Best Buy Briefly Lists AMD's Ryzen 9000 CPUs: From $279 to $599
Although AMD delayed launch of its Ryzen 9000-series processors based on the Zen 5 microarchitecture from July 31, to early and mid-August, the company's partner (and major US retailer) Best Buy briefly began listing the new CPUs today, revealing a very plausible set of launch prices. As per the retailer's product catalog, the most affordable unlocked Zen 5-based processor will cost $279, whereas the highest-performing Zen 5-powered CPU will cost $599 at launch.
AMD will start its Ryzen 9000 series rollout from relatively inexpensive six-core Ryzen 5 9600X and eight-core Ryzen 7 9700X on August 8. Per the Best Buy listing, the Ryzen 5 9600X will cost $279, whereas the Ryzen 7 9700X will carry a recommended price tag of $359. Meanwhile, The more advanced 12-core Ryzen 9 9900X and 16-core Ryzen 9 9950X will hit the market on August 15 at MSRPs of $449 and $599, respectively, based on the Best Buy listing.
| AMD Ryzen 9000 Series Processors Zen 5 Microarchitecture (Granite Ridge) |
|||||||
| AnandTech | Cores / Threads |
Base Freq |
Turbo Freq |
L2 Cache |
L3 Cache |
TDP | MSRP |
| Ryzen 9 9950X | 16C / 32T | 4.3GHz | 5.7GHz | 16 MB | 64 MB | 170 W | $599 |
| Ryzen 9 9900X | 12C / 24T | 4.4GHz | 5.6GHz | 12 MB | 64 MB | 120 W | $449 |
| Ryzen 7 9700X | 8C / 16T | 3.8GHz | 5.5GHz | 8 MB | 32 MB | 65 W | $359 |
| Ryzen 5 9600X | 6C / 12T | 3.9GHz | 5.4GHz | 6 MB | 32 MB | 65 W | $279 |
It is noteworthy that when compared to the launch prices of the Zen 4-based Ryzen 7000 processors, the new Zen 5-powered Ryzen 9000 CPUs come in cheaper. The range topping Ryzen 9 5950X started at $799 in 2020, while the Ryzen 9 7950X had a recommended $699 price tag in 2022. By contrast, the top-end Ryzen 9 9950X is listed at $599. Both Ryzen 7 5600X and Ryzen 7 7600X cost $299 at launch, while the upcoming Ryzen 5 9600X will apparently be priced at $279 at launch.
As always with accidental retailer listings, it should be emphasized that AMD has not yet announced official pricing for their Ryzen 9000 CPUs. Given Best Buy's status as one of the largest US electronics retailers, these prices carry a very high probability of being accurate; but none the less, they should be taken with a grain of salt – if only because last-minute price changes are not unheard of with new CPU launches.
Source: Best Buy (via @momomo_us)
CPUs
Posted by The Techinical Support
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling 
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025 
In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, TSMC also shared progress of its N2 node as part of its Symposiums 2024. The company's first 2nm-class fabrication node, and predominantly featuring gate-all-around transistors, according to TSMC N2 has almost achieved its target performance and yield goals, which places it on track to enter high-volume manufacturing in the second half of 2025.
TSMC states that 'N2 development is well on track and N2P is next.' In particular, gate-all-around nanosheet devices currently achieve over 90% of their expected performance, whereas yields of 256 Mb SRAM (32 MB) devices already exceeds 80%, depending on the batch. All of this for a node that is over a year away from mass production.
Meanwhile, average yield of a 256 Mb SRAM was around 70% as of March, 2024, up from around 35% in April, 2023. Device performance has also been improving with higher frequencies being achieved while keeping power consumption in check.
Chip designer interest towards TSMC's first 2nm-class gate-all-around nanosheet transistor-based technology is significant, too. The number of new tape-outs (NTOs) in the first year of N2 is over two-times higher than it was for N5. Though with that said, given TSMC's close working relationship with a handful of high-volume vendors – most notably Appe – NTOs can be a very misleading figure since the first year of a new node at TSMC is capacity constrained, and consequently the bulk of that capacity goes to TSMC's priority partners.
Meanwhile, there were considerably more N5 tapeouts in its second year (some where N5P, of course) and N2 promises to have 2.6X more NTOs in its second year. So the node indeed looks quite promising. In fact, based on TSMC's slides (which we're unfortunately not able to republish), N2 is more popular than N3 in terms of NTOs both in the first and the second years of existence.
When it comes to the second year of N2, in the second half of 2026 TSMC plans to roll out its N2P technology, which promises additional performance and power benefits. N2P is expected to improve frequency by 15% - 20%, reduce power consumption by 30% - 40%, and increase chip density by over 1.15 times compared to N3E, significant benefits to move to all-new GAA nanosheet transistors.
Finally, for those companies that need the best in performance, power, and density, TSMC is poised to offer their A16 process in 2026. That node will also bring in backside power delivery, which will add costs, but is expected to greatly improve performance efficiency and scaling.
Semiconductors
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025
In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, TSMC also shared progress of its N2 node as part of its Symposiums 2024. The company's first 2nm-class fabrication node, and predominantly featuring gate-all-around transistors, according to TSMC N2 has almost achieved its target performance and yield goals, which places it on track to enter high-volume manufacturing in the second half of 2025.
TSMC states that 'N2 development is well on track and N2P is next.' In particular, gate-all-around nanosheet devices currently achieve over 90% of their expected performance, whereas yields of 256 Mb SRAM (32 MB) devices already exceeds 80%, depending on the batch. All of this for a node that is over a year away from mass production.
Meanwhile, average yield of a 256 Mb SRAM was around 70% as of March, 2024, up from around 35% in April, 2023. Device performance has also been improving with higher frequencies being achieved while keeping power consumption in check.
Chip designer interest towards TSMC's first 2nm-class gate-all-around nanosheet transistor-based technology is significant, too. The number of new tape-outs (NTOs) in the first year of N2 is over two-times higher than it was for N5. Though with that said, given TSMC's close working relationship with a handful of high-volume vendors – most notably Appe – NTOs can be a very misleading figure since the first year of a new node at TSMC is capacity constrained, and consequently the bulk of that capacity goes to TSMC's priority partners.
Meanwhile, there were considerably more N5 tapeouts in its second year (some where N5P, of course) and N2 promises to have 2.6X more NTOs in its second year. So the node indeed looks quite promising. In fact, based on TSMC's slides (which we're unfortunately not able to republish), N2 is more popular than N3 in terms of NTOs both in the first and the second years of existence.
When it comes to the second year of N2, in the second half of 2026 TSMC plans to roll out its N2P technology, which promises additional performance and power benefits. N2P is expected to improve frequency by 15% - 20%, reduce power consumption by 30% - 40%, and increase chip density by over 1.15 times compared to N3E, significant benefits to move to all-new GAA nanosheet transistors.
Finally, for those companies that need the best in performance, power, and density, TSMC is poised to offer their A16 process in 2026. That node will also bring in backside power delivery, which will add costs, but is expected to greatly improve performance efficiency and scaling.
Semiconductors
![](https://twitter.com/share?url=https://compbuddey.blogspot.com/2024/08/best-buy-briefly-lists-amds-ryzen-9000_3.html&text=Best Buy Briefly Lists AMD's Ryzen 9000 CPUs: From $279 to $599 <p align="center"><a href="https://www.anandtech.com/show/21495/best-buy-lists-amds-ryzen-9000-cpus-from-279-to-599"><img src="https://images.anandtech.com/doci/21495/2613900-amd-ryzen-9000-series-processor-tile_575px.jpg" alt="" /></a></p><p><p>Although AMD delayed launch of its Ryzen 9000-series processors based on the Zen 5 microarchitecture from July 31, to early and mid-August, the company's partner (and major US retailer) Best Buy briefly began listing the new CPUs today, revealing a very plausible set of launch prices. As per the retailer's product catalog, the most affordable unlocked Zen 5-based processor will cost $279, whereas the highest-performing Zen 5-powered CPU will cost $599 at launch.</p>
<p>AMD will start its Ryzen 9000 series rollout from relatively inexpensive six-core Ryzen 5 9600X and eight-core Ryzen 7 9700X on August 8. Per the Best Buy listing, the Ryzen 5 9600X will cost $279, whereas the Ryzen 7 9700X will carry a recommended price tag of $359. Meanwhile, The more advanced 12-core Ryzen 9 9900X and 16-core Ryzen 9 9950X will hit the market on August 15 at MSRPs of $449 and $599, respectively, based on the Best Buy listing.</p>
<table border="0" style="text-align:center" width="95%">
<tbody>
<tr class="tgrey">
<td colspan="8">AMD Ryzen 9000 Series Processors<br />
Zen 5 Microarchitecture (Granite Ridge)</td>
</tr>
<tr class="tlblue">
<td><em>AnandTech</em></td>
<td>Cores /<br />
Threads</td>
<td>Base<br />
Freq</td>
<td>Turbo<br />
Freq</td>
<td>L2<br />
Cache</td>
<td>L3<br />
Cache</td>
<td>TDP</td>
<td>MSRP</td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 9 9950X</b></td>
<td>16C / 32T</td>
<td>4.3GHz</td>
<td>5.7GHz</td>
<td>16 MB</td>
<td>64 MB</td>
<td>170 W</td>
<td><em>$599</em></td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 9 9900X</b></td>
<td>12C / 24T</td>
<td>4.4GHz</td>
<td>5.6GHz</td>
<td>12 MB</td>
<td>64 MB</td>
<td>120 W</td>
<td><em>$449</em></td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 7 9700X</b></td>
<td>8C / 16T</td>
<td>3.8GHz</td>
<td>5.5GHz</td>
<td>8 MB</td>
<td>32 MB</td>
<td>65 W</td>
<td><em>$359</em></td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 5 9600X</b></td>
<td>6C / 12T</td>
<td>3.9GHz</td>
<td>5.4GHz</td>
<td>6 MB</td>
<td>32 MB</td>
<td>65 W</td>
<td><em>$279</em></td>
</tr>
</tbody>
</table>
<p>It is noteworthy that when compared to the launch prices of the Zen 4-based Ryzen 7000 processors, the new Zen 5-powered Ryzen 9000 CPUs come in cheaper. The range topping Ryzen 9 5950X started at $799 in 2020, while the Ryzen 9 7950X had a recommended $699 price tag in 2022. By contrast, the top-end Ryzen 9 9950X is listed at $599. Both Ryzen 7 5600X and Ryzen 7 7600X cost $299 at launch, while the upcoming Ryzen 5 9600X will apparently be priced at $279 at launch.</p>
<p>As always with accidental retailer listings, it should be emphasized that AMD has not yet announced official pricing for their Ryzen 9000 CPUs. Given Best Buy's status as one of the largest US electronics retailers, these prices carry a very high probability of being accurate; but none the less, they should be taken with a grain of salt – if only because last-minute price changes are not unheard of with new CPU launches.</p>
<p style="text-align: center;"><a href="https://www.anandtech.com/show/21495/best-buy-lists-amds-ryzen-9000-cpus-from-279-to-599"><img alt="" src="https://images.anandtech.com/doci/21495/GT0TH6zbwAMc9hj_575px.png" /></a></p>
<p>Source: <a href="http://www.bestbuy.com">Best Buy</a> (via <a href="https://x.com/momomo_us/status/1818631374707761456">@momomo_us</a>)</p>
</p> CPUs){kind=link}
![](https://www.pinterest.com/pin/create/button/?url=https://compbuddey.blogspot.com/2024/08/best-buy-briefly-lists-amds-ryzen-9000_3.html&media=https://lh3.googleusercontent.com/blogger_img_proxy/AEn0k_uSPcfMFLdpLYPhawgiORx17KObV7UcOkH3zYOflWR_hd4BTlF7mU4FEd_bfb9XZAqghPpt4Ls3psF2SI994XH6BrECt4yEc7gSzv9205QSKb70wVX-zSgbqgQbSzBedijA0JCLmiZEQ97q_sKUC5smjFVGRL3VBCSc6gm0a_CBb3g&description=Best Buy Briefly Lists AMD's Ryzen 9000 CPUs: From $279 to $599 <p align="center"><a href="https://www.anandtech.com/show/21495/best-buy-lists-amds-ryzen-9000-cpus-from-279-to-599"><img src="https://images.anandtech.com/doci/21495/2613900-amd-ryzen-9000-series-processor-tile_575px.jpg" alt="" /></a></p><p><p>Although AMD delayed launch of its Ryzen 9000-series processors based on the Zen 5 microarchitecture from July 31, to early and mid-August, the company's partner (and major US retailer) Best Buy briefly began listing the new CPUs today, revealing a very plausible set of launch prices. As per the retailer's product catalog, the most affordable unlocked Zen 5-based processor will cost $279, whereas the highest-performing Zen 5-powered CPU will cost $599 at launch.</p>
<p>AMD will start its Ryzen 9000 series rollout from relatively inexpensive six-core Ryzen 5 9600X and eight-core Ryzen 7 9700X on August 8. Per the Best Buy listing, the Ryzen 5 9600X will cost $279, whereas the Ryzen 7 9700X will carry a recommended price tag of $359. Meanwhile, The more advanced 12-core Ryzen 9 9900X and 16-core Ryzen 9 9950X will hit the market on August 15 at MSRPs of $449 and $599, respectively, based on the Best Buy listing.</p>
<table border="0" style="text-align:center" width="95%">
<tbody>
<tr class="tgrey">
<td colspan="8">AMD Ryzen 9000 Series Processors<br />
Zen 5 Microarchitecture (Granite Ridge)</td>
</tr>
<tr class="tlblue">
<td><em>AnandTech</em></td>
<td>Cores /<br />
Threads</td>
<td>Base<br />
Freq</td>
<td>Turbo<br />
Freq</td>
<td>L2<br />
Cache</td>
<td>L3<br />
Cache</td>
<td>TDP</td>
<td>MSRP</td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 9 9950X</b></td>
<td>16C / 32T</td>
<td>4.3GHz</td>
<td>5.7GHz</td>
<td>16 MB</td>
<td>64 MB</td>
<td>170 W</td>
<td><em>$599</em></td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 9 9900X</b></td>
<td>12C / 24T</td>
<td>4.4GHz</td>
<td>5.6GHz</td>
<td>12 MB</td>
<td>64 MB</td>
<td>120 W</td>
<td><em>$449</em></td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 7 9700X</b></td>
<td>8C / 16T</td>
<td>3.8GHz</td>
<td>5.5GHz</td>
<td>8 MB</td>
<td>32 MB</td>
<td>65 W</td>
<td><em>$359</em></td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 5 9600X</b></td>
<td>6C / 12T</td>
<td>3.9GHz</td>
<td>5.4GHz</td>
<td>6 MB</td>
<td>32 MB</td>
<td>65 W</td>
<td><em>$279</em></td>
</tr>
</tbody>
</table>
<p>It is noteworthy that when compared to the launch prices of the Zen 4-based Ryzen 7000 processors, the new Zen 5-powered Ryzen 9000 CPUs come in cheaper. The range topping Ryzen 9 5950X started at $799 in 2020, while the Ryzen 9 7950X had a recommended $699 price tag in 2022. By contrast, the top-end Ryzen 9 9950X is listed at $599. Both Ryzen 7 5600X and Ryzen 7 7600X cost $299 at launch, while the upcoming Ryzen 5 9600X will apparently be priced at $279 at launch.</p>
<p>As always with accidental retailer listings, it should be emphasized that AMD has not yet announced official pricing for their Ryzen 9000 CPUs. Given Best Buy's status as one of the largest US electronics retailers, these prices carry a very high probability of being accurate; but none the less, they should be taken with a grain of salt – if only because last-minute price changes are not unheard of with new CPU launches.</p>
<p style="text-align: center;"><a href="https://www.anandtech.com/show/21495/best-buy-lists-amds-ryzen-9000-cpus-from-279-to-599"><img alt="" src="https://images.anandtech.com/doci/21495/GT0TH6zbwAMc9hj_575px.png" /></a></p>
<p>Source: <a href="http://www.bestbuy.com">Best Buy</a> (via <a href="https://x.com/momomo_us/status/1818631374707761456">@momomo_us</a>)</p>
</p> CPUs){kind=link}
![](https://web.whatsapp.com/send?text=Best Buy Briefly Lists AMD's Ryzen 9000 CPUs: From $279 to $599 <p align="center"><a href="https://www.anandtech.com/show/21495/best-buy-lists-amds-ryzen-9000-cpus-from-279-to-599"><img src="https://images.anandtech.com/doci/21495/2613900-amd-ryzen-9000-series-processor-tile_575px.jpg" alt="" /></a></p><p><p>Although AMD delayed launch of its Ryzen 9000-series processors based on the Zen 5 microarchitecture from July 31, to early and mid-August, the company's partner (and major US retailer) Best Buy briefly began listing the new CPUs today, revealing a very plausible set of launch prices. As per the retailer's product catalog, the most affordable unlocked Zen 5-based processor will cost $279, whereas the highest-performing Zen 5-powered CPU will cost $599 at launch.</p>
<p>AMD will start its Ryzen 9000 series rollout from relatively inexpensive six-core Ryzen 5 9600X and eight-core Ryzen 7 9700X on August 8. Per the Best Buy listing, the Ryzen 5 9600X will cost $279, whereas the Ryzen 7 9700X will carry a recommended price tag of $359. Meanwhile, The more advanced 12-core Ryzen 9 9900X and 16-core Ryzen 9 9950X will hit the market on August 15 at MSRPs of $449 and $599, respectively, based on the Best Buy listing.</p>
<table border="0" style="text-align:center" width="95%">
<tbody>
<tr class="tgrey">
<td colspan="8">AMD Ryzen 9000 Series Processors<br />
Zen 5 Microarchitecture (Granite Ridge)</td>
</tr>
<tr class="tlblue">
<td><em>AnandTech</em></td>
<td>Cores /<br />
Threads</td>
<td>Base<br />
Freq</td>
<td>Turbo<br />
Freq</td>
<td>L2<br />
Cache</td>
<td>L3<br />
Cache</td>
<td>TDP</td>
<td>MSRP</td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 9 9950X</b></td>
<td>16C / 32T</td>
<td>4.3GHz</td>
<td>5.7GHz</td>
<td>16 MB</td>
<td>64 MB</td>
<td>170 W</td>
<td><em>$599</em></td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 9 9900X</b></td>
<td>12C / 24T</td>
<td>4.4GHz</td>
<td>5.6GHz</td>
<td>12 MB</td>
<td>64 MB</td>
<td>120 W</td>
<td><em>$449</em></td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 7 9700X</b></td>
<td>8C / 16T</td>
<td>3.8GHz</td>
<td>5.5GHz</td>
<td>8 MB</td>
<td>32 MB</td>
<td>65 W</td>
<td><em>$359</em></td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 5 9600X</b></td>
<td>6C / 12T</td>
<td>3.9GHz</td>
<td>5.4GHz</td>
<td>6 MB</td>
<td>32 MB</td>
<td>65 W</td>
<td><em>$279</em></td>
</tr>
</tbody>
</table>
<p>It is noteworthy that when compared to the launch prices of the Zen 4-based Ryzen 7000 processors, the new Zen 5-powered Ryzen 9000 CPUs come in cheaper. The range topping Ryzen 9 5950X started at $799 in 2020, while the Ryzen 9 7950X had a recommended $699 price tag in 2022. By contrast, the top-end Ryzen 9 9950X is listed at $599. Both Ryzen 7 5600X and Ryzen 7 7600X cost $299 at launch, while the upcoming Ryzen 5 9600X will apparently be priced at $279 at launch.</p>
<p>As always with accidental retailer listings, it should be emphasized that AMD has not yet announced official pricing for their Ryzen 9000 CPUs. Given Best Buy's status as one of the largest US electronics retailers, these prices carry a very high probability of being accurate; but none the less, they should be taken with a grain of salt – if only because last-minute price changes are not unheard of with new CPU launches.</p>
<p style="text-align: center;"><a href="https://www.anandtech.com/show/21495/best-buy-lists-amds-ryzen-9000-cpus-from-279-to-599"><img alt="" src="https://images.anandtech.com/doci/21495/GT0TH6zbwAMc9hj_575px.png" /></a></p>
<p>Source: <a href="http://www.bestbuy.com">Best Buy</a> (via <a href="https://x.com/momomo_us/status/1818631374707761456">@momomo_us</a>)</p>
</p> CPUs | https://compbuddey.blogspot.com/2024/08/best-buy-briefly-lists-amds-ryzen-9000_3.html){kind=link}
![](mailto:?subject=Best Buy Briefly Lists AMD's Ryzen 9000 CPUs: From $279 to $599 <p align="center"><a href="https://www.anandtech.com/show/21495/best-buy-lists-amds-ryzen-9000-cpus-from-279-to-599"><img src="https://images.anandtech.com/doci/21495/2613900-amd-ryzen-9000-series-processor-tile_575px.jpg" alt="" /></a></p><p><p>Although AMD delayed launch of its Ryzen 9000-series processors based on the Zen 5 microarchitecture from July 31, to early and mid-August, the company's partner (and major US retailer) Best Buy briefly began listing the new CPUs today, revealing a very plausible set of launch prices. As per the retailer's product catalog, the most affordable unlocked Zen 5-based processor will cost $279, whereas the highest-performing Zen 5-powered CPU will cost $599 at launch.</p>
<p>AMD will start its Ryzen 9000 series rollout from relatively inexpensive six-core Ryzen 5 9600X and eight-core Ryzen 7 9700X on August 8. Per the Best Buy listing, the Ryzen 5 9600X will cost $279, whereas the Ryzen 7 9700X will carry a recommended price tag of $359. Meanwhile, The more advanced 12-core Ryzen 9 9900X and 16-core Ryzen 9 9950X will hit the market on August 15 at MSRPs of $449 and $599, respectively, based on the Best Buy listing.</p>
<table border="0" style="text-align:center" width="95%">
<tbody>
<tr class="tgrey">
<td colspan="8">AMD Ryzen 9000 Series Processors<br />
Zen 5 Microarchitecture (Granite Ridge)</td>
</tr>
<tr class="tlblue">
<td><em>AnandTech</em></td>
<td>Cores /<br />
Threads</td>
<td>Base<br />
Freq</td>
<td>Turbo<br />
Freq</td>
<td>L2<br />
Cache</td>
<td>L3<br />
Cache</td>
<td>TDP</td>
<td>MSRP</td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 9 9950X</b></td>
<td>16C / 32T</td>
<td>4.3GHz</td>
<td>5.7GHz</td>
<td>16 MB</td>
<td>64 MB</td>
<td>170 W</td>
<td><em>$599</em></td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 9 9900X</b></td>
<td>12C / 24T</td>
<td>4.4GHz</td>
<td>5.6GHz</td>
<td>12 MB</td>
<td>64 MB</td>
<td>120 W</td>
<td><em>$449</em></td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 7 9700X</b></td>
<td>8C / 16T</td>
<td>3.8GHz</td>
<td>5.5GHz</td>
<td>8 MB</td>
<td>32 MB</td>
<td>65 W</td>
<td><em>$359</em></td>
</tr>
<tr>
<td class="tlgrey"><b>Ryzen 5 9600X</b></td>
<td>6C / 12T</td>
<td>3.9GHz</td>
<td>5.4GHz</td>
<td>6 MB</td>
<td>32 MB</td>
<td>65 W</td>
<td><em>$279</em></td>
</tr>
</tbody>
</table>
<p>It is noteworthy that when compared to the launch prices of the Zen 4-based Ryzen 7000 processors, the new Zen 5-powered Ryzen 9000 CPUs come in cheaper. The range topping Ryzen 9 5950X started at $799 in 2020, while the Ryzen 9 7950X had a recommended $699 price tag in 2022. By contrast, the top-end Ryzen 9 9950X is listed at $599. Both Ryzen 7 5600X and Ryzen 7 7600X cost $299 at launch, while the upcoming Ryzen 5 9600X will apparently be priced at $279 at launch.</p>
<p>As always with accidental retailer listings, it should be emphasized that AMD has not yet announced official pricing for their Ryzen 9000 CPUs. Given Best Buy's status as one of the largest US electronics retailers, these prices carry a very high probability of being accurate; but none the less, they should be taken with a grain of salt – if only because last-minute price changes are not unheard of with new CPU launches.</p>
<p style="text-align: center;"><a href="https://www.anandtech.com/show/21495/best-buy-lists-amds-ryzen-9000-cpus-from-279-to-599"><img alt="" src="https://images.anandtech.com/doci/21495/GT0TH6zbwAMc9hj_575px.png" /></a></p>
<p>Source: <a href="http://www.bestbuy.com">Best Buy</a> (via <a href="https://x.com/momomo_us/status/1818631374707761456">@momomo_us</a>)</p>
</p> CPUs&body=https://compbuddey.blogspot.com/2024/08/best-buy-briefly-lists-amds-ryzen-9000_3.html){kind=link}
Realtek Outlines SSD Controller Roadmap: High-End PCIe 5.0 x4 Platform in the Works 
While Realtek is best known in the enthusiast space for for its peripheral controllers such as audio codecs and network controllers, the company also has a small-but-respectable SSD controller business that tends to fly under the radar due to its focus on entry-level and mainstream drives. But Realtek's stature in the SSD space is on the rise, as the company is not only planning new PCIe Gen5 SSD controllers, but also their first high-end, DRAM-equipped SSD controller.
For this year's Computex trade show, Realtek laid out a new SSD controller roadmap that calls for the company to release a trio of new SSD controllers over the next couple of years. First up is a new four-channel entry-level PCIe 4.0 controller, the RTS5776DL, which will be joined a bit later by a PCIe 5.0 variant, the RTS5781DL. But most interesting on Realtek's new roadmap is the final chip being planned: the eight-channel, DRAM-equipped RTS5782, which would be the company's first high-end SSD controller, capable of hitting sequential read rates as high as 14GB/second.
| Realtek NVMe SSD Controller Comparison | |||||||||
| RTS5782 | RTS5781DL | RTS5776DL | RTS5772DL | RTS5766DL | |||||
| Market Segment | High-End | Mainstream | Entry-Level | ||||||
| Error Correction | 4K LDPC | 2K LDPC | |||||||
| DRAM | DDR4, LPDDR4(X) | No | No | No | No | ||||
| Host Interface | PCIe 5.0 x4 | PCIe 5.0 x4 | PCIe 4.0 x4 | PCIe 4.0 x4 | PCIe 3.0 x4 | ||||
| NVMe Version | NVMe 2.0 | NVMe 2.0 | NVMe 2.0 | NVMe 1.4 | NVMe 1.4 | ||||
| NAND Channels, Interface Speed | 8 ch, 3600 MT/s |
4 ch, 3600 MT/s |
4 ch, 3600 MT/s |
8 ch, 1600 MT/s |
4 ch, 1200 MT/s |
||||
| Sequential Read | 14 GB/s | 10 GB/s | 7.4 GB/s | 6 GB/s | 3.2 GB/s | ||||
| Sequential Write | 12 GB/s | 10 GB/s | 7.4 GB/s | 6 GB/s | 2.2 GB/s | ||||
| 4KB Random Read IOPS | 2500k | 1400k | 1200k | - | - | ||||
| 4KB Random Write IOPS | 2500k | 1400k | 1200k | - | - | ||||
Diving a bit deeper into Realtek's roadmap, the RTS5776DL is traditional DRAM-less PCIe Gen4 x4 controller with four NAND chann... SSDs
The AMD Ryzen AI 9 HX 370 Review: Unleashing Zen 5 and RDNA 3.5 Into Notebooks During the opening keynote delivered by AMD CEO Dr. Lisa Su at Computex 2024, AMD finally lifted the lid on their highly-anticipated Zen 5 microarchitecture. The backbone for the next couple of years of everything CPU at AMD, the company unveiled their plans to bring Zen 5 in the consumer market, announcing both their next-generation mobile and desktop products at the same time. With a tight schedule that will see both platforms launch within weeks of each other, today AMD is taking their first step with the launch of the Ryzen AI 300 series – codenamed Strix Point – their new Zen 5-powered mobile SoC.
The latest and greatest from AMD, the Strix Point brings significant architectural improvements across AMD's entire IP portfolio. Headlining the chip, of course, is the company's new Zen 5 CPU microarchitecture, which is taking multiple steps to improve on CPU performance without the benefits of big clockspeed gains. And reflecting the industry's current heavy emphasis on AI performance, Strix Point also includes the latest XDNA 2-based NPU, which boasts up to 50 TOPS of performance. Other improvements include an upgraded integrated graphics processor, with AMD moving to the RDNA 3.5 graphics architecture.
The architectural updates in Strix Point are also seeing AMD opt for a heterogenous CPU design from the very start, incorporating both performance and efficiency cores as a means of offering better overall performance in power-constrained devices. AMD first introduced their compact Zen cores in the middle of the Zen 4 generation, and while they made it into products such as AMD's small-die Phoenix 2 platform, this is the first time AMD's flagship mobile silicon has included them as well. And while this change is going to be transparent from a user perspective, under the hood it represents an important improvement in CPU design. As a result, all Ryzen AI 300 chips are going to include a mix of not only AMD's (mostly) full-fat Zen 5 CPU cores, but also their compact Zen 5c cores, boosting the chips' total CPU core counts and performance in multi-threaded situations.
For today's launch, the AMD Ryzen AI 300 series will consist of just three SKUs: the flagship Ryzen AI 9 HX 375, with 12 CPU cores, as well as the Ryzen AI 9 HX 370 and Ryzen 9 365, with 12 and 10 cores respectively. All three SoCs combine both the regular Zen 5 core with the more compact Zen 5c cores to make up the CPU cluster, and are paired with a powerful Raden 890M/880M GPU, and a XDNA 2-based NPU.
As the successor to the Zen 4-based Phoenix/Hawk Point, the AMD Ryzen AI 300 series is targeting a diverse and active notebook market that has become the largest segment of the PC industry overall. And it is telling that, for the first time in the Zen era, AMD is launching their mobile chips first – if only by days – rather than their typical desktop-first launch. It's both a reflection on how the PC industry has changed over the years, and how AMD has continued to iterate and improve upon its mobile chips; this is as close to mobile-first as the company has ever been.
Getting down to business, for our review of the Ryzen AI 300 series, we are taking a look at ASUS's Zenbook S 16 (2024), a 16-inch laptop that's equipped with AMD's Ryzen AI 9 HX 370. The sightly more modest Ryzen features four Zen 5 CPU cores and 8 Zen 5c CPU cores, as well as AMD's latest RDNA 3.5 Radeon 890M integrated graphics. Overall, the HX 370 has a configurable TDP of between 15 and 54 W, depending on the desired notebook configuration.
Fleshing out the rest of the Zenbook S 16, ASUS has equipped the laptop with a bevy of features and technologies fitting for a flagship Ryzen notebook. The centerpiece of the laptop is a Lumina OLED 16-inch display, with a resolution of up to 2880 x 1800 and a variable 120 Hz refresh rate. Meanwhile, inside the Zenbook S 16 is 32 GB of LPDDR5 memory and a 1 TB PCIe 4.0 NVMe SSD. And while this is a 16-inch class notebook, ASUS has still designed it with an emphasis on portability, leading to the Zenbook S 16 coming in at 1.1 cm thick, and weighting 1.5 kg. That petite design also means ASUS has configured the Ryzen AI 9 HX 370 chip inside rather conservatively: out of the box, the chip runs at a TDP of just 17 Watts.
CPUs
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Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
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