td>Y</td>
<td>16</td>
<td>65W</td>
<td>$229</td>
</tr>
<tr>
<td class="tlgrey"><strong>Ryzen 5 8400F</strong></td>
<td><strong>6/12</strong></td>
<td><strong>4200</strong></td>
<td><strong>4700</strong></td>
<td><strong>-</strong></td>
<td><strong>-</strong></td>
<td><strong>N</strong></td>
<td><strong>16</strong></td>
<td><strong>65W</strong></td>
<td><strong>?</strong></td>
</tr>
</tbody>
</table>
<p>The Ryzen 7 8700F features an 8C/16T design, with 16MB of L3 cache and the same 65W TDP as the Ryzen 7 8700G. Although the base clock speed is 4.1 GHz, it boosts to 5.0 GHz; this is 100 MHz less on both base/boost clocks than the 8700G. Meanwhile, the Ryzen 5 8400F is a slightly scaled-down version of the Ryzen 8600G APU, with 6C/12, 16MB of L3 cache, and again has a 100 MHz reduction to base clocks compared to the 8600G. Unlike the Ryzen 5 8400F, the Ryzen 7 8700F keeps AMD's Ryzen AI NPU, adding additional capability for generative AI. </p>
<p>The Ryzen 5 8400F can boost up to 4.7 GHz, 300 MHz slower than the Ryzen 5 8600G. AMD also allows overclocking for these new F-series chips, which means users could potentially boost the performance of these processors to match their G-series equivalents.</p>
<p>Pricing details are still pending, but to remain competitive, AMD will likely need to price these CPUs below the 8700G and 8600G, as well as the Ryzen 7 7700 and Ryzen 5 7600. These CPUs offer, albeit very limited, integrated graphics and have double the L3 cache capacity, along with higher boost clocks than the 8000F series chips, so pricing is something to consider whenever pricing becomes available.</p>
</p> CPUs){kind=link}
![](https://web.whatsapp.com/send?text=AMD Quietly Launches Ryzen 7 8700F and Ryzen 5 8400F Processors <p align="center"><a href="https://www.anandtech.com/show/21348/amd-quietly-launches-ryzen-7-8700f-and-ryzen-5-8400f-processors"><img src="https://images.anandtech.com/doci/21348/upb9b2u8fKkAyCpt8EUHqf-970-80ddddd_575px.jpg" alt="" /></a></p><p><p>AMD has recently expanded its Ryzen 8000 series by introducing the Ryzen 7 8700F and Ryzen 5 8400F processors. Initially launched in China, these chips were added to AMD's global website, signaling they are available worldwide, apparently from April 1st. Built from the recent Zen 4-based Phoenix APUs using the TSMC 4nm node as their Zen 4 mobile chips, these new CPUs lack integrated graphics. However, the Ryzen 7 8700F does include the integrated Ryzen AI NPU for added capabilities in a world currently dominated by AI and moving it directly into the PC.</p>
<p>The company's decision to announce these chips in China aligns with its strategy to offer Ryzen solutions at every price point in the market. Although AMD didn't initially disclose the full specifications of these F-series models, and we did reach out to the company to ask about them, they refused to discuss them with us. Their listing on the website has now been updated with a complete list of specifications and features, with everything but the price mentioned.</p>
<table border="0" style="text-align:center" width="100%">
<tbody>
<tr class="tgrey">
<td colspan="10">AMD Ryzen 8000G vs. Ryzen 8000F Series (Desktop)<br />
Zen 4 (Phoenix)</td>
</tr>
<tr class="tlblue">
<td><em>AnandTech</em></td>
<td>Cores/Threads</td>
<td>Base<br />
Freq</td>
<td>Turbo<br />
Freq</td>
<td>GPU</td>
<td>GPU<br />
Freq</td>
<td>Ryzen AI<br />
(NPU)</td>
<td>L3 Cache<br />
(MB)</td>
<td>TDP</td>
<td>MSRP</td>
</tr>
<tr>
<td class="tlgrey" colspan="10">Ryzen 7</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 7 8700G</td>
<td>8/16</td>
<td>4200</td>
<td>5100</td>
<td>R780M<br />
12 CUs</td>
<td>2900</td>
<td>Y</td>
<td>16</td>
<td>65W</td>
<td>$329</td>
</tr>
<tr>
<td class="tlgrey"><strong>Ryzen 7 8700F</strong></td>
<td><strong>8/16</strong></td>
<td><strong>4100</strong></td>
<td><strong>5000</strong></td>
<td><strong>-</strong></td>
<td><strong>-</strong></td>
<td><strong>Y</strong></td>
<td><strong>16</strong></td>
<td><strong>65W</strong></td>
<td><strong>?</strong></td>
</tr>
<tr>
<td class="tlgrey" colspan="10">Ryzen 5</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 5 8600G</td>
<td>6/12</td>
<td>4300</td>
<td>5000</td>
<td>R760M<br />
8 CUs</td>
<td>2800</td>
<td>Y</td>
<td>16</td>
<td>65W</td>
<td>$229</td>
</tr>
<tr>
<td class="tlgrey"><strong>Ryzen 5 8400F</strong></td>
<td><strong>6/12</strong></td>
<td><strong>4200</strong></td>
<td><strong>4700</strong></td>
<td><strong>-</strong></td>
<td><strong>-</strong></td>
<td><strong>N</strong></td>
<td><strong>16</strong></td>
<td><strong>65W</strong></td>
<td><strong>?</strong></td>
</tr>
</tbody>
</table>
<p>The Ryzen 7 8700F features an 8C/16T design, with 16MB of L3 cache and the same 65W TDP as the Ryzen 7 8700G. Although the base clock speed is 4.1 GHz, it boosts to 5.0 GHz; this is 100 MHz less on both base/boost clocks than the 8700G. Meanwhile, the Ryzen 5 8400F is a slightly scaled-down version of the Ryzen 8600G APU, with 6C/12, 16MB of L3 cache, and again has a 100 MHz reduction to base clocks compared to the 8600G. Unlike the Ryzen 5 8400F, the Ryzen 7 8700F keeps AMD's Ryzen AI NPU, adding additional capability for generative AI. </p>
<p>The Ryzen 5 8400F can boost up to 4.7 GHz, 300 MHz slower than the Ryzen 5 8600G. AMD also allows overclocking for these new F-series chips, which means users could potentially boost the performance of these processors to match their G-series equivalents.</p>
<p>Pricing details are still pending, but to remain competitive, AMD will likely need to price these CPUs below the 8700G and 8600G, as well as the Ryzen 7 7700 and Ryzen 5 7600. These CPUs offer, albeit very limited, integrated graphics and have double the L3 cache capacity, along with higher boost clocks than the 8000F series chips, so pricing is something to consider whenever pricing becomes available.</p>
</p> CPUs | https://compbuddey.blogspot.com/2024/04/amd-quietly-launches-ryzen-7-8700f-and_30.html){kind=link}
![](mailto:?subject=AMD Quietly Launches Ryzen 7 8700F and Ryzen 5 8400F Processors <p align="center"><a href="https://www.anandtech.com/show/21348/amd-quietly-launches-ryzen-7-8700f-and-ryzen-5-8400f-processors"><img src="https://images.anandtech.com/doci/21348/upb9b2u8fKkAyCpt8EUHqf-970-80ddddd_575px.jpg" alt="" /></a></p><p><p>AMD has recently expanded its Ryzen 8000 series by introducing the Ryzen 7 8700F and Ryzen 5 8400F processors. Initially launched in China, these chips were added to AMD's global website, signaling they are available worldwide, apparently from April 1st. Built from the recent Zen 4-based Phoenix APUs using the TSMC 4nm node as their Zen 4 mobile chips, these new CPUs lack integrated graphics. However, the Ryzen 7 8700F does include the integrated Ryzen AI NPU for added capabilities in a world currently dominated by AI and moving it directly into the PC.</p>
<p>The company's decision to announce these chips in China aligns with its strategy to offer Ryzen solutions at every price point in the market. Although AMD didn't initially disclose the full specifications of these F-series models, and we did reach out to the company to ask about them, they refused to discuss them with us. Their listing on the website has now been updated with a complete list of specifications and features, with everything but the price mentioned.</p>
<table border="0" style="text-align:center" width="100%">
<tbody>
<tr class="tgrey">
<td colspan="10">AMD Ryzen 8000G vs. Ryzen 8000F Series (Desktop)<br />
Zen 4 (Phoenix)</td>
</tr>
<tr class="tlblue">
<td><em>AnandTech</em></td>
<td>Cores/Threads</td>
<td>Base<br />
Freq</td>
<td>Turbo<br />
Freq</td>
<td>GPU</td>
<td>GPU<br />
Freq</td>
<td>Ryzen AI<br />
(NPU)</td>
<td>L3 Cache<br />
(MB)</td>
<td>TDP</td>
<td>MSRP</td>
</tr>
<tr>
<td class="tlgrey" colspan="10">Ryzen 7</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 7 8700G</td>
<td>8/16</td>
<td>4200</td>
<td>5100</td>
<td>R780M<br />
12 CUs</td>
<td>2900</td>
<td>Y</td>
<td>16</td>
<td>65W</td>
<td>$329</td>
</tr>
<tr>
<td class="tlgrey"><strong>Ryzen 7 8700F</strong></td>
<td><strong>8/16</strong></td>
<td><strong>4100</strong></td>
<td><strong>5000</strong></td>
<td><strong>-</strong></td>
<td><strong>-</strong></td>
<td><strong>Y</strong></td>
<td><strong>16</strong></td>
<td><strong>65W</strong></td>
<td><strong>?</strong></td>
</tr>
<tr>
<td class="tlgrey" colspan="10">Ryzen 5</td>
</tr>
<tr>
<td class="tlgrey">Ryzen 5 8600G</td>
<td>6/12</td>
<td>4300</td>
<td>5000</td>
<td>R760M<br />
8 CUs</td>
<td>2800</td>
<td>Y</td>
<td>16</td>
<td>65W</td>
<td>$229</td>
</tr>
<tr>
<td class="tlgrey"><strong>Ryzen 5 8400F</strong></td>
<td><strong>6/12</strong></td>
<td><strong>4200</strong></td>
<td><strong>4700</strong></td>
<td><strong>-</strong></td>
<td><strong>-</strong></td>
<td><strong>N</strong></td>
<td><strong>16</strong></td>
<td><strong>65W</strong></td>
<td><strong>?</strong></td>
</tr>
</tbody>
</table>
<p>The Ryzen 7 8700F features an 8C/16T design, with 16MB of L3 cache and the same 65W TDP as the Ryzen 7 8700G. Although the base clock speed is 4.1 GHz, it boosts to 5.0 GHz; this is 100 MHz less on both base/boost clocks than the 8700G. Meanwhile, the Ryzen 5 8400F is a slightly scaled-down version of the Ryzen 8600G APU, with 6C/12, 16MB of L3 cache, and again has a 100 MHz reduction to base clocks compared to the 8600G. Unlike the Ryzen 5 8400F, the Ryzen 7 8700F keeps AMD's Ryzen AI NPU, adding additional capability for generative AI. </p>
<p>The Ryzen 5 8400F can boost up to 4.7 GHz, 300 MHz slower than the Ryzen 5 8600G. AMD also allows overclocking for these new F-series chips, which means users could potentially boost the performance of these processors to match their G-series equivalents.</p>
<p>Pricing details are still pending, but to remain competitive, AMD will likely need to price these CPUs below the 8700G and 8600G, as well as the Ryzen 7 7700 and Ryzen 5 7600. These CPUs offer, albeit very limited, integrated graphics and have double the L3 cache capacity, along with higher boost clocks than the 8000F series chips, so pricing is something to consider whenever pricing becomes available.</p>
</p> CPUs&body=https://compbuddey.blogspot.com/2024/04/amd-quietly-launches-ryzen-7-8700f-and_30.html){kind=link}
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