Samsung Validates LPDDR5X Running at 10.7 GT/sec with MediaTek's Dimensity 9400 SoC
Samsung has successfully validated its new LPDDR5X-10700 memory with MediaTek's upcoming Dimensity platform. At present, 10.7 GT/s is the highest performing speed grade of LPDDR5X DRAM slated to be released this year, so the upcoming Dimensity 9400 system-on-chip will get the highest memory bandwidth available for a mobile application processor.
The verification process involved Samsung's 16 GB LPDDR5X package and MediaTek's soon-to-be-announced Dimensity 9400 SoC for high-end 5G smartphones. Usage of LPDDR5X-10700 provides a memory bandwidth of 85.6 GB/second over a 64-bit interface, which will be available for bandwidth-hungry applications like graphics and generative AI.
"Working together with Samsung Electronics has made it possible for MediaTek's next-generation Dimensity chipset to become the world's first to be validated at LPDDR5X operating speeds up to 10.7Gbps, enabling upcoming devices to deliver AI functionality and mobile performance at a level we have never seen before," said JC Hsu, Corporate Senior Vice President at MediaTek. "This updated architecture will make it easier for developers and users to leverage more AI capabilities and take advantage of more features with less impact on battery life."
Samsung's LPDDR5X 10.7 GT/s memory in made on the company's 12nm-class DRAM process technology and is said to provide a more than 25% improvement in power efficiency over previous-generation LPDDR5X, in addition to extra performance. This will positively affect improved user experience, including enhanced on-device AI capabilities, such as faster voice-to-text conversion, and better quality graphics.
Overall, the two companies completed this process in just three months. Though it remains to be seen when smartphones based on the Dimensity 9400 application processor and LPDDR5X memory are set to be available on the market, as MediaTek has not yet even formally announced the SoC itself.
"Through our strategic cooperation with MediaTek, Samsung has verified the industry's fastest LPDDR5X DRAM that is poised to lead the AI smartphone market," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "Samsung will continue to innovate through active collaboration with customers and provide optimum solutions for the on-device AI era."
Memory
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Microchip Demonstrates Flashtec 5016 Enterprise SSD Controller Microchip recently announced the availability of their second PCIe Gen 5 enterprise SSD controller - the Flashtec 5016. Like the 4016, this is also a 16-channel controller, but there are some key updates: PCIe 5.0 lane organization: Operation in x4 or dual independent x2 / x2 mode in the 5016, compared to the x8, or x4, or dual independent x4 / x2 mode in the 4016. DRAM support: Four ranks of DDR5-5200 in the 5016, compared to two ranks of DDR4-3200 in the 4016. Extended NAND support: 2400 MT/s NAND in the 4016, compared to the 3200 MT/s NAND support in the 5016. Performance improvements: The 5016 is capable of delivering 3.5M+ random read IOPS compared to the 3M+ of the 4016. Microchip's enterprise SSD controllers provide a high level of flexibility to SSD vendors by providing them with significant horsepower and accelerators. The 5016 includes Cortex-A53 cores for SSD vendors to run custom applications relevant to SSD management. However, compared to the Gen4 controllers, there are two additional cores in the CPU cluster. The DRAM subsystem includes ECC support (both out-of-band and inline, as desired by the SSD vendor). At FMS 2024, the company demonstrated an application of the neural network engines embedded in the Gen5 controllers. Controllers usually employ a 'read-retry' operation with altered read-out voltages for flash reads that do not complete successfully. Microchip implemented a machine learning approach to determine the read-out voltage based on the health history of the NAND block using the NN engines in the controller. This approach delivers tangible benefits for read latency and power consumption (thanks to a smaller number of errors on the first read). The 4016 and 5016 come with a single-chip root of trust implementation for hardware security. A secure boot process with dual-signature authentication ensures that the controller firmware is not maliciously altered in the field. The company also brought out the advantages of their controller's implementation of SR-IOV, flexible data placement, and zoned namespaces along with their 'credit engine' scheme for multi-tenant cloud workloads. These aspects were also brought out in other demonstrations. Microchip's press release included quotes from the usual NAND vendors - Solidigm, Kioxia, and Micron. On the customer front, Longsys has been using Flashtec controllers in their enterprise offerings along with YMTC NAND. It is likely that this collaboration will continue further using the new 5016 controller. Storage
MediaTek to Add NVIDIA G-Sync Support to Monitor Scalers, Make G-Sync Displays More Accessible NVIDIA on Tuesday said that future monitor scalers from MediaTek will support its G-Sync technologies. NVIDIA is partnering with MediaTek to integrate its full range of G-Sync technologies into future monitors without requiring a standalone G-Sync module, which makes advanced gaming features more accessible across a broader range of displays. Traditionally, G-Sync technology relied on a dedicated G-sync module – based on an Altera FPGA – to handle syncing display refresh rates with the GPU in order to reduce screen tearing, stutter, and input lag. As a more basic solution, in 2019 NVIDIA introduced G-Sync Compatible certification and branding, which leveraged the industry-standard VESA AdaptiveSync technology to handle variable refresh rates. In lieu of using a dedicated module, leveraging AdaptiveSync allowed for cheaper monitors, with NVIDIA's program serving as a stamp of approval that the monitor worked with NVIDIA GPUs and met NVIDIA's performance requirements. Still, G-Sync Compatible monitors still lack some features that, to date, require the dedicated G-Sync module. Through this new partnership with MediaTek, MediaTek will bring support for all of NVIDIA's G-Sync technologies, including the latest G-Sync Pulsar, directly into their scalers. G-Sync Pulsar enhances motion clarity and reduces ghosting, providing a smoother gaming experience. In addition to variable refresh rates and Pulsar, MediaTek-based G-Sync displays will support such features as variable overdrive, 12-bit color, Ultra Low Motion Blur, low latency HDR, and Reflex Analyzer. This integration will allow more monitors to support a full range of G-Sync features without having to incorporate an expensive FPGA. The first monitors to feature full G-Sync support without needing an NVIDIA module include the AOC Agon Pro AG276QSG2, Acer Predator XB273U F5, and ASUS ROG Swift 360Hz PG27AQNR. These monitors offer 360Hz refresh rates, 1440p resolution, and HDR support. What remains to be seen is which specific MediaTek's scalers will support NVIDIA's G-Sync technology – or if the company is going to implement support into all of their scalers going forward. It also remains to be seen whether monitors with NVIDIA's dedicated G-Sync modules retain any advantages over displays with MediaTek's scalers. Monitors
Fadu's FC5161 SSD Controller Breaks Cover in Western Digital's PCIe Gen5 Enterprise Drives When Western Digital introduced its Ultrastar DC SN861 SSDs earlier this year, the company did not disclose which controller it used for these drives, which made many observers presume that WD was using an in-house controller. But a recent teardown of the drive shows that is not the case; instead, the company is using a controller from Fadu, a South Korean company founded in 2015 that specializes on enterprise-grade turnkey SSD solutions. The Western Digital Ultrastar DC SN861 SSD is aimed at performance-hungry hyperscale datacenters and enterprise customers which are adopting PCIe Gen5 storage devices these days. And, as uncovered in photos from a recent Storage Review article, the drive is based on Fadu's FC5161 NVMe 2.0-compliant controller. The FC5161 utilizes 16 NAND channels supporting an ONFi 5.0 2400 MT/s interface, and features a combination of enterprise-grade capabilities (OCP Cloud Spec 2.0, SR-IOV, up to 512 name spaces for ZNS support, flexible data placement, NVMe-MI 1.2, advanced security, telemetry, power loss protection) not available on other off-the-shelf controllers – or on any previous Western Digital controllers. The Ultrastar DC SN861 SSD offers sequential read speeds up to 13.7 GB/s as well as sequential write speeds up to 7.5 GB/s. As for random performance, it boasts with an up to 3.3 million random 4K read IOPS and up to 0.8 million random 4K write IOPS. The drives are available in capacities between 1.6 TB and 7.68 TB with one or three drive writes per day (DWPD) over five years rating as well as in U.2 and E1.S form-factors. While the two form factors of the SN861 share a similar technical design, Western Digital has tailored each version for distinct workloads: the E1.S supports FDP and performance enhancements specifically for cloud environments. By contrast, the U.2 model is geared towards high-performance enterprise tasks and emerging applications like AI. Without any doubts, Western Digital's Ultrastar DC SN861 is a feature-rich high-performance enterprise-grade SSD. It has another distinctive feature: a 5W idle power consumption, which is rather low by the standards of enterprise-grade drives (e.g., it is 1W lower compared to the SN840). While the difference with predecessors may be just 1W, hyperscalers deploy thousands of drives and for their TCO every watt counts. Western Digital's Ultrastar DC SN861 SSDs are now available for purchase to select customers (such as Meta) and to interested parties. Prices are unknown, but they will depend on such factors as volumes. Sources: Fadu, Storage Review Storage
G.Skill Intros Low Latency DDR5 Memory Modules: CL30 at 6400 MT/s
G.Skill on Tuesday introduced its ultra-low-latency DDR5-6400 memory modules that feature a CAS latency of 30 clocks, which appears to be the industry's most aggressive timings yet for DDR5-6400 sticks. The modules will be available for both AMD and Intel CPU-based systems.
With every new generation of DDR memory comes an increase in data transfer rates and an extension of relative latencies. While for the vast majority of applications, the increased bandwidth offsets the performance impact of higher timings, there are applications that favor low latencies. However, shrinking latencies is sometimes harder than increasing data transfer rates, which is why low-latency modules are rare.
Nonetheless, G.Skill has apparently managed to cherry-pick enough DDR5 memory chips and build appropriate printed circuit boards to produce DDR5-6400 modules with CL30 timings, which are substantially lower than the CL46 timings recommended by JEDEC for this speed bin. This means that while JEDEC-standard modules have an absolute latency of 14.375 ns, G.Skill's modules can boast a latency of just 9.375 ns – an approximately 35% decrease.
G.Skill's DDR5-6400 CL30 39-39-102 modules have a capacity of 16 GB and will be available in 32 GB dual-channel kits, though the company does not disclose voltages, which are likely considerably higher than those standardized by JEDEC.
The company plans to make its DDR5-6400 modules available both for AMD systems with EXPO profiles (Trident Z5 Neo RGB and Trident Z5 Royal Neo) and for Intel-powered PCs with XMP 3.0 profiles (Trident Z5 RGB and Trident Z5 Royal). For AMD AM5 systems that have a practical limitation of 6000 MT/s – 6400 MT/s for DDR5 memory (as this is roughly as fast as AMD's Infinity Fabric can operate at with a 1:1 ratio), the new modules will be particularly beneficial for AMD's Ryzen 7000 and Ryzen 9000-series processors.
G.Skill notes that since its modules are non-standard, they will not work with all systems but will operate on high-end motherboards with properly cooled CPUs.
The new ultra-low-latency memory kits will be available worldwide from G.Skill's partners starting in late August 2024. The company did not disclose the pricing of these modules, but since we are talking about premium products that boast unique specifications, they are likely to be priced accordingly.
Memory
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling
![](https://twitter.com/share?url=https://compbuddey.blogspot.com/2024/07/samsung-validates-lpddr5x-running-at_30.html&text=Samsung Validates LPDDR5X Running at 10.7 GT/sec with MediaTek's Dimensity 9400 SoC <p align="center"><a href="https://www.anandtech.com/show/21475/samsung-validates-lpddr5x-107-gts-with-mediateks-dimensity-9400-soc"><img src="https://images.anandtech.com/doci/21475/Samsung-Semiconductors-LPDDR5X-MediaTek-Platform-Validation_main2_crop_575px.jpg" alt="" /></a></p><p><p>Samsung has successfully validated its new LPDDR5X-10700 memory with MediaTek's upcoming Dimensity platform. At present, <a href="https://www.anandtech.com/show/21354/samsung-unveils-world-s-fastest-lpddr5x-memory-10-7-gt-s">10.7 GT/s is the highest performing speed grade of LPDDR5X DRAM</a> slated to be released this year, so the upcoming Dimensity 9400 system-on-chip will get the highest memory bandwidth available for a mobile application processor.</p>
<p>The verification process involved Samsung's 16 GB LPDDR5X package and MediaTek's soon-to-be-announced Dimensity 9400 SoC for high-end 5G smartphones. Usage of LPDDR5X-10700 provides a memory bandwidth of 85.6 GB/second over a 64-bit interface, which will be available for bandwidth-hungry applications like graphics and generative AI.</p>
<p>"Working together with Samsung Electronics has made it possible for MediaTek's next-generation Dimensity chipset to become the world's first to be validated at LPDDR5X operating speeds up to 10.7Gbps, enabling upcoming devices to deliver AI functionality and mobile performance at a level we have never seen before," said JC Hsu, Corporate Senior Vice President at MediaTek. "This updated architecture will make it easier for developers and users to leverage more AI capabilities and take advantage of more features with less impact on battery life."</p>
<p>Samsung's LPDDR5X 10.7 GT/s memory in made on the company's 12nm-class DRAM process technology and is said to provide a more than 25% improvement in power efficiency over previous-generation LPDDR5X, in addition to extra performance. This will positively affect improved user experience, including enhanced on-device AI capabilities, such as faster voice-to-text conversion, and better quality graphics.</p>
<p>Overall, the two companies completed this process in just three months. Though it remains to be seen when smartphones based on the Dimensity 9400 application processor and LPDDR5X memory are set to be available on the market, as MediaTek has not yet even formally announced the SoC itself.</p>
<p>"Through our strategic cooperation with MediaTek, Samsung has verified the industry's fastest LPDDR5X DRAM that is poised to lead the AI smartphone market," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "Samsung will continue to innovate through active collaboration with customers and provide optimum solutions for the on-device AI era."</p>
</p> Memory){kind=link}
![](https://www.pinterest.com/pin/create/button/?url=https://compbuddey.blogspot.com/2024/07/samsung-validates-lpddr5x-running-at_30.html&media=https://lh3.googleusercontent.com/blogger_img_proxy/AEn0k_v3YW_FgLtkSQOlGP-eM9RNSF85FNYd4tyukmW2EOH-FPbLEAILwuMZMeiACSpQdOeEs3zO-intz9ang9nKH4DdQoBa3A5O2MR5HVw_MOUS1D40rf-PGJyn4TYfK4Rq82KYrxzQPIAA4AndxVTYdhCWxbG8zgt4pCwmgBg5LN6c8ofqW58xZ2m6s575ZK-woQy_RbsjNo1ENYGR&description=Samsung Validates LPDDR5X Running at 10.7 GT/sec with MediaTek's Dimensity 9400 SoC <p align="center"><a href="https://www.anandtech.com/show/21475/samsung-validates-lpddr5x-107-gts-with-mediateks-dimensity-9400-soc"><img src="https://images.anandtech.com/doci/21475/Samsung-Semiconductors-LPDDR5X-MediaTek-Platform-Validation_main2_crop_575px.jpg" alt="" /></a></p><p><p>Samsung has successfully validated its new LPDDR5X-10700 memory with MediaTek's upcoming Dimensity platform. At present, <a href="https://www.anandtech.com/show/21354/samsung-unveils-world-s-fastest-lpddr5x-memory-10-7-gt-s">10.7 GT/s is the highest performing speed grade of LPDDR5X DRAM</a> slated to be released this year, so the upcoming Dimensity 9400 system-on-chip will get the highest memory bandwidth available for a mobile application processor.</p>
<p>The verification process involved Samsung's 16 GB LPDDR5X package and MediaTek's soon-to-be-announced Dimensity 9400 SoC for high-end 5G smartphones. Usage of LPDDR5X-10700 provides a memory bandwidth of 85.6 GB/second over a 64-bit interface, which will be available for bandwidth-hungry applications like graphics and generative AI.</p>
<p>"Working together with Samsung Electronics has made it possible for MediaTek's next-generation Dimensity chipset to become the world's first to be validated at LPDDR5X operating speeds up to 10.7Gbps, enabling upcoming devices to deliver AI functionality and mobile performance at a level we have never seen before," said JC Hsu, Corporate Senior Vice President at MediaTek. "This updated architecture will make it easier for developers and users to leverage more AI capabilities and take advantage of more features with less impact on battery life."</p>
<p>Samsung's LPDDR5X 10.7 GT/s memory in made on the company's 12nm-class DRAM process technology and is said to provide a more than 25% improvement in power efficiency over previous-generation LPDDR5X, in addition to extra performance. This will positively affect improved user experience, including enhanced on-device AI capabilities, such as faster voice-to-text conversion, and better quality graphics.</p>
<p>Overall, the two companies completed this process in just three months. Though it remains to be seen when smartphones based on the Dimensity 9400 application processor and LPDDR5X memory are set to be available on the market, as MediaTek has not yet even formally announced the SoC itself.</p>
<p>"Through our strategic cooperation with MediaTek, Samsung has verified the industry's fastest LPDDR5X DRAM that is poised to lead the AI smartphone market," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "Samsung will continue to innovate through active collaboration with customers and provide optimum solutions for the on-device AI era."</p>
</p> Memory){kind=link}
![](https://web.whatsapp.com/send?text=Samsung Validates LPDDR5X Running at 10.7 GT/sec with MediaTek's Dimensity 9400 SoC <p align="center"><a href="https://www.anandtech.com/show/21475/samsung-validates-lpddr5x-107-gts-with-mediateks-dimensity-9400-soc"><img src="https://images.anandtech.com/doci/21475/Samsung-Semiconductors-LPDDR5X-MediaTek-Platform-Validation_main2_crop_575px.jpg" alt="" /></a></p><p><p>Samsung has successfully validated its new LPDDR5X-10700 memory with MediaTek's upcoming Dimensity platform. At present, <a href="https://www.anandtech.com/show/21354/samsung-unveils-world-s-fastest-lpddr5x-memory-10-7-gt-s">10.7 GT/s is the highest performing speed grade of LPDDR5X DRAM</a> slated to be released this year, so the upcoming Dimensity 9400 system-on-chip will get the highest memory bandwidth available for a mobile application processor.</p>
<p>The verification process involved Samsung's 16 GB LPDDR5X package and MediaTek's soon-to-be-announced Dimensity 9400 SoC for high-end 5G smartphones. Usage of LPDDR5X-10700 provides a memory bandwidth of 85.6 GB/second over a 64-bit interface, which will be available for bandwidth-hungry applications like graphics and generative AI.</p>
<p>"Working together with Samsung Electronics has made it possible for MediaTek's next-generation Dimensity chipset to become the world's first to be validated at LPDDR5X operating speeds up to 10.7Gbps, enabling upcoming devices to deliver AI functionality and mobile performance at a level we have never seen before," said JC Hsu, Corporate Senior Vice President at MediaTek. "This updated architecture will make it easier for developers and users to leverage more AI capabilities and take advantage of more features with less impact on battery life."</p>
<p>Samsung's LPDDR5X 10.7 GT/s memory in made on the company's 12nm-class DRAM process technology and is said to provide a more than 25% improvement in power efficiency over previous-generation LPDDR5X, in addition to extra performance. This will positively affect improved user experience, including enhanced on-device AI capabilities, such as faster voice-to-text conversion, and better quality graphics.</p>
<p>Overall, the two companies completed this process in just three months. Though it remains to be seen when smartphones based on the Dimensity 9400 application processor and LPDDR5X memory are set to be available on the market, as MediaTek has not yet even formally announced the SoC itself.</p>
<p>"Through our strategic cooperation with MediaTek, Samsung has verified the industry's fastest LPDDR5X DRAM that is poised to lead the AI smartphone market," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "Samsung will continue to innovate through active collaboration with customers and provide optimum solutions for the on-device AI era."</p>
</p> Memory | https://compbuddey.blogspot.com/2024/07/samsung-validates-lpddr5x-running-at_30.html){kind=link}
![](mailto:?subject=Samsung Validates LPDDR5X Running at 10.7 GT/sec with MediaTek's Dimensity 9400 SoC <p align="center"><a href="https://www.anandtech.com/show/21475/samsung-validates-lpddr5x-107-gts-with-mediateks-dimensity-9400-soc"><img src="https://images.anandtech.com/doci/21475/Samsung-Semiconductors-LPDDR5X-MediaTek-Platform-Validation_main2_crop_575px.jpg" alt="" /></a></p><p><p>Samsung has successfully validated its new LPDDR5X-10700 memory with MediaTek's upcoming Dimensity platform. At present, <a href="https://www.anandtech.com/show/21354/samsung-unveils-world-s-fastest-lpddr5x-memory-10-7-gt-s">10.7 GT/s is the highest performing speed grade of LPDDR5X DRAM</a> slated to be released this year, so the upcoming Dimensity 9400 system-on-chip will get the highest memory bandwidth available for a mobile application processor.</p>
<p>The verification process involved Samsung's 16 GB LPDDR5X package and MediaTek's soon-to-be-announced Dimensity 9400 SoC for high-end 5G smartphones. Usage of LPDDR5X-10700 provides a memory bandwidth of 85.6 GB/second over a 64-bit interface, which will be available for bandwidth-hungry applications like graphics and generative AI.</p>
<p>"Working together with Samsung Electronics has made it possible for MediaTek's next-generation Dimensity chipset to become the world's first to be validated at LPDDR5X operating speeds up to 10.7Gbps, enabling upcoming devices to deliver AI functionality and mobile performance at a level we have never seen before," said JC Hsu, Corporate Senior Vice President at MediaTek. "This updated architecture will make it easier for developers and users to leverage more AI capabilities and take advantage of more features with less impact on battery life."</p>
<p>Samsung's LPDDR5X 10.7 GT/s memory in made on the company's 12nm-class DRAM process technology and is said to provide a more than 25% improvement in power efficiency over previous-generation LPDDR5X, in addition to extra performance. This will positively affect improved user experience, including enhanced on-device AI capabilities, such as faster voice-to-text conversion, and better quality graphics.</p>
<p>Overall, the two companies completed this process in just three months. Though it remains to be seen when smartphones based on the Dimensity 9400 application processor and LPDDR5X memory are set to be available on the market, as MediaTek has not yet even formally announced the SoC itself.</p>
<p>"Through our strategic cooperation with MediaTek, Samsung has verified the industry's fastest LPDDR5X DRAM that is poised to lead the AI smartphone market," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "Samsung will continue to innovate through active collaboration with customers and provide optimum solutions for the on-device AI era."</p>
</p> Memory&body=https://compbuddey.blogspot.com/2024/07/samsung-validates-lpddr5x-running-at_30.html){kind=link}
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
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