CXL Gathers Momentum at FMS 2024
The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had announced v3.0 of the CXL specifications. This was followed by CXL 3.1's introduction at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly subsumed other competing standards such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on the device side. At FMS 2024, CXL had a prime position in the booth demos of many vendors.
The migration of server platforms from DDR4 to DDR5, along with the rise of workloads demanding large RAM capacity (but not particularly sensitive to either memory bandwidth or latency), has opened up memory expansion modules as one of the first set of widely available CXL devices. Over the last couple of years, we have had product announcements from Samsung and Micron in this area.
SK hynix CMM-DDR5 CXL Memory Module and HMSDK
At FMS 2024, SK hynix was showing off their DDR5-based CMM-DDR5 CXL memory module with a 128 GB capacity. The company was also detailing their associated Heterogeneous Memory Software Development Kit (HMSDK) - a set of libraries and tools at both the kernel and user levels aimed at increasing the ease of use of CXL memory. This is achieved in part by considering the memory pyramid / hierarchy and relocating the data between the server's main memory (DRAM) and the CXL device based on usage frequency.
The CMM-DDR5 CXL memory module comes in the SDFF form-factor (E3.S 2T) with a PCIe 3.0 x8 host interface. The internal memory is based on 1α technology DRAM, and the device promises DDR5-class bandwidth and latency within a single NUMA hop. As these memory modules are meant to be used in datacenters and enterprises, the firmware includes features for RAS (reliability, availability, and serviceability) along with secure boot and other management features.
SK hynix was also demonstrating Niagara 2.0 - a hardware solution (currently based on FPGAs) to enable memory pooling and sharing - i.e, connecting multiple CXL memories to allow different hosts (CPUs and GPUs) to optimally share their capacity. The previous version only allowed capacity sharing, but the latest version enables sharing of data also. SK hynix had presented these solutions at the CXL DevCon 2024 earlier this year, but some progress seems to have been made in finalizing the specifications of the CMM-DDR5 at FMS 2024.
Microchip and Micron Demonstrate CZ120 CXL Memory Expansion Module
Micron had unveiled the CZ120 CXL Memory Expansion Module last year based on the Microchip SMC 2000 series CXL memory controller. At FMS 2024, Micron and Microchip had a demonstration of the module on a Granite Rapids server.
Additional insights into the SMC 2000 controller were also provided.
The CXL memory controller also incorporates DRAM die failure handling, and Microchip also provides diagnostics and debug tools to analyze failed modules. The memory controller also supports ECC, which forms part of the enterprise... Storage
Posted by The Techinical Support
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling 
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
![](https://twitter.com/share?url=https://compbuddey.blogspot.com/2024/10/cxl-gathers-momentum-at-fms-2024-cxl_17.html&text=CXL Gathers Momentum at FMS 2024 <p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img src="https://images.anandtech.com/doci/21533/cxl-car-2_575px.jpg" alt="" /></a></p><p><p>The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had <a href="https://www.anandtech.com/show/17520/compute-express-link-cxl-30-announced-doubled-speeds-and-flexible-fabrics">announced</a> v3.0 of the CXL specifications. This was followed by CXL 3.1's <a href="https://www.businesswire.com/news/home/20231114332690/en/CXL-Consortium-Announces-Compute-Express-Link-3.1-Specification-Release">introduction</a> at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly <a href="https://www.anandtech.com/show/17519/">subsumed other competing standards</a> such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on the device side. At FMS 2024, CXL had a prime position in the booth demos of many vendors.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/cxl-mem-hier_575px.jpg" /></a></p>
<p>The migration of server platforms from DDR4 to DDR5, along with the rise of workloads demanding large RAM capacity (but not particularly sensitive to either memory bandwidth or latency), has opened up memory expansion modules as one of the first set of widely available CXL devices. Over the last couple of years, we have had product announcements from <a href="https://www.anandtech.com/show/21333">Samsung</a> and <a href="https://www.anandtech.com/show/20003">Micron</a> in this area.</p>
<h3>SK hynix CMM-DDR5 CXL Memory Module and HMSDK</h3>
<p>At FMS 2024, SK hynix was showing off their DDR5-based CMM-DDR5 CXL memory module with a 128 GB capacity. The company was also detailing their associated Heterogeneous Memory Software Development Kit (HMSDK) - a set of libraries and tools at both the kernel and user levels aimed at increasing the ease of use of CXL memory. This is achieved in part by considering the memory pyramid / hierarchy and relocating the data between the server's main memory (DRAM) and the CXL device based on usage frequency.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/skh-cmm-ddr5_575px.jpg" /></a></p>
<p>The CMM-DDR5 CXL memory module comes in the SDFF form-factor (E3.S 2T) with a PCIe 3.0 x8 host interface. The internal memory is based on 1α technology DRAM, and the device promises DDR5-class bandwidth and latency within a single NUMA hop. As these memory modules are meant to be used in datacenters and enterprises, the firmware includes features for RAS (reliability, availability, and serviceability) along with secure boot and other management features.</p>
<p>SK hynix was also demonstrating Niagara 2.0 - a hardware solution (currently based on FPGAs) to enable memory pooling and sharing - i.e, connecting multiple CXL memories to allow different hosts (CPUs and GPUs) to optimally share their capacity. The previous version only allowed capacity sharing, but the latest version enables sharing of data also. SK hynix had <a href="https://news.skhynix.com/sk-hynix-presents-ai-memory-solutions-at-cxl-devcon-2024/">presented</a> these solutions at the CXL DevCon 2024 earlier this year, but some progress seems to have been made in finalizing the specifications of the CMM-DDR5 at FMS 2024.</p>
<h3>Microchip and Micron Demonstrate CZ120 CXL Memory Expansion Module</h3>
<p>Micron had <a href="https://www.anandtech.com/show/20003/">unveiled</a> the CZ120 CXL Memory Expansion Module last year based on the Microchip SMC 2000 series CXL memory controller. At FMS 2024, Micron and Microchip had a demonstration of the module on a Granite Rapids server.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/mchip-micron_575px.jpg" /></a></p>
<p>Additional insights into the SMC 2000 controller were also provided.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/mchip-sm2000_575px.png" /></a></p>
<p>The CXL memory controller also incorporates DRAM die failure handling, and Microchip also provides diagnostics and debug tools to analyze failed modules. The memory controller also supports ECC, which forms part of the enterprise... Storage){kind=link}
![](https://www.pinterest.com/pin/create/button/?url=https://compbuddey.blogspot.com/2024/10/cxl-gathers-momentum-at-fms-2024-cxl_17.html&media=https://lh3.googleusercontent.com/blogger_img_proxy/AEn0k_sg2wnykvxS3fawcE6hx1PpEWfMIVbdu7dywhuXxvesi1S0eU2w31uTUm2zkSk7mlmj5Cem8-c-I40fLalcskqYFtjV3hRg3es_aTaFoiSfKzfsGjmtLfk7am1fqAm_&description=CXL Gathers Momentum at FMS 2024 <p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img src="https://images.anandtech.com/doci/21533/cxl-car-2_575px.jpg" alt="" /></a></p><p><p>The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had <a href="https://www.anandtech.com/show/17520/compute-express-link-cxl-30-announced-doubled-speeds-and-flexible-fabrics">announced</a> v3.0 of the CXL specifications. This was followed by CXL 3.1's <a href="https://www.businesswire.com/news/home/20231114332690/en/CXL-Consortium-Announces-Compute-Express-Link-3.1-Specification-Release">introduction</a> at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly <a href="https://www.anandtech.com/show/17519/">subsumed other competing standards</a> such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on the device side. At FMS 2024, CXL had a prime position in the booth demos of many vendors.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/cxl-mem-hier_575px.jpg" /></a></p>
<p>The migration of server platforms from DDR4 to DDR5, along with the rise of workloads demanding large RAM capacity (but not particularly sensitive to either memory bandwidth or latency), has opened up memory expansion modules as one of the first set of widely available CXL devices. Over the last couple of years, we have had product announcements from <a href="https://www.anandtech.com/show/21333">Samsung</a> and <a href="https://www.anandtech.com/show/20003">Micron</a> in this area.</p>
<h3>SK hynix CMM-DDR5 CXL Memory Module and HMSDK</h3>
<p>At FMS 2024, SK hynix was showing off their DDR5-based CMM-DDR5 CXL memory module with a 128 GB capacity. The company was also detailing their associated Heterogeneous Memory Software Development Kit (HMSDK) - a set of libraries and tools at both the kernel and user levels aimed at increasing the ease of use of CXL memory. This is achieved in part by considering the memory pyramid / hierarchy and relocating the data between the server's main memory (DRAM) and the CXL device based on usage frequency.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/skh-cmm-ddr5_575px.jpg" /></a></p>
<p>The CMM-DDR5 CXL memory module comes in the SDFF form-factor (E3.S 2T) with a PCIe 3.0 x8 host interface. The internal memory is based on 1α technology DRAM, and the device promises DDR5-class bandwidth and latency within a single NUMA hop. As these memory modules are meant to be used in datacenters and enterprises, the firmware includes features for RAS (reliability, availability, and serviceability) along with secure boot and other management features.</p>
<p>SK hynix was also demonstrating Niagara 2.0 - a hardware solution (currently based on FPGAs) to enable memory pooling and sharing - i.e, connecting multiple CXL memories to allow different hosts (CPUs and GPUs) to optimally share their capacity. The previous version only allowed capacity sharing, but the latest version enables sharing of data also. SK hynix had <a href="https://news.skhynix.com/sk-hynix-presents-ai-memory-solutions-at-cxl-devcon-2024/">presented</a> these solutions at the CXL DevCon 2024 earlier this year, but some progress seems to have been made in finalizing the specifications of the CMM-DDR5 at FMS 2024.</p>
<h3>Microchip and Micron Demonstrate CZ120 CXL Memory Expansion Module</h3>
<p>Micron had <a href="https://www.anandtech.com/show/20003/">unveiled</a> the CZ120 CXL Memory Expansion Module last year based on the Microchip SMC 2000 series CXL memory controller. At FMS 2024, Micron and Microchip had a demonstration of the module on a Granite Rapids server.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/mchip-micron_575px.jpg" /></a></p>
<p>Additional insights into the SMC 2000 controller were also provided.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/mchip-sm2000_575px.png" /></a></p>
<p>The CXL memory controller also incorporates DRAM die failure handling, and Microchip also provides diagnostics and debug tools to analyze failed modules. The memory controller also supports ECC, which forms part of the enterprise... Storage){kind=link}
![](https://web.whatsapp.com/send?text=CXL Gathers Momentum at FMS 2024 <p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img src="https://images.anandtech.com/doci/21533/cxl-car-2_575px.jpg" alt="" /></a></p><p><p>The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had <a href="https://www.anandtech.com/show/17520/compute-express-link-cxl-30-announced-doubled-speeds-and-flexible-fabrics">announced</a> v3.0 of the CXL specifications. This was followed by CXL 3.1's <a href="https://www.businesswire.com/news/home/20231114332690/en/CXL-Consortium-Announces-Compute-Express-Link-3.1-Specification-Release">introduction</a> at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly <a href="https://www.anandtech.com/show/17519/">subsumed other competing standards</a> such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on the device side. At FMS 2024, CXL had a prime position in the booth demos of many vendors.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/cxl-mem-hier_575px.jpg" /></a></p>
<p>The migration of server platforms from DDR4 to DDR5, along with the rise of workloads demanding large RAM capacity (but not particularly sensitive to either memory bandwidth or latency), has opened up memory expansion modules as one of the first set of widely available CXL devices. Over the last couple of years, we have had product announcements from <a href="https://www.anandtech.com/show/21333">Samsung</a> and <a href="https://www.anandtech.com/show/20003">Micron</a> in this area.</p>
<h3>SK hynix CMM-DDR5 CXL Memory Module and HMSDK</h3>
<p>At FMS 2024, SK hynix was showing off their DDR5-based CMM-DDR5 CXL memory module with a 128 GB capacity. The company was also detailing their associated Heterogeneous Memory Software Development Kit (HMSDK) - a set of libraries and tools at both the kernel and user levels aimed at increasing the ease of use of CXL memory. This is achieved in part by considering the memory pyramid / hierarchy and relocating the data between the server's main memory (DRAM) and the CXL device based on usage frequency.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/skh-cmm-ddr5_575px.jpg" /></a></p>
<p>The CMM-DDR5 CXL memory module comes in the SDFF form-factor (E3.S 2T) with a PCIe 3.0 x8 host interface. The internal memory is based on 1α technology DRAM, and the device promises DDR5-class bandwidth and latency within a single NUMA hop. As these memory modules are meant to be used in datacenters and enterprises, the firmware includes features for RAS (reliability, availability, and serviceability) along with secure boot and other management features.</p>
<p>SK hynix was also demonstrating Niagara 2.0 - a hardware solution (currently based on FPGAs) to enable memory pooling and sharing - i.e, connecting multiple CXL memories to allow different hosts (CPUs and GPUs) to optimally share their capacity. The previous version only allowed capacity sharing, but the latest version enables sharing of data also. SK hynix had <a href="https://news.skhynix.com/sk-hynix-presents-ai-memory-solutions-at-cxl-devcon-2024/">presented</a> these solutions at the CXL DevCon 2024 earlier this year, but some progress seems to have been made in finalizing the specifications of the CMM-DDR5 at FMS 2024.</p>
<h3>Microchip and Micron Demonstrate CZ120 CXL Memory Expansion Module</h3>
<p>Micron had <a href="https://www.anandtech.com/show/20003/">unveiled</a> the CZ120 CXL Memory Expansion Module last year based on the Microchip SMC 2000 series CXL memory controller. At FMS 2024, Micron and Microchip had a demonstration of the module on a Granite Rapids server.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/mchip-micron_575px.jpg" /></a></p>
<p>Additional insights into the SMC 2000 controller were also provided.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/mchip-sm2000_575px.png" /></a></p>
<p>The CXL memory controller also incorporates DRAM die failure handling, and Microchip also provides diagnostics and debug tools to analyze failed modules. The memory controller also supports ECC, which forms part of the enterprise... Storage | https://compbuddey.blogspot.com/2024/10/cxl-gathers-momentum-at-fms-2024-cxl_17.html){kind=link}
![](mailto:?subject=CXL Gathers Momentum at FMS 2024 <p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img src="https://images.anandtech.com/doci/21533/cxl-car-2_575px.jpg" alt="" /></a></p><p><p>The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had <a href="https://www.anandtech.com/show/17520/compute-express-link-cxl-30-announced-doubled-speeds-and-flexible-fabrics">announced</a> v3.0 of the CXL specifications. This was followed by CXL 3.1's <a href="https://www.businesswire.com/news/home/20231114332690/en/CXL-Consortium-Announces-Compute-Express-Link-3.1-Specification-Release">introduction</a> at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly <a href="https://www.anandtech.com/show/17519/">subsumed other competing standards</a> such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on the device side. At FMS 2024, CXL had a prime position in the booth demos of many vendors.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/cxl-mem-hier_575px.jpg" /></a></p>
<p>The migration of server platforms from DDR4 to DDR5, along with the rise of workloads demanding large RAM capacity (but not particularly sensitive to either memory bandwidth or latency), has opened up memory expansion modules as one of the first set of widely available CXL devices. Over the last couple of years, we have had product announcements from <a href="https://www.anandtech.com/show/21333">Samsung</a> and <a href="https://www.anandtech.com/show/20003">Micron</a> in this area.</p>
<h3>SK hynix CMM-DDR5 CXL Memory Module and HMSDK</h3>
<p>At FMS 2024, SK hynix was showing off their DDR5-based CMM-DDR5 CXL memory module with a 128 GB capacity. The company was also detailing their associated Heterogeneous Memory Software Development Kit (HMSDK) - a set of libraries and tools at both the kernel and user levels aimed at increasing the ease of use of CXL memory. This is achieved in part by considering the memory pyramid / hierarchy and relocating the data between the server's main memory (DRAM) and the CXL device based on usage frequency.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/skh-cmm-ddr5_575px.jpg" /></a></p>
<p>The CMM-DDR5 CXL memory module comes in the SDFF form-factor (E3.S 2T) with a PCIe 3.0 x8 host interface. The internal memory is based on 1α technology DRAM, and the device promises DDR5-class bandwidth and latency within a single NUMA hop. As these memory modules are meant to be used in datacenters and enterprises, the firmware includes features for RAS (reliability, availability, and serviceability) along with secure boot and other management features.</p>
<p>SK hynix was also demonstrating Niagara 2.0 - a hardware solution (currently based on FPGAs) to enable memory pooling and sharing - i.e, connecting multiple CXL memories to allow different hosts (CPUs and GPUs) to optimally share their capacity. The previous version only allowed capacity sharing, but the latest version enables sharing of data also. SK hynix had <a href="https://news.skhynix.com/sk-hynix-presents-ai-memory-solutions-at-cxl-devcon-2024/">presented</a> these solutions at the CXL DevCon 2024 earlier this year, but some progress seems to have been made in finalizing the specifications of the CMM-DDR5 at FMS 2024.</p>
<h3>Microchip and Micron Demonstrate CZ120 CXL Memory Expansion Module</h3>
<p>Micron had <a href="https://www.anandtech.com/show/20003/">unveiled</a> the CZ120 CXL Memory Expansion Module last year based on the Microchip SMC 2000 series CXL memory controller. At FMS 2024, Micron and Microchip had a demonstration of the module on a Granite Rapids server.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/mchip-micron_575px.jpg" /></a></p>
<p>Additional insights into the SMC 2000 controller were also provided.</p>
<p align="center"><a href="https://www.anandtech.com/show/21533/cxl-gathers-momentum-at-fms-2024"><img alt="" src="https://images.anandtech.com/doci/21533/mchip-sm2000_575px.png" /></a></p>
<p>The CXL memory controller also incorporates DRAM die failure handling, and Microchip also provides diagnostics and debug tools to analyze failed modules. The memory controller also supports ECC, which forms part of the enterprise... Storage&body=https://compbuddey.blogspot.com/2024/10/cxl-gathers-momentum-at-fms-2024-cxl_17.html){kind=link}
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Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
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