OLED panels have a number of advantages, including deep blacks, fast response times, and energy efficiency; most of these stemming from the fact that they do not need backlighting. However they also have drawbacks, as well, as trying to drive them to be as bright as a high-tier LCD will quickly wear out the organic material used. Researchers have been spending the past couple of decades developing ways to prolong the lifespans of OLED materials, and recently LG has put together a novel (if brute force) solution: halve the work by doubling the number of pixels. This is the basis of the company's new tandem OLED technology, which has recently gone into mass production.
The Tandem OLED technology introduced by LG Display uses two stacks of red, green, and blue (RGB) organic light-emitting layers, which are layered on top fo each other, essentially reducing how bright each layer needs to individually be in order to hit a specific cumulative brightness. By combining multiple OLED pixels running at a lower brightness, tandem OLED displays are intended to offer higher brightness and durability than traditional single panel OLED displays, reducing the wear on the organic materials in normal situations – and by extension, making it possible to crank up the brightness of the panels well beyond what a single panel could sustain without cooking itself. Overall, LG claims that tandem panels can hit over three-times the brightness of standard OLED panels.
The switch to tandem panels also comes with energy efficiency benefits, as the power consumption of OLED pixels is not linear with the output brightness. According to LG, their tandem panels consume up to 40% less power. More interesting from the manufacturing side of matters, LG's tandem panel stack is 40% thinner (and 28%) lighter than existing OLED laptop screens, despite having to get a whole second layer of pixels in there.
In terms of specifications, the 13-inch tandem OLED panel feature a WQXGA+ (2880×1800) resolution and can cover 100% of the DCI-P3 color gamut. The panel is also certified to meet VESA's Display HDR True Black 500 requirements, which among other things, requires that it can hit 500 nits of brightness. And given that this tech is meant to go into tablets and laptops, it shouldn't come as any surprise that the display panel is also touch sensitive, as well.
"We will continue to strengthen the competitiveness of OLED products for IT applications and offer differentiated customer value based on distinctive strengths of Tandem OLED, such as long life, high brightness, and low power consumption," said Jae-Won Jang, Vice President and Head of the Medium Display Product Planning Division at LG Display.
Without any doubts, LG's Tandem OLED display panel looks impressive. The company is banking on it doing well in the high-end laptop and tablet markets, where manufacturers have been somewhat hesitant to embrace OLED displays due to power concerns. The technology has already been adopted by Apple for their most recent iPad Pro tablets, and now LG is making it available to a wider group of OEMs.
What remains to be seen is the technology's cost. Computer-grade OLED panels are already a more expensive option, and this one ups the ante with two layers of OLED pixels. So it isn't a question of whether it will be reserved for premium, high-margin devices, but a matter of just how much it will add to the final price tag.
For now, LG Display does not disclose which PC OEMs are set to use its 13-inch Tandem OLED panel, though as the company is a supplier to virtually all of the PC OEMs, there's little doubt it should crop up in multiple laptops soon enough.
DisplaysAs LPCAMM2 adoption begins, the first retail memory modules are finally starting to hit the retail market, courtesy of Micron. The memory manufacturer has begun selling their LPDDR5X-based LPCAMM2 memory modules under their in-house Crucial brand, making them available on the latter's storefront. Timed to coincide with the release of Lenovo's ThinkPad P1 Gen 7 laptop – the first retail laptop designed to use the memory modules – this marks the de facto start of the eagerly-awaited modular LPDDR5X memory era.
Micron's Low Power Compression Attached Memory Module 2 (LPCAMM2) modules are available in capacities of 32 GB and 64 GB. These are dual-channel modules that feature a 128-bit wide interface, and are based around LPDDR5X memory running at data rates up to 7500 MT/s. This gives a single LPCAMM2 a peak bandwidth of 120 GB/s. Micron is not disclosing the latencies of its LPCAMM2 memory modules, but it says that high data transfer rates of LPDDR5X compensate for the extended timings.
Micron says that LPDDR5X memory offers significantly lower power consumption, with active power per 64-bit bus being 43-58% lower than DDR5 at the same speed, and standby power up to 80% lower. Meanwhile, similar to DDR5 modules, LPCAMM2 modules include a power management IC and voltage regulating circuitry, which provides module manufacturers additional opportunities to reduce power consumption of their products.

Source: Micron LPDDR5X LPCAMM2 Technical Brief
It's worth noting, however, that at least for the first generation of LPCAMM2 modules, system vendors will need to pick between modularity and performance. While soldered-down LPDDR5X memory is available at speeds up to 8533 MT/sec – and with 9600 MT/sec on the horizon – the fastest LPCAMM2 modules planned for this year by both Micron and rival Samsung will be running at 7500 MT/sec. So vendors will have to choose between the flexibility of offering modular LPDDR5X, or the higher bandwidth (and space savings) offered by soldering down their memory.
Micron, for its part, is projecting that 9600 MT/sec LPCAMM2 modules will be available by 2026. Though it's all but certain that faster memory will also be avaialble in the same timeframe.
Micron's Crucial LPDDR5X 32 GB module costs $174.99, whereas a 64 GB module costs $329.99.
Memory
While the new CAMM and LPCAMM memory modules for laptops have garnered a great deal of attention in recent months, it's not just the mobile side of the PC memory industry that is looking at changes. The desktop memory market is also coming due for some upgrades to further improve DIMM performance, in the form of a new DIMM variety called the Clocked Unbuffered DIMM (CUDIMM). And while this memory isn't in use quite yet, several memory vendors had their initial CUDIMM products on display at this year's Computex trade show, offering a glimpse into the future of desktop memory.
A variation on traditional Unbuffered DIMMs (UDIMMs), Clocked UDIMMs (and Clocked SODIMMs) have been created as another solution to the ongoing signal integrity challenges presented by DDR5 memory. DDR5 allows for rather speedy transfer rates with removable (and easily installed) DIMMs, but further performance increases are running up against the laws of physics when it comes to the electrical challenges of supporting memory on a stick – particularly with so many capacity/performance combinations like we see today. And while those challenges aren't insurmountable, if DDR5 (and eventually, DDR6) are to keep increasing in speed, some changes appear to be needed to produce more electrically robust DIMMs, which is giving rise to the CUDIMM.
Standardized by JEDEC earlier this year as JESD323, CUDIMMs tweak the traditional unbuffered DIMM by adding a clock driver (CKD) to the DIMM itself, with the tiny IC responsible for regenerating the clock signal driving the actual memory chips. By generating a clean clock locally on the DIMM (rather than directly using the clock from the CPU, as is the case today), CUDIMMs are designed to offer improved stability and reliability at high memory speeds, combating the electrical issues that would otherwise cause reliability issues at faster memory speeds. In other words, adding a clock driver is the key to keeping DDR5 operating reliably at high clockspeeds.
All told, JEDEC is proposing that CUDIMMs be used for DDR5-6400 speeds and higher, with the first version of the specification covering speeds up to DDR5-7200. The new DIMMs will also be drop-in compatible with existing platforms (at least on paper), using the same 288-pin connector as today's standard DDR5 UDIMM and allowing for a relatively smooth transition towards higher DDR5 clockspeeds.
MemoryDuring the Intel keynote hosted by CEO Pat Gelsinger, he gave the world a glimpse into the Intel Client roadmap until 2026. Meteor Lake launched last year on that roadmap, and Lunar Lake, which we dived into yesterday as Intel disclosed technical details about the upcoming platform. Pat also presented a wafer on stage, Panther Lake, and he gave some additional information about Intel's forthcoming Panther Lake platform, which is expected in 2025.
We covered Intel's initial announcement about the Panther Lake platform last year. It is set to be Intel's first client platform using its Intel 18A node. Aside from once again affirming that things are on track for a 2026 launch, Pat Gelsinger, Intel's CEO, also confirmed that they will be powering on the first 18A wafer for Panther Lake as early as next week.
| Intel CPU Architecture Generations | |||||
| Alder/Raptor Lake | Meteor Lake |
Lunar Lake |
Arrow Lake |
Panther Lake |
|
| P-Core Architecture | Golden Cove/ Raptor Cove |
Redwood Cove | Lion Cove | Lion Cove | Cougar Cove? |
| E-Core Architecture | Gracemont | Crestmont | Skymont | Crestmont? | Darkmont? |
| GPU Architecture | Xe-LP | Xe-LPG | Xe2 | Xe2? | ? |
| NPU Architecture | N/A | NPU 3720 | NPU 4 | ? | ? |
| Active Tiles | 1 (Monolithic) | 4 | 2 | 4? | ? |
| Manufacturing Processes | Intel 7 | Intel 4 + TSMC N6 + TSMC N5 | TSMC N3B + TSMC N6 | Intel 20A + More | Intel 18A + ? |
| Segment | Mobile + Desktop | Mobile | LP Mobile | HP Mobile + Desktop | Mobile? |
| Release Date (OEM) | Q4'2021 | Q4'2023 | Q3'2024 | Q4'2024 | 2025 |
One element to consider from last year is that Lunar Lake is built using TSMC, with the Lunar Lake compute tile with Xe2-LPG graphics on TSMC N3B, and the I/O tile on TSMC N6. Pat confirmed on stage that Panther Lake will be on Intel 18A. Still, he didn't confirm whether the chip will be made purely at Intel, or a mix between Intel and external foundries (ala Meteor Lake). Intel has also yet to confirm the CPU cores to be used, but from what our sources tell us, it sounds like it will be the new Cougar Cove and Darkmont cores.
As we head into the second half of 2024 and after Lunar Lake launches, Intel may divulge more information, including the architectural advancements Panther Lake is expected to bring. Until then, we will have to wait and see.
CPUs
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