When Western Digital introduced its Ultrastar DC SN861 SSDs earlier this year, the company did not disclose which controller it used for these drives, which made many observers presume that WD was using an in-house controller. But a recent teardown of the drive shows that is not the case; instead, the company is using a controller from Fadu, a South Korean company founded in 2015 that specializes on enterprise-grade turnkey SSD solutions.
The Western Digital Ultrastar DC SN861 SSD is aimed at performance-hungry hyperscale datacenters and enterprise customers which are adopting PCIe Gen5 storage devices these days. And, as uncovered in photos from a recent Storage Review article, the drive is based on Fadu's FC5161 NVMe 2.0-compliant controller. The FC5161 utilizes 16 NAND channels supporting an ONFi 5.0 2400 MT/s interface, and features a combination of enterprise-grade capabilities (OCP Cloud Spec 2.0, SR-IOV, up to 512 name spaces for ZNS support, flexible data placement, NVMe-MI 1.2, advanced security, telemetry, power loss protection) not available on other off-the-shelf controllers – or on any previous Western Digital controllers.
The Ultrastar DC SN861 SSD offers sequential read speeds up to 13.7 GB/s as well as sequential write speeds up to 7.5 GB/s. As for random performance, it boasts with an up to 3.3 million random 4K read IOPS and up to 0.8 million random 4K write IOPS. The drives are available in capacities between 1.6 TB and 7.68 TB with one or three drive writes per day (DWPD) over five years rating as well as in U.2 and E1.S form-factors.
While the two form factors of the SN861 share a similar technical design, Western Digital has tailored each version for distinct workloads: the E1.S supports FDP and performance enhancements specifically for cloud environments. By contrast, the U.2 model is geared towards high-performance enterprise tasks and emerging applications like AI.
Without any doubts, Western Digital's Ultrastar DC SN861 is a feature-rich high-performance enterprise-grade SSD. It has another distinctive feature: a 5W idle power consumption, which is rather low by the standards of enterprise-grade drives (e.g., it is 1W lower compared to the SN840). While the difference with predecessors may be just 1W, hyperscalers deploy thousands of drives and for their TCO every watt counts.
Western Digital's Ultrastar DC SN861 SSDs are now available for purchase to select customers (such as Meta) and to interested parties. Prices are unknown, but they will depend on such factors as volumes.
Sources: Fadu, Storage Review
StorageSamsung's 128 TB-Class BM1743 Enterprise SSD Displayed at FMS 2024 Samsung had quietly launched its BM1743 enterprise QLC SSD last month with a hefty 61.44 TB SKU. At FMS 2024, the company had the even larger 122.88 TB version of that SSD on display, alongside a few recorded benchmarking sessions. Compared to the previous generation, the BM1743 comes with a 4.1x improvement in I/O performance, improvement in data retention, and a 45% improvement in power efficiency for sequential writes. The 128 TB-class QLC SSD boasts of sequential read speeds of 7.5 GBps and write speeds of 3 GBps. Random reads come in at 1.6 M IOPS, while 16 KB random writes clock in at 45K IOPS. Based on the quoted random write access granularity, it appears that Samsung is using a 16 KB indirection unit (IU) to optimize flash management. This is similar to the strategy adopted by Solidigm with IUs larger than 4K in their high-capacity SSDs. A recorded benchmark session on the company's PM9D3a 8-channel Gen 5 SSD was also on display. The SSD family is being promoted as a mainstream option for datacenters, and boasts of sequential reads up to 12 GBps and writes up to 6.8 GBps. Random reads clock in at 2 M IOPS, and random writes at 400 K IOPS. Available in multiple form-factors up to 32 TB (M.2 tops out at 2 TB), the drive's firmware includes optional support for flexible data placement (FDP) to help address the write amplification aspect. The PM1753 is the current enterprise SSD flagship in Samsung's lineup. With support for 16 NAND channels and capacities up to 32 TB, this U.2 / E3.S SSD has advertised sequential read and write speeds of 14.8 GBps and 11 GBps respectively. Random reads and writes for 4 KB accesses are listed at 3.4 M and 600 K IOPS. Samsung claims a 1.7x performance improvement and a 1.7x power efficiency improvement over the previous generation (PM1743), making this TLC SSD suitable for AI servers. The 9th Gen. V-NAND wafer was also available for viewing, though photography was prohibited. Mass production of this flash memory began in April 2024. Storage
MediaTek to Add NVIDIA G-Sync Support to Monitor Scalers, Make G-Sync Displays More Accessible NVIDIA on Tuesday said that future monitor scalers from MediaTek will support its G-Sync technologies. NVIDIA is partnering with MediaTek to integrate its full range of G-Sync technologies into future monitors without requiring a standalone G-Sync module, which makes advanced gaming features more accessible across a broader range of displays. Traditionally, G-Sync technology relied on a dedicated G-sync module – based on an Altera FPGA – to handle syncing display refresh rates with the GPU in order to reduce screen tearing, stutter, and input lag. As a more basic solution, in 2019 NVIDIA introduced G-Sync Compatible certification and branding, which leveraged the industry-standard VESA AdaptiveSync technology to handle variable refresh rates. In lieu of using a dedicated module, leveraging AdaptiveSync allowed for cheaper monitors, with NVIDIA's program serving as a stamp of approval that the monitor worked with NVIDIA GPUs and met NVIDIA's performance requirements. Still, G-Sync Compatible monitors still lack some features that, to date, require the dedicated G-Sync module. Through this new partnership with MediaTek, MediaTek will bring support for all of NVIDIA's G-Sync technologies, including the latest G-Sync Pulsar, directly into their scalers. G-Sync Pulsar enhances motion clarity and reduces ghosting, providing a smoother gaming experience. In addition to variable refresh rates and Pulsar, MediaTek-based G-Sync displays will support such features as variable overdrive, 12-bit color, Ultra Low Motion Blur, low latency HDR, and Reflex Analyzer. This integration will allow more monitors to support a full range of G-Sync features without having to incorporate an expensive FPGA. The first monitors to feature full G-Sync support without needing an NVIDIA module include the AOC Agon Pro AG276QSG2, Acer Predator XB273U F5, and ASUS ROG Swift 360Hz PG27AQNR. These monitors offer 360Hz refresh rates, 1440p resolution, and HDR support. What remains to be seen is which specific MediaTek's scalers will support NVIDIA's G-Sync technology – or if the company is going to implement support into all of their scalers going forward. It also remains to be seen whether monitors with NVIDIA's dedicated G-Sync modules retain any advantages over displays with MediaTek's scalers. Monitors
Later this year Intel is set to introduce its Xeon 6-branded processors, codenamed Granite Rapids (6x00P) and Sierra Forest (6x00E). And with it will come a new slew of server motherboards and pre-built server platforms to go with it. On the latter note, this will be the first generation where Intel won't be offering any pre-builts of its own, after selling that business off to MiTAC last year.
To that end, MiTAC and its subsidiary Tyan were at this year's event to demonstrate what they've been up to since acquiring Intel's server business unit, as well as to show off the server platforms they're developing for the Xeon 6 family. Altogether, the companies had two server platforms on display – a compact 2S system, and a larger 2S system with significant expansion capabilities – as well as a pair of single-socket designs from Tyan.
The most basic platform that MiTAC had to show is their TX86-E7148 (Katmai Pass), a half-width 1U system that's the successor to Intel's D50DNP platform. Katmai Pass has two CPU sockets, supports up to 2 TB of DDR5-6400 RDIMMs over 16 slots (8 per CPU), and has two low-profile PCIe 5.0 x16 slots. Like its predecessor, this platform is aimed at mainstream servers that do not need a lot of storage or room to house bulky add-in cards like AI accelerators.
The company's other platform is TX77A-E7142 (Deer Creek Pass), a considerably more serious offering that replaces Intel's M50FCP platform. This board can house up to 4 TB of DDR5-6400 RDIMMs over 32 slots (16 per CPU with 2DPC), four PCIe 5.0 x16 slots, one PCIe 5.0 x8 slot, two OCP 3.0 slots, and 24 hot-swap U.2 bays. Deer Creek Pass can be used both for general-purpose workloads, high-performance storage, as well as workloads that require GPUs or other special-purpose accelerators.
Meanwhile Tyan had the single-socket Thunder CX GC73A-B5660 on display. That system supports up to 2 TB of DDR5-6400 memory over 16 RDIMMs and offers two PCIe 5.0 x16 slots, one PCIe 4.0 x4 M.2 slot, two OCP 3.0 slots, and 12 hot-swappable U.2 drive bays.
Finally, Tyan's Thunder HX S5662 is an HPC server board specifically designed to house multiple AI accelerators and other large PCIe cards. This board supports one Xeon 6 6700 processor, up to 1 TB of memory over eight DDR5-6400 RDIMMs, and has five tradiitonal PCIe 5.0 x16 slots as well as two PCIe 5.0 x2 M.2 slots for storage.
MiTAC is expected to start shipments of these new Xeon 6 motherboards in the coming months, as Intel rolls out its next-generation datacenter CPUs. Pricing of these platforms is unknown for now, but expect it to be comparable to... Servers
At FMS 2024, the technological requirements from the storage and memory subsystem took center stage. Both SSD and controller vendors had various demonstrations touting their suitability for different stages of the AI data pipeline - ingestion, preparation, training, checkpointing, and inference. Vendors like Solidigm have different types of SSDs optimized for different stages of the pipeline. At the same time, controller vendors have taken advantage of one of the features introduced recently in the NVM Express standard - Flexible Data Placement (FDP).
FDP involves the host providing information / hints about the areas where the controller could place the incoming write data in order to reduce the write amplification. These hints are generated based on specific block sizes advertised by the device. The feature is completely backwards-compatible, with non-FDP hosts working just as before with FDP-enabled SSDs, and vice-versa.
Silicon Motion's MonTitan Gen 5 Enterprise SSD Platform was announced back in 2022. Since then, Silicon Motion has been touting the flexibility of the platform, allowing its customers to incorporate their own features as part of the customization process. This approach is common in the enterprise space, as we have seen with Marvell's Bravera SC5 SSD controller in the DapuStor SSDs and Microchip's Flashtec controllers in the Longsys FORESEE enterprise SSDs.
At FMS 2024, the company was demonstrating the advantages of flexible data placement by allowing a single QLC SSD based on their MonTitan platform to take part in different stages of the AI data pipeline while maintaining the required quality of service (minimum bandwidth) for each process. The company even has a trademarked name (PerformaShape) for the firmware feature in the controller that allows the isolation of different concurrent SSD accesses (from different stages in the AI data pipeline) to guarantee this QoS. Silicon Motion claims that this scheme will enable its customers to get the maximum write performance possible from QLC SSDs without negatively impacting the performance of other types of accesses.
Silicon Motion and Phison have market leadership in the client SSD controller market with similar approaches. However, their enterprise SSD controller marketing couldn't be more different. While Phison has gone in for a turnkey solution with their Gen 5 SSD platform (to the extent of not adopting the white label route for this generation, and instead opting to get the SSDs qualified with different cloud service providers themselves), Silicon Motion is opting for a different approach. The flexibility and customization possibilities can make platforms like the MonTitan appeal to flash array vendors.
StorageLater this year Intel is set to introduce its Xeon 6-branded processors, codenamed Granite Rapids (6x00P) and Sierra Forest (6x00E). And with it will come a new slew of server motherboards and pre-built server platforms to go with it. On the latter note, this will be the first generation where Intel won't be offering any pre-builts of its own, after selling that business off to MiTAC last year.
To that end, MiTAC and its subsidiary Tyan were at this year's event to demonstrate what they've been up to since acquiring Intel's server business unit, as well as to show off the server platforms they're developing for the Xeon 6 family. Altogether, the companies had two server platforms on display – a compact 2S system, and a larger 2S system with significant expansion capabilities – as well as a pair of single-socket designs from Tyan.
The most basic platform that MiTAC had to show is their TX86-E7148 (Katmai Pass), a half-width 1U system that's the successor to Intel's D50DNP platform. Katmai Pass has two CPU sockets, supports up to 2 TB of DDR5-6400 RDIMMs over 16 slots (8 per CPU), and has two low-profile PCIe 5.0 x16 slots. Like its predecessor, this platform is aimed at mainstream servers that do not need a lot of storage or room to house bulky add-in cards like AI accelerators.
The company's other platform is TX77A-E7142 (Deer Creek Pass), a considerably more serious offering that replaces Intel's M50FCP platform. This board can house up to 4 TB of DDR5-6400 RDIMMs over 32 slots (16 per CPU with 2DPC), four PCIe 5.0 x16 slots, one PCIe 5.0 x8 slot, two OCP 3.0 slots, and 24 hot-swap U.2 bays. Deer Creek Pass can be used both for general-purpose workloads, high-performance storage, as well as workloads that require GPUs or other special-purpose accelerators.
Meanwhile Tyan had the single-socket Thunder CX GC73A-B5660 on display. That system supports up to 2 TB of DDR5-6400 memory over 16 RDIMMs and offers two PCIe 5.0 x16 slots, one PCIe 4.0 x4 M.2 slot, two OCP 3.0 slots, and 12 hot-swappable U.2 drive bays.
Finally, Tyan's Thunder HX S5662 is an HPC server board specifically designed to house multiple AI accelerators and other large PCIe cards. This board supports one Xeon 6 6700 processor, up to 1 TB of memory over eight DDR5-6400 RDIMMs, and has five tradiitonal PCIe 5.0 x16 slots as well as two PCIe 5.0 x2 M.2 slots for storage.
MiTAC is expected to start shipments of these new Xeon 6 motherboards in the coming months, as Intel rolls out its next-generation datacenter CPUs. Pricing of these platforms is unknown for now, but expect it to be comparable to... Servers
At FMS 2024, the technological requirements from the storage and memory subsystem took center stage. Both SSD and controller vendors had various demonstrations touting their suitability for different stages of the AI data pipeline - ingestion, preparation, training, checkpointing, and inference. Vendors like Solidigm have different types of SSDs optimized for different stages of the pipeline. At the same time, controller vendors have taken advantage of one of the features introduced recently in the NVM Express standard - Flexible Data Placement (FDP).
FDP involves the host providing information / hints about the areas where the controller could place the incoming write data in order to reduce the write amplification. These hints are generated based on specific block sizes advertised by the device. The feature is completely backwards-compatible, with non-FDP hosts working just as before with FDP-enabled SSDs, and vice-versa.
Silicon Motion's MonTitan Gen 5 Enterprise SSD Platform was announced back in 2022. Since then, Silicon Motion has been touting the flexibility of the platform, allowing its customers to incorporate their own features as part of the customization process. This approach is common in the enterprise space, as we have seen with Marvell's Bravera SC5 SSD controller in the DapuStor SSDs and Microchip's Flashtec controllers in the Longsys FORESEE enterprise SSDs.
At FMS 2024, the company was demonstrating the advantages of flexible data placement by allowing a single QLC SSD based on their MonTitan platform to take part in different stages of the AI data pipeline while maintaining the required quality of service (minimum bandwidth) for each process. The company even has a trademarked name (PerformaShape) for the firmware feature in the controller that allows the isolation of different concurrent SSD accesses (from different stages in the AI data pipeline) to guarantee this QoS. Silicon Motion claims that this scheme will enable its customers to get the maximum write performance possible from QLC SSDs without negatively impacting the performance of other types of accesses.
Silicon Motion and Phison have market leadership in the client SSD controller market with similar approaches. However, their enterprise SSD controller marketing couldn't be more different. While Phison has gone in for a turnkey solution with their Gen 5 SSD platform (to the extent of not adopting the white label route for this generation, and instead opting to get the SSDs qualified with different cloud service providers themselves), Silicon Motion is opting for a different approach. The flexibility and customization possibilities can make platforms like the MonTitan appeal to flash array vendors.
StorageSamsung this week has unveiled its latest process technologies roadmap at the company's Samsung Foundry Forum (SFF) U.S. The new plan covers the evolution of Samsung's 2nm-class production nodes through 2027, including a process technology with a backside power delivery, re-emphasizing plans to bring out a 1.4nm-class node in 2027, and the introduction of a 'high value' 4nm-class manufacturing tech.
Samsung Foundry's key announcements for today are clearly focused on the its 2nm-class process technologies, which are set to enter production in 2025 and will span to 2027, when the company's 1.4-nm class production node is set to enter the scene. Samsung is also adding (or rather, renaming) another 2nm-class node to their roadmap with SF2, which was previously disclosed by Samsung as SF3P and aimed at high-performance devices.
"We have refined and improved the SF3P, resulting in what we now refer to as SF2," a Samsung spokesperson told AnandTech. "This enhanced node incorporates various process design improvements, delivering notable power, performance, and area (PPA) benefits."
Samsung Foundry for Leading-Edge Nodes Announced on June 12, 2024 Compiled by AnandTech |
||||||||
HVM Start | 2023 | 2024 | 2025 | 2026 | 2027 | 2027 | ||
Process | SF3E | SF3 | SF2 (aka SF3P) |
SF2P/SF2X | SF2Z | SF1.4 | ||
FET | GAAFET | |||||||
Power Delivery | Frontside | Backside (BSPDN) | ? | |||||
EUV | 0.33 NA EUV | ? | ? | ? | ? |
This is another example of a rebranding of leading-edge fabrication nodes in the recent years by a major chipmaker. Samsung Foundry is not disclosing any specific PPA improvements SF3P has over SF2, and for now is only stating in high-level terms that it will be a better-performing node than the planned SF3P.
Meanwhile, this week's announcement also includes new information on Samsung's next batch of process nodes, which are planned for 2026 and 2027. In 2026 Samsung will have SF2P, a further refinement of SF2 which incorporates 'faster' yet less dense transistors. That will be followed up in 2027 with SF2Z, which adds backside power delivery to the mix for better and higher quality power delivery. In particular, Samsung is targetting voltate drop (aka IR drop) here, which is an ongoing concern in chip design.
Finally, SF1.4, a 1.4nm-class node, is on track for 2027 as well. Interestingly, however, it looks like it does not feature a backside power delivery. Which, per current roadmaps, would have Samsung as the only foundry not using BSPDN for their first 1.4nm/14Å-class node.
"We have optimized BSPDN and incorporated it for the first time in the SF2Z node we announced today," the spokesperso... Semiconductors
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
StorageLater this year Intel is set to introduce its Xeon 6-branded processors, codenamed Granite Rapids (6x00P) and Sierra Forest (6x00E). And with it will come a new slew of server motherboards and pre-built server platforms to go with it. On the latter note, this will be the first generation where Intel won't be offering any pre-builts of its own, after selling that business off to MiTAC last year.
To that end, MiTAC and its subsidiary Tyan were at this year's event to demonstrate what they've been up to since acquiring Intel's server business unit, as well as to show off the server platforms they're developing for the Xeon 6 family. Altogether, the companies had two server platforms on display – a compact 2S system, and a larger 2S system with significant expansion capabilities – as well as a pair of single-socket designs from Tyan.
The most basic platform that MiTAC had to show is their TX86-E7148 (Katmai Pass), a half-width 1U system that's the successor to Intel's D50DNP platform. Katmai Pass has two CPU sockets, supports up to 2 TB of DDR5-6400 RDIMMs over 16 slots (8 per CPU), and has two low-profile PCIe 5.0 x16 slots. Like its predecessor, this platform is aimed at mainstream servers that do not need a lot of storage or room to house bulky add-in cards like AI accelerators.
The company's other platform is TX77A-E7142 (Deer Creek Pass), a considerably more serious offering that replaces Intel's M50FCP platform. This board can house up to 4 TB of DDR5-6400 RDIMMs over 32 slots (16 per CPU with 2DPC), four PCIe 5.0 x16 slots, one PCIe 5.0 x8 slot, two OCP 3.0 slots, and 24 hot-swap U.2 bays. Deer Creek Pass can be used both for general-purpose workloads, high-performance storage, as well as workloads that require GPUs or other special-purpose accelerators.
Meanwhile Tyan had the single-socket Thunder CX GC73A-B5660 on display. That system supports up to 2 TB of DDR5-6400 memory over 16 RDIMMs and offers two PCIe 5.0 x16 slots, one PCIe 4.0 x4 M.2 slot, two OCP 3.0 slots, and 12 hot-swappable U.2 drive bays.
Finally, Tyan's Thunder HX S5662 is an HPC server board specifically designed to house multiple AI accelerators and other large PCIe cards. This board supports one Xeon 6 6700 processor, up to 1 TB of memory over eight DDR5-6400 RDIMMs, and has five tradiitonal PCIe 5.0 x16 slots as well as two PCIe 5.0 x2 M.2 slots for storage.
MiTAC is expected to start shipments of these new Xeon 6 motherboards in the coming months, as Intel rolls out its next-generation datacenter CPUs. Pricing of these platforms is unknown for now, but expect it to be comparable to... Servers
Later this year Intel is set to introduce its Xeon 6-branded processors, codenamed Granite Rapids (6x00P) and Sierra Forest (6x00E). And with it will come a new slew of server motherboards and pre-built server platforms to go with it. On the latter note, this will be the first generation where Intel won't be offering any pre-builts of its own, after selling that business off to MiTAC last year.
To that end, MiTAC and its subsidiary Tyan were at this year's event to demonstrate what they've been up to since acquiring Intel's server business unit, as well as to show off the server platforms they're developing for the Xeon 6 family. Altogether, the companies had two server platforms on display – a compact 2S system, and a larger 2S system with significant expansion capabilities – as well as a pair of single-socket designs from Tyan.
The most basic platform that MiTAC had to show is their TX86-E7148 (Katmai Pass), a half-width 1U system that's the successor to Intel's D50DNP platform. Katmai Pass has two CPU sockets, supports up to 2 TB of DDR5-6400 RDIMMs over 16 slots (8 per CPU), and has two low-profile PCIe 5.0 x16 slots. Like its predecessor, this platform is aimed at mainstream servers that do not need a lot of storage or room to house bulky add-in cards like AI accelerators.
The company's other platform is TX77A-E7142 (Deer Creek Pass), a considerably more serious offering that replaces Intel's M50FCP platform. This board can house up to 4 TB of DDR5-6400 RDIMMs over 32 slots (16 per CPU with 2DPC), four PCIe 5.0 x16 slots, one PCIe 5.0 x8 slot, two OCP 3.0 slots, and 24 hot-swap U.2 bays. Deer Creek Pass can be used both for general-purpose workloads, high-performance storage, as well as workloads that require GPUs or other special-purpose accelerators.
Meanwhile Tyan had the single-socket Thunder CX GC73A-B5660 on display. That system supports up to 2 TB of DDR5-6400 memory over 16 RDIMMs and offers two PCIe 5.0 x16 slots, one PCIe 4.0 x4 M.2 slot, two OCP 3.0 slots, and 12 hot-swappable U.2 drive bays.
Finally, Tyan's Thunder HX S5662 is an HPC server board specifically designed to house multiple AI accelerators and other large PCIe cards. This board supports one Xeon 6 6700 processor, up to 1 TB of memory over eight DDR5-6400 RDIMMs, and has five tradiitonal PCIe 5.0 x16 slots as well as two PCIe 5.0 x2 M.2 slots for storage.
MiTAC is expected to start shipments of these new Xeon 6 motherboards in the coming months, as Intel rolls out its next-generation datacenter CPUs. Pricing of these platforms is unknown for now, but expect it to be comparable to... Servers
At FMS 2024, the technological requirements from the storage and memory subsystem took center stage. Both SSD and controller vendors had various demonstrations touting their suitability for different stages of the AI data pipeline - ingestion, preparation, training, checkpointing, and inference. Vendors like Solidigm have different types of SSDs optimized for different stages of the pipeline. At the same time, controller vendors have taken advantage of one of the features introduced recently in the NVM Express standard - Flexible Data Placement (FDP).
FDP involves the host providing information / hints about the areas where the controller could place the incoming write data in order to reduce the write amplification. These hints are generated based on specific block sizes advertised by the device. The feature is completely backwards-compatible, with non-FDP hosts working just as before with FDP-enabled SSDs, and vice-versa.
Silicon Motion's MonTitan Gen 5 Enterprise SSD Platform was announced back in 2022. Since then, Silicon Motion has been touting the flexibility of the platform, allowing its customers to incorporate their own features as part of the customization process. This approach is common in the enterprise space, as we have seen with Marvell's Bravera SC5 SSD controller in the DapuStor SSDs and Microchip's Flashtec controllers in the Longsys FORESEE enterprise SSDs.
At FMS 2024, the company was demonstrating the advantages of flexible data placement by allowing a single QLC SSD based on their MonTitan platform to take part in different stages of the AI data pipeline while maintaining the required quality of service (minimum bandwidth) for each process. The company even has a trademarked name (PerformaShape) for the firmware feature in the controller that allows the isolation of different concurrent SSD accesses (from different stages in the AI data pipeline) to guarantee this QoS. Silicon Motion claims that this scheme will enable its customers to get the maximum write performance possible from QLC SSDs without negatively impacting the performance of other types of accesses.
Silicon Motion and Phison have market leadership in the client SSD controller market with similar approaches. However, their enterprise SSD controller marketing couldn't be more different. While Phison has gone in for a turnkey solution with their Gen 5 SSD platform (to the extent of not adopting the white label route for this generation, and instead opting to get the SSDs qualified with different cloud service providers themselves), Silicon Motion is opting for a different approach. The flexibility and customization possibilities can make platforms like the MonTitan appeal to flash array vendors.
Storage
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