This week, Kioxia introduced its new 3D QLC NAND devices aimed at high-performance, high-capacity drives that could redefine what we typically expect from QLC-based SSDs. The components are 1 Tb and 2 Tb 3D QLC NAND ICs with a 3600 MT/s interface speed that could enable M.2-2230 SSDs with a 4 TB capacity and decent performance.
Kioxia's 1 Tb (128 MB) and 2 Tb (256 TB) 3D QLC NAND devices are made on the company's BICS 8 process technology and feature 238 active layers as well as CMOS directly Bonded to Array (CBA) design, which implies that CMOS (including interface and buffers circuitry) is built on a specialized node and bonded to the memory array. Such a manufacturing process enabled Kioxia (and its manufacturing partner Western Digital) to achieve a particularly high interface speed of 3600 MT/s.
In addition to being one of the industry's first 2 Tb QLC NAND devices, the component features a 70% higher write power efficiency compared to Kioxia's BICS 5 3D QLC NAND devices, which is a bit vague statement as the new ICs have higher capacity and performance in general. This feature will be valuable for data centre applications, though I do not expect someone to use 3D QLC memory for write-intensive applications in general. Yet, these devices will be just what the doctor ordered for AI: read-intensive, content distribution, and backup storage.
It is interesting to note that Kioxia's 1 Tb 3D QLC NAND, optimized for performance, has a 30% faster sequential write performance and a 15% lower read latency than the 2 Tb 3D QLC component. These qualities (alongside a 3600 MT/s interface) promise to make Kioxia's 1 Tb 3D QLC competitive even for higher-end PCIe Gen5 x4 SSDs, which currently exclusively use 3D TLC memory.
The remarkable storage density of Kioxia's 2Tb 3D QLC NAND devices will allow customers to create high-capacity SSDs in compact form factors. For instance, a 16-Hi stacked package (measuring 11.5 mm × 13.5 mm × 1.5 mm) can be used to build a 4TB M.2-2230 drive or a 16TB M.2-2280 drive. Even a single 16-Hi package could be enough to build a particularly fast client SSD.
Kioxia is now sampling its 2 Tb 3D QLC NAND BiCS 8 memory with customers, such as Pure Storage.
"We have a long-standing relationship with Kioxia and are delighted to incorporate their eighth-generation BiCS Flash 2Tb QLC flash memory products to enhance the performance and efficiency of our all-flash storage solutions," said Charles Giancarlo, CEO of Pure Storage. "Pure's unified all-flash data storage platform is able to meet the demanding needs of artificial intelligence as well as the aggressive costs of backup storage. Backed by Kioxia technology, Pure Storage will continue to offer unmatched performance, power efficiency, and reliability, delivering exceptional value to our customers."
"We are pleased to be shipping samples of our new 2Tb QLC with the new eighth-generation BiCS flash technology," said Hideshi Miyajima, CTO of Kioxia. "With its industry-leading high bit density, high speed data transfer, and superior power efficiency, the 2Tb QLC product will offer new value for rapidly emerging AI applications and large storage applications demanding power and space savings."
There is no word on when the 1 Tb 3D QLC BiCS 8 memory will be sampled or released to the market.
SSDsThe Lian Li Hydroshift LCD 360S AIO Cooler Review: Sleek, Stylish, and Lively Among the packed field of PC hardware manufacturers, Lian Li is a company that arguably shouldn't even need an introduction. The quirky company has developed a devout following thanks to its focus on premium-quality aluminum computer cases that, more often that not, and come with in some rather unique designs. Over the years, the company has developed a solid reputation for its meticulous craftsmanship, durability, and elegant aesthetics. And consequently, when the company made the decision to expand beyond aluminum cases and in to other PC peripherals, that development attracted quite a bit of attention to see what kind of a touch Lian Li could bring to the rest of the PC ecosystem. Lian Li's focus on premium products means that the company doesn't really make much in the way of products that are merely basic, and that kind of mentality has extended beyond cases and into the rest of their peripherals. Case in point is the subject of today's review: Lian Li's new all-in-one CPU cooler, the HydroShift LCD 360S AIO. Not content just to make a powerful 360 mm cooler, Lian Li has gone a step above by integrating recesses and other features to help hide the tubing around the cooler, and then for the coup de grace, added a high-quality 2.88-inch IPS display to the pump block. Overall, this new product marks a significant milestone for Lian Li, as it combines advanced cooling technology with the company's signature aesthetic appeal, making for a cooler that's aimed at both enthusiasts and professional users seeking high-end thermal performance and visual customization. Overall, the HydroShift LCD 360S is undeniably designed first and foremost with aesthetics in mind, but the shiny pump block is backed up with one of the most powerful 360 mm cooler designs on the market today. So Lian Li is throwing everything they have at the new HydroShift coolers. Overall, the 360S is part of a trio of HydroShift 360 mm coolers the company is launching this summer. All three share a similar design, although with some pump changes and the addition of RGB fan lighting, depending on the specific model, with the 360S effectively serving as the base model. Cases/Cooling/PSUs
SK hynix Wraps up Dev Work on High-End PCB01 PCIe 5.0 SSD for OEMs, Launching Later This Year SK hynix early in Friday announced that the company has finished the development of it's PCB01 PCIe Gen5 SSD, the company's forthcoming high-end SSD for OEMs. Based on the company's new Alistar platform, the PCB01 is designed to deliver chart-topping performance for client machines. And, as a sign of the times, SK hynix is positioning the PCB01 for AI PCs, looking to synergize with the overall industry interest in anything and everything AI. The bare, OEM-focused drives have previously been shown off by SK hynix, and make no attempt to hide what's under the hood. The PCB01 relies on SK hynix's Alistar controller, which features a PCIe Gen5 x4 host interface on the front end and eight NAND channels on the back end, placing it solidly in the realm of high-end SSDs. Paired with the Alistar controller is the company's latest 238-layer TLC NAND (H25T1TD48C & H25T2TD88C), which offers a maximum transfer speed of 2400 MT/second. Being that this is a high-end client SSD, there's also a DRAM chip on board, though the company isn't disclosing its capacity. As with other high-end PCIe 5.0 client SSDs, SK hynix is planning on hitting peak read speeds of up to 14GB/second on the drive, while peak sequential write speeds should top 12GB/second (with pSLC caching, of course) – performance figures well within the realm of possibility for an 8 channel drive. As for random performance, at Computex the company was telling attendees that the drives should be able to sustain 4K random read and write rates of 2 million IOPS, which is very high as well. The SSDs are also said to consume up to 30% less power than 'predecessors,' according to SK hynix, though the company didn't elaborate on that figure. Typically in the storage industry, energy figures are based on iso-performance (rather than peak performance) – essentially measuring energy efficiency per bit rather than toal power consumption – and that is likely the case here as well. At least initially, SK Hynix plans to release its PCB01 in three capacities – 512 GB, 1 TB, and 2 TB. The company has previously disclosed that their 238L TLC NAND has a capacity of 512Gbit, so these are typical capacity figures for single-sided drives. And while the focus of the company's press release this week was on OEM drives, this is the same controller and NAND that is also going into the company's previously-teased retail Platinum P51 SSD, so this week's reveal offers a bit more detail into what to expect from that drive family as well. Specs aside, Ahn Hyun, the Head of the N-S Committee at SK hynix, said that multiple global CPU providers for on-device AI PCs are seeking collaboration for the compatibility validation process, which is underway, so expect PCB01 drives inside PCs in this back-to-school and holiday seasons. "We will work towards enhancing our leadership as the global top AI memory provider also in the NAND solution space by successfully completing the customer validation and mass production of PCB01, which will be in the limelight," Ahn Hyun said. SSDs
One of the core challenges that Rapidus will face when it kicks off volume production of chips on its 2nm-class process technology in 2027 is lining up customers. With Intel, Samsung, and TSMC all slated to offer their own 2nm-class nodes by that time, Rapidus will need some kind of advantage to attract customers away from its more established rivals. To that end, the company thinks they've found their edge: fully automated packaging that will allow for shorter chip lead times than manned packaging operations.
In an interview with Nikkei, Rapidus' president, Atsuyoshi Koike, outlined the company's vision to use advanced packaging as a competitive edge for the new fab. The Hokkaido facility, which is currently under construction and is expecting to begin equipment installation this December, is already slated to both produce chips and offer advanced packaging services within the same facility, an industry first. But ultimately, Rapidus biggest plan to differentiate itself is by automating the back-end fab processes (chip packaging) to provide significantly faster turnaround times.
Rapidus is targetting back-end production in particular as, compared to front-end (lithography) production, back-end production still heavily relies on human labor. No other advanced packaging fab has fully automated the process thus far, which provides for a degree of flexibility, but slows throughput. But with automation in place to handle this aspect of chip production, Rapidus would be able to increase chip packaging efficiency and speed, which is crucial as chip assembly tasks become more complex. Rapidus is also collaborating with multiple Japanese suppliers to source materials for back-end production.
"In the past, Japanese chipmakers tried to keep their technology development exclusively in-house, which pushed up development costs and made them less competitive," Koike told Nikkei. "[Rapidus plans to] open up technology that should be standardized, bringing down costs, while handling important technology in-house."
Financially, Rapidus faces a significant challenge, needing a total of ¥5 trillion ($35 billion) by the time mass production starts in 2027. The company estimates that ¥2 trillion will be required by 2025 for prototype production. While the Japanese government has provided ¥920 billion in aid, Rapidus still needs to secure substantial funding from private investors.
Due to its lack of track record and experience of chip production as. well as limited visibility for success, Rapidus is finding it difficult to attract private financing. The company is in discussions with the government to make it easier to raise capital, including potential loan guarantees, and is hopeful that new legislation will assist in this effort.
SemiconductorsWestern Digital's BiCS8 218-layer 3D NAND is being put to good use in a wide range of client and enterprise platforms, including WD's upcoming Gen 5 client SSDs and 128 TB-class datacenter SSD. On the external storage front, the company demonstrated four different products: for card-based media, 4 TB microSDUC and 8 TB SDUC cards with UHS-I speeds, and on the portable SSD front we had two 16 TB drives. One will be a SanDisk Desk Drive with external power, and the other in the SanDisk Extreme Pro housing with a lanyard opening in the case.
All of these are using BiCS8 QLC NAND, though I did hear booth talk (as I was taking leave) that they were not supposed to divulge the use of QLC in these products. The 4 TB microSDUC and 8 TB SDUC cards are rated for UHS-I speeds. They are being marketed under the SanDisk Ultra branding.
The SanDisk Desk Drive is an external SSD with a 18W power adapter, and it has been in the market for a few months now. Initially launched in capacities up to 8 TB, Western Digital had promised a 16 TB version before the end of the year. It appears that the product is coming to retail quite soon. One aspect to note is that this drive has been using TLC for the SKUs that are currently in the market, so it appears unlikely that the 16 TB version would be QLC. The units (at least up to the 8 TB capacity point) come with two SN850XE drives. Given the recent introduction of the 8 TB SN850X, an 'E' version with tweaked firmware is likely to be present in the 16 TB Desk Drive.
The 16 TB portable SSD in the SanDisk Extreme housing was a technology demonstration. It is definitely the highest capacity bus-powered portable SSD demonstrated by any vendor at any trade show thus far. Given the 16 TB Desk Drive's imminent market introduction, it is just a matter of time before the technology demonstration of the bus-powered version becomes a retail reality.
StorageAt FMS 2024, the technological requirements from the storage and memory subsystem took center stage. Both SSD and controller vendors had various demonstrations touting their suitability for different stages of the AI data pipeline - ingestion, preparation, training, checkpointing, and inference. Vendors like Solidigm have different types of SSDs optimized for different stages of the pipeline. At the same time, controller vendors have taken advantage of one of the features introduced recently in the NVM Express standard - Flexible Data Placement (FDP).
FDP involves the host providing information / hints about the areas where the controller could place the incoming write data in order to reduce the write amplification. These hints are generated based on specific block sizes advertised by the device. The feature is completely backwards-compatible, with non-FDP hosts working just as before with FDP-enabled SSDs, and vice-versa.
Silicon Motion's MonTitan Gen 5 Enterprise SSD Platform was announced back in 2022. Since then, Silicon Motion has been touting the flexibility of the platform, allowing its customers to incorporate their own features as part of the customization process. This approach is common in the enterprise space, as we have seen with Marvell's Bravera SC5 SSD controller in the DapuStor SSDs and Microchip's Flashtec controllers in the Longsys FORESEE enterprise SSDs.
At FMS 2024, the company was demonstrating the advantages of flexible data placement by allowing a single QLC SSD based on their MonTitan platform to take part in different stages of the AI data pipeline while maintaining the required quality of service (minimum bandwidth) for each process. The company even has a trademarked name (PerformaShape) for the firmware feature in the controller that allows the isolation of different concurrent SSD accesses (from different stages in the AI data pipeline) to guarantee this QoS. Silicon Motion claims that this scheme will enable its customers to get the maximum write performance possible from QLC SSDs without negatively impacting the performance of other types of accesses.
Silicon Motion and Phison have market leadership in the client SSD controller market with similar approaches. However, their enterprise SSD controller marketing couldn't be more different. While Phison has gone in for a turnkey solution with their Gen 5 SSD platform (to the extent of not adopting the white label route for this generation, and instead opting to get the SSDs qualified with different cloud service providers themselves), Silicon Motion is opting for a different approach. The flexibility and customization possibilities can make platforms like the MonTitan appeal to flash array vendors.
StorageOne of the core challenges that Rapidus will face when it kicks off volume production of chips on its 2nm-class process technology in 2027 is lining up customers. With Intel, Samsung, and TSMC all slated to offer their own 2nm-class nodes by that time, Rapidus will need some kind of advantage to attract customers away from its more established rivals. To that end, the company thinks they've found their edge: fully automated packaging that will allow for shorter chip lead times than manned packaging operations.
In an interview with Nikkei, Rapidus' president, Atsuyoshi Koike, outlined the company's vision to use advanced packaging as a competitive edge for the new fab. The Hokkaido facility, which is currently under construction and is expecting to begin equipment installation this December, is already slated to both produce chips and offer advanced packaging services within the same facility, an industry first. But ultimately, Rapidus biggest plan to differentiate itself is by automating the back-end fab processes (chip packaging) to provide significantly faster turnaround times.
Rapidus is targetting back-end production in particular as, compared to front-end (lithography) production, back-end production still heavily relies on human labor. No other advanced packaging fab has fully automated the process thus far, which provides for a degree of flexibility, but slows throughput. But with automation in place to handle this aspect of chip production, Rapidus would be able to increase chip packaging efficiency and speed, which is crucial as chip assembly tasks become more complex. Rapidus is also collaborating with multiple Japanese suppliers to source materials for back-end production.
"In the past, Japanese chipmakers tried to keep their technology development exclusively in-house, which pushed up development costs and made them less competitive," Koike told Nikkei. "[Rapidus plans to] open up technology that should be standardized, bringing down costs, while handling important technology in-house."
Financially, Rapidus faces a significant challenge, needing a total of ¥5 trillion ($35 billion) by the time mass production starts in 2027. The company estimates that ¥2 trillion will be required by 2025 for prototype production. While the Japanese government has provided ¥920 billion in aid, Rapidus still needs to secure substantial funding from private investors.
Due to its lack of track record and experience of chip production as. well as limited visibility for success, Rapidus is finding it difficult to attract private financing. The company is in discussions with the government to make it easier to raise capital, including potential loan guarantees, and is hopeful that new legislation will assist in this effort.
SemiconductorsWestern Digital's BiCS8 218-layer 3D NAND is being put to good use in a wide range of client and enterprise platforms, including WD's upcoming Gen 5 client SSDs and 128 TB-class datacenter SSD. On the external storage front, the company demonstrated four different products: for card-based media, 4 TB microSDUC and 8 TB SDUC cards with UHS-I speeds, and on the portable SSD front we had two 16 TB drives. One will be a SanDisk Desk Drive with external power, and the other in the SanDisk Extreme Pro housing with a lanyard opening in the case.
All of these are using BiCS8 QLC NAND, though I did hear booth talk (as I was taking leave) that they were not supposed to divulge the use of QLC in these products. The 4 TB microSDUC and 8 TB SDUC cards are rated for UHS-I speeds. They are being marketed under the SanDisk Ultra branding.
The SanDisk Desk Drive is an external SSD with a 18W power adapter, and it has been in the market for a few months now. Initially launched in capacities up to 8 TB, Western Digital had promised a 16 TB version before the end of the year. It appears that the product is coming to retail quite soon. One aspect to note is that this drive has been using TLC for the SKUs that are currently in the market, so it appears unlikely that the 16 TB version would be QLC. The units (at least up to the 8 TB capacity point) come with two SN850XE drives. Given the recent introduction of the 8 TB SN850X, an 'E' version with tweaked firmware is likely to be present in the 16 TB Desk Drive.
The 16 TB portable SSD in the SanDisk Extreme housing was a technology demonstration. It is definitely the highest capacity bus-powered portable SSD demonstrated by any vendor at any trade show thus far. Given the 16 TB Desk Drive's imminent market introduction, it is just a matter of time before the technology demonstration of the bus-powered version becomes a retail reality.
StorageAt FMS 2024, the technological requirements from the storage and memory subsystem took center stage. Both SSD and controller vendors had various demonstrations touting their suitability for different stages of the AI data pipeline - ingestion, preparation, training, checkpointing, and inference. Vendors like Solidigm have different types of SSDs optimized for different stages of the pipeline. At the same time, controller vendors have taken advantage of one of the features introduced recently in the NVM Express standard - Flexible Data Placement (FDP).
FDP involves the host providing information / hints about the areas where the controller could place the incoming write data in order to reduce the write amplification. These hints are generated based on specific block sizes advertised by the device. The feature is completely backwards-compatible, with non-FDP hosts working just as before with FDP-enabled SSDs, and vice-versa.
Silicon Motion's MonTitan Gen 5 Enterprise SSD Platform was announced back in 2022. Since then, Silicon Motion has been touting the flexibility of the platform, allowing its customers to incorporate their own features as part of the customization process. This approach is common in the enterprise space, as we have seen with Marvell's Bravera SC5 SSD controller in the DapuStor SSDs and Microchip's Flashtec controllers in the Longsys FORESEE enterprise SSDs.
At FMS 2024, the company was demonstrating the advantages of flexible data placement by allowing a single QLC SSD based on their MonTitan platform to take part in different stages of the AI data pipeline while maintaining the required quality of service (minimum bandwidth) for each process. The company even has a trademarked name (PerformaShape) for the firmware feature in the controller that allows the isolation of different concurrent SSD accesses (from different stages in the AI data pipeline) to guarantee this QoS. Silicon Motion claims that this scheme will enable its customers to get the maximum write performance possible from QLC SSDs without negatively impacting the performance of other types of accesses.
Silicon Motion and Phison have market leadership in the client SSD controller market with similar approaches. However, their enterprise SSD controller marketing couldn't be more different. While Phison has gone in for a turnkey solution with their Gen 5 SSD platform (to the extent of not adopting the white label route for this generation, and instead opting to get the SSDs qualified with different cloud service providers themselves), Silicon Motion is opting for a different approach. The flexibility and customization possibilities can make platforms like the MonTitan appeal to flash array vendors.
StorageOne of the core challenges that Rapidus will face when it kicks off volume production of chips on its 2nm-class process technology in 2027 is lining up customers. With Intel, Samsung, and TSMC all slated to offer their own 2nm-class nodes by that time, Rapidus will need some kind of advantage to attract customers away from its more established rivals. To that end, the company thinks they've found their edge: fully automated packaging that will allow for shorter chip lead times than manned packaging operations.
In an interview with Nikkei, Rapidus' president, Atsuyoshi Koike, outlined the company's vision to use advanced packaging as a competitive edge for the new fab. The Hokkaido facility, which is currently under construction and is expecting to begin equipment installation this December, is already slated to both produce chips and offer advanced packaging services within the same facility, an industry first. But ultimately, Rapidus biggest plan to differentiate itself is by automating the back-end fab processes (chip packaging) to provide significantly faster turnaround times.
Rapidus is targetting back-end production in particular as, compared to front-end (lithography) production, back-end production still heavily relies on human labor. No other advanced packaging fab has fully automated the process thus far, which provides for a degree of flexibility, but slows throughput. But with automation in place to handle this aspect of chip production, Rapidus would be able to increase chip packaging efficiency and speed, which is crucial as chip assembly tasks become more complex. Rapidus is also collaborating with multiple Japanese suppliers to source materials for back-end production.
"In the past, Japanese chipmakers tried to keep their technology development exclusively in-house, which pushed up development costs and made them less competitive," Koike told Nikkei. "[Rapidus plans to] open up technology that should be standardized, bringing down costs, while handling important technology in-house."
Financially, Rapidus faces a significant challenge, needing a total of ¥5 trillion ($35 billion) by the time mass production starts in 2027. The company estimates that ¥2 trillion will be required by 2025 for prototype production. While the Japanese government has provided ¥920 billion in aid, Rapidus still needs to secure substantial funding from private investors.
Due to its lack of track record and experience of chip production as. well as limited visibility for success, Rapidus is finding it difficult to attract private financing. The company is in discussions with the government to make it easier to raise capital, including potential loan guarantees, and is hopeful that new legislation will assist in this effort.
SemiconductorsG.Skill on Tuesday introduced its ultra-low-latency DDR5-6400 memory modules that feature a CAS latency of 30 clocks, which appears to be the industry's most aggressive timings yet for DDR5-6400 sticks. The modules will be available for both AMD and Intel CPU-based systems.
With every new generation of DDR memory comes an increase in data transfer rates and an extension of relative latencies. While for the vast majority of applications, the increased bandwidth offsets the performance impact of higher timings, there are applications that favor low latencies. However, shrinking latencies is sometimes harder than increasing data transfer rates, which is why low-latency modules are rare.
Nonetheless, G.Skill has apparently managed to cherry-pick enough DDR5 memory chips and build appropriate printed circuit boards to produce DDR5-6400 modules with CL30 timings, which are substantially lower than the CL46 timings recommended by JEDEC for this speed bin. This means that while JEDEC-standard modules have an absolute latency of 14.375 ns, G.Skill's modules can boast a latency of just 9.375 ns – an approximately 35% decrease.
G.Skill's DDR5-6400 CL30 39-39-102 modules have a capacity of 16 GB and will be available in 32 GB dual-channel kits, though the company does not disclose voltages, which are likely considerably higher than those standardized by JEDEC.
The company plans to make its DDR5-6400 modules available both for AMD systems with EXPO profiles (Trident Z5 Neo RGB and Trident Z5 Royal Neo) and for Intel-powered PCs with XMP 3.0 profiles (Trident Z5 RGB and Trident Z5 Royal). For AMD AM5 systems that have a practical limitation of 6000 MT/s – 6400 MT/s for DDR5 memory (as this is roughly as fast as AMD's Infinity Fabric can operate at with a 1:1 ratio), the new modules will be particularly beneficial for AMD's Ryzen 7000 and Ryzen 9000-series processors.
G.Skill notes that since its modules are non-standard, they will not work with all systems but will operate on high-end motherboards with properly cooled CPUs.
The new ultra-low-latency memory kits will be available worldwide from G.Skill's partners starting in late August 2024. The company did not disclose the pricing of these modules, but since we are talking about premium products that boast unique specifications, they are likely to be priced accordingly.
MemoryA few years back, the Japanese government's New Energy and Industrial Technology Development Organization (NEDO ) allocated funding for the development of green datacenter technologies. With the aim to obtain up to 40% savings in overall power consumption, several Japanese companies have been developing an optical interface for their enterprise SSDs. And at this year's FMS, Kioxia had their optical interface on display.
For this demonstration, Kioxia took its existing CM7 enterprise SSD and created an optical interface for it. A PCIe card with on-board optics developed by Kyocera is installed in the server slot. An optical interface allows data transfer over long distances (it was 40m in the demo, but Kioxia promises lengths of up to 100m for the cable in the future). This allows the storage to be kept in a separate room with minimal cooling requirements compared to the rack with the CPUs and GPUs. Disaggregation of different server components will become an option as very high throughput interfaces such as PCIe 7.0 (with 128 GT/s rates) become available.
The demonstration of the optical SSD showed a slight loss in IOPS performance, but a significant advantage in the latency metric over the shipping enterprise SSD behind a copper network link. Obviously, there are advantages in wiring requirements and signal integrity maintenance with optical links.
Being a proof-of-concept demonstration, we do see the requirement for an industry-standard approach if this were to gain adoption among different datacenter vendors. The PCI-SIG optical workgroup will need to get its act together soon to create a standards-based approach to this problem.
StorageOne of the core challenges that Rapidus will face when it kicks off volume production of chips on its 2nm-class process technology in 2027 is lining up customers. With Intel, Samsung, and TSMC all slated to offer their own 2nm-class nodes by that time, Rapidus will need some kind of advantage to attract customers away from its more established rivals. To that end, the company thinks they've found their edge: fully automated packaging that will allow for shorter chip lead times than manned packaging operations.
In an interview with Nikkei, Rapidus' president, Atsuyoshi Koike, outlined the company's vision to use advanced packaging as a competitive edge for the new fab. The Hokkaido facility, which is currently under construction and is expecting to begin equipment installation this December, is already slated to both produce chips and offer advanced packaging services within the same facility, an industry first. But ultimately, Rapidus biggest plan to differentiate itself is by automating the back-end fab processes (chip packaging) to provide significantly faster turnaround times.
Rapidus is targetting back-end production in particular as, compared to front-end (lithography) production, back-end production still heavily relies on human labor. No other advanced packaging fab has fully automated the process thus far, which provides for a degree of flexibility, but slows throughput. But with automation in place to handle this aspect of chip production, Rapidus would be able to increase chip packaging efficiency and speed, which is crucial as chip assembly tasks become more complex. Rapidus is also collaborating with multiple Japanese suppliers to source materials for back-end production.
"In the past, Japanese chipmakers tried to keep their technology development exclusively in-house, which pushed up development costs and made them less competitive," Koike told Nikkei. "[Rapidus plans to] open up technology that should be standardized, bringing down costs, while handling important technology in-house."
Financially, Rapidus faces a significant challenge, needing a total of ¥5 trillion ($35 billion) by the time mass production starts in 2027. The company estimates that ¥2 trillion will be required by 2025 for prototype production. While the Japanese government has provided ¥920 billion in aid, Rapidus still needs to secure substantial funding from private investors.
Due to its lack of track record and experience of chip production as. well as limited visibility for success, Rapidus is finding it difficult to attract private financing. The company is in discussions with the government to make it easier to raise capital, including potential loan guarantees, and is hopeful that new legislation will assist in this effort.
SemiconductorsOne of the core challenges that Rapidus will face when it kicks off volume production of chips on its 2nm-class process technology in 2027 is lining up customers. With Intel, Samsung, and TSMC all slated to offer their own 2nm-class nodes by that time, Rapidus will need some kind of advantage to attract customers away from its more established rivals. To that end, the company thinks they've found their edge: fully automated packaging that will allow for shorter chip lead times than manned packaging operations.
In an interview with Nikkei, Rapidus' president, Atsuyoshi Koike, outlined the company's vision to use advanced packaging as a competitive edge for the new fab. The Hokkaido facility, which is currently under construction and is expecting to begin equipment installation this December, is already slated to both produce chips and offer advanced packaging services within the same facility, an industry first. But ultimately, Rapidus biggest plan to differentiate itself is by automating the back-end fab processes (chip packaging) to provide significantly faster turnaround times.
Rapidus is targetting back-end production in particular as, compared to front-end (lithography) production, back-end production still heavily relies on human labor. No other advanced packaging fab has fully automated the process thus far, which provides for a degree of flexibility, but slows throughput. But with automation in place to handle this aspect of chip production, Rapidus would be able to increase chip packaging efficiency and speed, which is crucial as chip assembly tasks become more complex. Rapidus is also collaborating with multiple Japanese suppliers to source materials for back-end production.
"In the past, Japanese chipmakers tried to keep their technology development exclusively in-house, which pushed up development costs and made them less competitive," Koike told Nikkei. "[Rapidus plans to] open up technology that should be standardized, bringing down costs, while handling important technology in-house."
Financially, Rapidus faces a significant challenge, needing a total of ¥5 trillion ($35 billion) by the time mass production starts in 2027. The company estimates that ¥2 trillion will be required by 2025 for prototype production. While the Japanese government has provided ¥920 billion in aid, Rapidus still needs to secure substantial funding from private investors.
Due to its lack of track record and experience of chip production as. well as limited visibility for success, Rapidus is finding it difficult to attract private financing. The company is in discussions with the government to make it easier to raise capital, including potential loan guarantees, and is hopeful that new legislation will assist in this effort.
SemiconductorsWestern Digital's BiCS8 218-layer 3D NAND is being put to good use in a wide range of client and enterprise platforms, including WD's upcoming Gen 5 client SSDs and 128 TB-class datacenter SSD. On the external storage front, the company demonstrated four different products: for card-based media, 4 TB microSDUC and 8 TB SDUC cards with UHS-I speeds, and on the portable SSD front we had two 16 TB drives. One will be a SanDisk Desk Drive with external power, and the other in the SanDisk Extreme Pro housing with a lanyard opening in the case.
All of these are using BiCS8 QLC NAND, though I did hear booth talk (as I was taking leave) that they were not supposed to divulge the use of QLC in these products. The 4 TB microSDUC and 8 TB SDUC cards are rated for UHS-I speeds. They are being marketed under the SanDisk Ultra branding.
The SanDisk Desk Drive is an external SSD with a 18W power adapter, and it has been in the market for a few months now. Initially launched in capacities up to 8 TB, Western Digital had promised a 16 TB version before the end of the year. It appears that the product is coming to retail quite soon. One aspect to note is that this drive has been using TLC for the SKUs that are currently in the market, so it appears unlikely that the 16 TB version would be QLC. The units (at least up to the 8 TB capacity point) come with two SN850XE drives. Given the recent introduction of the 8 TB SN850X, an 'E' version with tweaked firmware is likely to be present in the 16 TB Desk Drive.
The 16 TB portable SSD in the SanDisk Extreme housing was a technology demonstration. It is definitely the highest capacity bus-powered portable SSD demonstrated by any vendor at any trade show thus far. Given the 16 TB Desk Drive's imminent market introduction, it is just a matter of time before the technology demonstration of the bus-powered version becomes a retail reality.
StorageAt FMS 2024, the technological requirements from the storage and memory subsystem took center stage. Both SSD and controller vendors had various demonstrations touting their suitability for different stages of the AI data pipeline - ingestion, preparation, training, checkpointing, and inference. Vendors like Solidigm have different types of SSDs optimized for different stages of the pipeline. At the same time, controller vendors have taken advantage of one of the features introduced recently in the NVM Express standard - Flexible Data Placement (FDP).
FDP involves the host providing information / hints about the areas where the controller could place the incoming write data in order to reduce the write amplification. These hints are generated based on specific block sizes advertised by the device. The feature is completely backwards-compatible, with non-FDP hosts working just as before with FDP-enabled SSDs, and vice-versa.
Silicon Motion's MonTitan Gen 5 Enterprise SSD Platform was announced back in 2022. Since then, Silicon Motion has been touting the flexibility of the platform, allowing its customers to incorporate their own features as part of the customization process. This approach is common in the enterprise space, as we have seen with Marvell's Bravera SC5 SSD controller in the DapuStor SSDs and Microchip's Flashtec controllers in the Longsys FORESEE enterprise SSDs.
At FMS 2024, the company was demonstrating the advantages of flexible data placement by allowing a single QLC SSD based on their MonTitan platform to take part in different stages of the AI data pipeline while maintaining the required quality of service (minimum bandwidth) for each process. The company even has a trademarked name (PerformaShape) for the firmware feature in the controller that allows the isolation of different concurrent SSD accesses (from different stages in the AI data pipeline) to guarantee this QoS. Silicon Motion claims that this scheme will enable its customers to get the maximum write performance possible from QLC SSDs without negatively impacting the performance of other types of accesses.
Silicon Motion and Phison have market leadership in the client SSD controller market with similar approaches. However, their enterprise SSD controller marketing couldn't be more different. While Phison has gone in for a turnkey solution with their Gen 5 SSD platform (to the extent of not adopting the white label route for this generation, and instead opting to get the SSDs qualified with different cloud service providers themselves), Silicon Motion is opting for a different approach. The flexibility and customization possibilities can make platforms like the MonTitan appeal to flash array vendors.
Storage
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