As the deployment of PCIe 5.0 picks up steam in both datacenter and consumer markets, PCI-SIG is not sitting idle, and is already working on getting the ecosystem ready for the updats to the PCIe specifications. At FMS 2024, some vendors were even talking about PCIe 7.0 with its 128 GT/s capabilities despite PCIe 6.0 not even starting to ship yet. We caught up with PCI-SIG to get some updates on its activities and have a discussion on the current state of the PCIe ecosystem.
PCI-SIG has already made the PCIe 7.0 specifications (v 0.5) available to its members, and expects full specifications to be officially released sometime in 2025. The goal is to deliver a 128 GT/s data rate with up to 512 GBps of bidirectional traffic using x16 links. Similar to PCIe 6.0, this specification will also utilize PAM4 signaling and maintain backwards compatibility. Power efficiency as well as silicon die area are also being kept in mind as part of the drafting process.
The move to PAM4 signaling brings higher bit-error rates compared to the previous NRZ scheme. This made it necessary to adopt a different error correction scheme in PCIe 6.0 - instead of operating on variable length packets, PCIe 6.0's Flow Control Unit (FLIT) encoding operates on fixed size packets to aid in forward error correction. PCIe 7.0 retains these aspects.
The integrators list for the PCIe 6.0 compliance program is also expected to come out in 2025, though initial testing is already in progress. This was evident by the FMS 2024 demo involving Cadence's 3nm test chip for its PCIe 6.0 IP offering along with Teledyne Lecroy's PCIe 6.0 analyzer. These timelines track well with the specification completion dates and compliance program availability for previous PCIe generations.
We also received an update on the optical workgroup - while being optical-technology agnostic, the WG also intends to develop technology-specific form-factors including pluggable optical transceivers, on-board optics, co-packaged optics, and optical I/O. The logical and electrical layers of the PCIe 6.0 specifications are being enhanced to accommodate the new optical PCIe standardization and this process will also be done with PCIe 7.0 to coincide with that standard's release next year.
The PCI-SIG also has ongoing cabling initiatives. On the consumer side, we have seen significant traction for Thunderbolt and external GPU enclosures. However, even datacenters and enterprise systems are moving towards cabling solutions as it becomes evident that disaggregation of components such as storage from the CPU and GPU are better for thermal design. Additionally maintaining signal integrity over longer distances becomes difficult for on-board signal traces. Cabling internal to the computing systems can help here.
OCuLink emerged as a good candidate and was adopted fairly widely as an internal link in server systems. It has even made an appearance in mini-PCs from some Chinese manufacturers in its external avatar for the consumer market, albeit with limited traction. As speeds increase, a widely-adopted standard for external PCIe peripherals (or even connecting components within a system) will become imperative.
StorageAs Qualcomm's exclusivity for Arm-powered processors for Windows PCs is reportedly coming to its end, other chipmakers are getting ready to offer their Arm-based system-on-chips for Windows computers. And, according to a new report from Reuters, MediaTek will be among the companies jumping into the Windows-on-Arm field, with plans to launch their first PC processor late next year.
MediaTek's system-on-chip for Windows PCs will rely on Arm's 'ready-made designs,' according to Reuters. Which in turn hints that MediaTek would be using Arm's compute sub-system (CSS) for client PCs, a building block designed to significantly speed up development of SoCs.
With the vauge nature of the Reuters report, however, which version of Arm's IP MediaTek might be using remains unclear, and the answer to that will largely hinge on timing. Arm refreshes its client cores and IP offerings yearly – typically announcing them to the public in May – with finished chips rolling out as early as later in the year. So depending on just how late in the year MediaTek is planning to launch their chip, the company has a large enough window to potentially use either the current 2024 client designs, or next year's 2025 designs.
For reference, Arm's 2024 CSS for client systems is quite powerful on its own. It includes two ultra-high-performance Arm Cortex-X925 cores (each with up to 3MB L2 cache and clock speeds over 3.60 GHz, supporting SVE and SVE2), four high-performance Cortex-A725 cores, two energy-efficient Cortex-A520 cores, and an Immortalis-G925 graphics processor. And, of course, MediaTek has the expertise to skip Arm's CSS and build their own bespoke designs as well, if that's what they'd prefer.
Overall, the latest client designs from Arm can accommodate up to 14 CPU cores – Arm intentionally leaves headroom for designs to be scaled-up for laptops – which would make for quite a formidable chip. But the PC SoC market has no shortage of capable contenders with their own designs; besides Qualcomm's Snapdragon X processors, MediaTek would also be going up against the latest designs from Intel and AMD. All of whom are planning to make big plays for the mobile PC market in the next several months. So MediaTek will need to make a serious effort if their effort to jump into the PC SoC market are to succeed.
Since 2016, Microsoft has partnered with Qualcomm to bring Arm's processor architecture, which is widely used in smartphones, to Windows PCs. Qualcomm has an exclusive agreement to supply these chips for the next several months (the exact timing remains unclear), after which other designers like MediaTek can enter the market. Qualcomm, for its part, has benefited greatly from collaborating with Microsoft, so it will be interesting to see if Microsoft extends a similar hand out to other Arm chip makers.
Ultimately, the market for Arm PC SoCs has the potential to get crowded quickly. According to previous reports from Reuters, both AMD and NVIDIA are also developing Arm-based chips for Windows. So if all of those projects come to fruition, there could potentially be several Arm SoCs available to PC manufacturers around the same time. All of which would be a massive change from the past 20 years of the PC, where Intel and AMD have been the entire market.
Both MediaTek and Microsoft have declined to comment on the ongoing developments, the news agency states.
CPUsAs LPCAMM2 adoption begins, the first retail memory modules are finally starting to hit the retail market, courtesy of Micron. The memory manufacturer has begun selling their LPDDR5X-based LPCAMM2 memory modules under their in-house Crucial brand, making them available on the latter's storefront. Timed to coincide with the release of Lenovo's ThinkPad P1 Gen 7 laptop – the first retail laptop designed to use the memory modules – this marks the de facto start of the eagerly-awaited modular LPDDR5X memory era.
Micron's Low Power Compression Attached Memory Module 2 (LPCAMM2) modules are available in capacities of 32 GB and 64 GB. These are dual-channel modules that feature a 128-bit wide interface, and are based around LPDDR5X memory running at data rates up to 7500 MT/s. This gives a single LPCAMM2 a peak bandwidth of 120 GB/s. Micron is not disclosing the latencies of its LPCAMM2 memory modules, but it says that high data transfer rates of LPDDR5X compensate for the extended timings.
Micron says that LPDDR5X memory offers significantly lower power consumption, with active power per 64-bit bus being 43-58% lower than DDR5 at the same speed, and standby power up to 80% lower. Meanwhile, similar to DDR5 modules, LPCAMM2 modules include a power management IC and voltage regulating circuitry, which provides module manufacturers additional opportunities to reduce power consumption of their products.

Source: Micron LPDDR5X LPCAMM2 Technical Brief
It's worth noting, however, that at least for the first generation of LPCAMM2 modules, system vendors will need to pick between modularity and performance. While soldered-down LPDDR5X memory is available at speeds up to 8533 MT/sec – and with 9600 MT/sec on the horizon – the fastest LPCAMM2 modules planned for this year by both Micron and rival Samsung will be running at 7500 MT/sec. So vendors will have to choose between the flexibility of offering modular LPDDR5X, or the higher bandwidth (and space savings) offered by soldering down their memory.
Micron, for its part, is projecting that 9600 MT/sec LPCAMM2 modules will be available by 2026. Though it's all but certain that faster memory will also be avaialble in the same timeframe.
Micron's Crucial LPDDR5X 32 GB module costs $174.99, whereas a 64 GB module costs $329.99.
Memory
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