Samsung Joins The 60 TB SSD Club, Looking Forward To 120 TB Drives
Multiple companies offer high-capacity SSDs, but until recently, only two companies offered high-performance 60 TB-class drives with a PCIe interface: Solidigm and Western Digital. As our colleagues from Blocks & Files discovered, Samsung quietly rolled out its BM1743 61.44 TB solid-state drive in mid-June and now envisions 120 TB-class SSDs based on the same platform.
Samsung's BM1743 61.44 TB features a proprietary controller and relies on Samsung's 7th Generation V-NAND (3D NAND) QLC memory. Moreover, Samsung believes that its 7th Gen V-NAND 'has the potential to accommodate up to 122.88 TB,'
Samsung plans to offer the BM1743 in two form factors: U.2 for PCIe 4.0 x4 to address traditional servers and E3.S for PCIe 5.0 x4 interfaces to address machines designed to offer maximum storage density. BM1743 can address various applications, including AI training and inference, content delivery networks, and read-intensive workloads. To that end, its write endurance is 0.26 drive writes per day (DWPD) over five years.
Regarding performance, Samsung's BM1743 is hardly a champion compared to high-end drives for gaming machines and workstations. The drive can sustainably achieve sequential read speeds of 7,200 MB/s and write speeds of 2,000 MB/s. It can handle up to 1.6 million 4K random reads and 110,000 4K random writes for random operations.
Power consumption details for the BM1743 have not been disclosed, though it is expected to be high. Meanwhile, the drive's key selling point is its massive storage density, which likely outweighs concerns over its absolute power efficiency for intended applications, as a 60 TB SSD still consumes less than multiple storage devices offering similar capacity and performance.
As noted above, Samsung's BM1743 61.44 TB faces limited competition in the market, so its price will be quite high. For example, Solidigm's D5-P5336 61.44 TB SSD costs $6,905. Other companies, such as Kioxia, Micron, and SK Hynix, have not yet introduced their 60TB-class SSDs, which gives Samsung and Solidigm an edge for now.
SSDs
Posted by The Techinical Support
XPG Demos "Nia" Handheld Gaming PC With Foveated Rendering, Swappable DRAM 
With the rise of the handheld gaming PC market, we've seen PC vendors and their partners toy with a number of tricks and tweaks to improve improve framerates in games, with some of their latest efforts on display at this year's Computex trade show. Perhaps the most interesting find thus far comes from ADATA sub-brand XPG, who is demoing their prototype "Nia" handheld PC, which uses eye tracking and dynamic foveated rendering to further improve their rendering performance.
For those unfamiliar, dynamic foveated rendering is a graphics technique that is sometimes used to boost performance in virtual reality (VR) and augmented reality (AR) applications by taking advantage of how human vision works. Typically, humans can only perceive detailed imagery in the relatively small central area of our vision called the fovea, while our peripheral vision is much less detailed. Dynamic foveated rendering, in turn, exploits this by using real-time eye tracking to determine where the user is looking, and then rendering just that area in high/full resolution, while rendering the peripheral areas in lower resolution. The net result is that only a fraction of the screen is rendered at full detail, which cuts down on the total amount of rendering work required and boosting framerates on performance-limited devices.
As stated before, this technology is sometimes used in high-end AR/VR headsets, where high resolution displays are placed mere inches from one's face. This ends up being an ideal use case for the technique, since at those distances, only a small fraction of the screen is within the fovea.
Using dynamic foveated rendering for a handheld, on the other hand, is a more novel application. All of the same visual principles apply, but the resolutions at play are lower, and the screen is farther from the users' eyes. This makes a handheld device a less ideal use case, at least on paper, as a larger portion of the screen is going to be in the fovea, and thus will need to be rendered at full resolution. None the less, it will be interesting to see how XPG's efforts pan out, and if dynamic foveated rendering is beneficial enough for handheld PCs. As we sometimes see with trade show demos, not everything makes it out of the prototype stage.
According to a press release put out by ADATA ahead of the trade show, the eye tracking technology is being provided by AMD collaborator Eyeware. Notably, their software-based approach runs on top of standard webcams, rather than requiring IR cameras. So the camera hardware itself should be pretty straight-forward.
Foveated rendering aside, XPG is making sure that the Nia won't be a one-trick pony. The handheld's other major claim to fame is its hardware swappability. The prototype handheld not only features a removable M.2-2230 SSD, but the company is also taking advantage of the recently-introduced LPCAMM2 memory module standard to introduce removable DRAM. Via a hatch in the back of the handheld, device owners would be able to swap out LPCAMM2 LPDDR5X modules for higher capacity versions. This would give the handheld an additional degree of future-proofness over current handhelds, which use non-replaceable soldered-down memory.
Rounding out the package, the current prototype is based on an AMD's Zen 4 Phoenix APU, which is used across both of the company's current mobile lines (Ryzen Mobile 7000/8000 and Ryzen Z1). Meanwhile, the unit's display is adjustable, allowing it to be angled away from the body of the handheld.
Assuming all goes well with the prototype, XPG aims to release a finished product in 2025.
ADATA
Kioxia Demonstrates Optical Interface SSDs for Data Centers 
A few years back, the Japanese government's New Energy and Industrial Technology Development Organization (NEDO ) allocated funding for the development of green datacenter technologies. With the aim to obtain up to 40% savings in overall power consumption, several Japanese companies have been developing an optical interface for their enterprise SSDs. And at this year's FMS, Kioxia had their optical interface on display.
For this demonstration, Kioxia took its existing CM7 enterprise SSD and created an optical interface for it. A PCIe card with on-board optics developed by Kyocera is installed in the server slot. An optical interface allows data transfer over long distances (it was 40m in the demo, but Kioxia promises lengths of up to 100m for the cable in the future). This allows the storage to be kept in a separate room with minimal cooling requirements compared to the rack with the CPUs and GPUs. Disaggregation of different server components will become an option as very high throughput interfaces such as PCIe 7.0 (with 128 GT/s rates) become available.
The demonstration of the optical SSD showed a slight loss in IOPS performance, but a significant advantage in the latency metric over the shipping enterprise SSD behind a copper network link. Obviously, there are advantages in wiring requirements and signal integrity maintenance with optical links.
Being a proof-of-concept demonstration, we do see the requirement for an industry-standard approach if this were to gain adoption among different datacenter vendors. The PCI-SIG optical workgroup will need to get its act together soon to create a standards-based approach to this problem.
Storage
XPG Demos "Nia" Handheld Gaming PC With Foveated Rendering, Swappable DRAM
With the rise of the handheld gaming PC market, we've seen PC vendors and their partners toy with a number of tricks and tweaks to improve improve framerates in games, with some of their latest efforts on display at this year's Computex trade show. Perhaps the most interesting find thus far comes from ADATA sub-brand XPG, who is demoing their prototype "Nia" handheld PC, which uses eye tracking and dynamic foveated rendering to further improve their rendering performance.
For those unfamiliar, dynamic foveated rendering is a graphics technique that is sometimes used to boost performance in virtual reality (VR) and augmented reality (AR) applications by taking advantage of how human vision works. Typically, humans can only perceive detailed imagery in the relatively small central area of our vision called the fovea, while our peripheral vision is much less detailed. Dynamic foveated rendering, in turn, exploits this by using real-time eye tracking to determine where the user is looking, and then rendering just that area in high/full resolution, while rendering the peripheral areas in lower resolution. The net result is that only a fraction of the screen is rendered at full detail, which cuts down on the total amount of rendering work required and boosting framerates on performance-limited devices.
As stated before, this technology is sometimes used in high-end AR/VR headsets, where high resolution displays are placed mere inches from one's face. This ends up being an ideal use case for the technique, since at those distances, only a small fraction of the screen is within the fovea.
Using dynamic foveated rendering for a handheld, on the other hand, is a more novel application. All of the same visual principles apply, but the resolutions at play are lower, and the screen is farther from the users' eyes. This makes a handheld device a less ideal use case, at least on paper, as a larger portion of the screen is going to be in the fovea, and thus will need to be rendered at full resolution. None the less, it will be interesting to see how XPG's efforts pan out, and if dynamic foveated rendering is beneficial enough for handheld PCs. As we sometimes see with trade show demos, not everything makes it out of the prototype stage.
According to a press release put out by ADATA ahead of the trade show, the eye tracking technology is being provided by AMD collaborator Eyeware. Notably, their software-based approach runs on top of standard webcams, rather than requiring IR cameras. So the camera hardware itself should be pretty straight-forward.
Foveated rendering aside, XPG is making sure that the Nia won't be a one-trick pony. The handheld's other major claim to fame is its hardware swappability. The prototype handheld not only features a removable M.2-2230 SSD, but the company is also taking advantage of the recently-introduced LPCAMM2 memory module standard to introduce removable DRAM. Via a hatch in the back of the handheld, device owners would be able to swap out LPCAMM2 LPDDR5X modules for higher capacity versions. This would give the handheld an additional degree of future-proofness over current handhelds, which use non-replaceable soldered-down memory.
Rounding out the package, the current prototype is based on an AMD's Zen 4 Phoenix APU, which is used across both of the company's current mobile lines (Ryzen Mobile 7000/8000 and Ryzen Z1). Meanwhile, the unit's display is adjustable, allowing it to be angled away from the body of the handheld.
Assuming all goes well with the prototype, XPG aims to release a finished product in 2025.
ADATA
Kioxia Demonstrates Optical Interface SSDs for Data Centers
A few years back, the Japanese government's New Energy and Industrial Technology Development Organization (NEDO ) allocated funding for the development of green datacenter technologies. With the aim to obtain up to 40% savings in overall power consumption, several Japanese companies have been developing an optical interface for their enterprise SSDs. And at this year's FMS, Kioxia had their optical interface on display.
For this demonstration, Kioxia took its existing CM7 enterprise SSD and created an optical interface for it. A PCIe card with on-board optics developed by Kyocera is installed in the server slot. An optical interface allows data transfer over long distances (it was 40m in the demo, but Kioxia promises lengths of up to 100m for the cable in the future). This allows the storage to be kept in a separate room with minimal cooling requirements compared to the rack with the CPUs and GPUs. Disaggregation of different server components will become an option as very high throughput interfaces such as PCIe 7.0 (with 128 GT/s rates) become available.
The demonstration of the optical SSD showed a slight loss in IOPS performance, but a significant advantage in the latency metric over the shipping enterprise SSD behind a copper network link. Obviously, there are advantages in wiring requirements and signal integrity maintenance with optical links.
Being a proof-of-concept demonstration, we do see the requirement for an industry-standard approach if this were to gain adoption among different datacenter vendors. The PCI-SIG optical workgroup will need to get its act together soon to create a standards-based approach to this problem.
Storage
CXL Gathers Momentum at FMS 2024 
The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had announced v3.0 of the CXL specifications. This was followed by CXL 3.1's introduction at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly subsumed other competing standards such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on the device side. At FMS 2024, CXL had a prime position in the booth demos of many vendors.
The migration of server platforms from DDR4 to DDR5, along with the rise of workloads demanding large RAM capacity (but not particularly sensitive to either memory bandwidth or latency), has opened up memory expansion modules as one of the first set of widely available CXL devices. Over the last couple of years, we have had product announcements from Samsung and Micron in this area.
SK hynix CMM-DDR5 CXL Memory Module and HMSDK
At FMS 2024, SK hynix was showing off their DDR5-based CMM-DDR5 CXL memory module with a 128 GB capacity. The company was also detailing their associated Heterogeneous Memory Software Development Kit (HMSDK) - a set of libraries and tools at both the kernel and user levels aimed at increasing the ease of use of CXL memory. This is achieved in part by considering the memory pyramid / hierarchy and relocating the data between the server's main memory (DRAM) and the CXL device based on usage frequency.
The CMM-DDR5 CXL memory module comes in the SDFF form-factor (E3.S 2T) with a PCIe 3.0 x8 host interface. The internal memory is based on 1α technology DRAM, and the device promises DDR5-class bandwidth and latency within a single NUMA hop. As these memory modules are meant to be used in datacenters and enterprises, the firmware includes features for RAS (reliability, availability, and serviceability) along with secure boot and other management features.
SK hynix was also demonstrating Niagara 2.0 - a hardware solution (currently based on FPGAs) to enable memory pooling and sharing - i.e, connecting multiple CXL memories to allow different hosts (CPUs and GPUs) to optimally share their capacity. The previous version only allowed capacity sharing, but the latest version enables sharing of data also. SK hynix had presented these solutions at the CXL DevCon 2024 earlier this year, but some progress seems to have been made in finalizing the specifications of the CMM-DDR5 at FMS 2024.
Microchip and Micron Demonstrate CZ120 CXL Memory Expansion Module
Micron had unveiled the CZ120 CXL Memory Expansion Module last year based on the Microchip SMC 2000 series CXL memory controller. At FMS 2024, Micron and Microchip had a demonstration of the module on a Granite Rapids server.
Additional insights into the SMC 2000 controller were also provided.
The CXL memory controller also incorporates DRAM die failure handling, and Microchip also provides diagnostics and debug tools to analyze failed modules. The memory controller also supports ECC, which forms part of the enterprise... Storage
![](https://twitter.com/share?url=https://compbuddey.blogspot.com/2024/07/samsung-joins-60-tb-ssd-club-looking_13.html&text=Samsung Joins The 60 TB SSD Club, Looking Forward To 120 TB Drives <p align="center"><a href="https://www.anandtech.com/show/21465/samsung-joins-the-60-tb-ssd-club-looking-forward-to-120-tb-drives"><img src="https://images.anandtech.com/doci/21465/samsung-ssd-bm1743-678_575px.jpg" alt="" /></a></p><p><p>Multiple companies offer high-capacity SSDs, but until recently, only two companies offered high-performance 60 TB-class drives with a PCIe interface: Solidigm and Western Digital. As our colleagues from <a href="https://blocksandfiles.com/2024/07/02/samsung-bm1743-qlc-flash/">Blocks & Files</a> discovered, Samsung quietly rolled out its BM1743 61.44 TB solid-state drive in mid-June and now envisions 120 TB-class SSDs based on the same platform.</p>
<p>Samsung's BM1743 61.44 TB features a proprietary controller and relies on Samsung's 7<sup>th</sup> Generation V-NAND (3D NAND) QLC memory. Moreover, Samsung believes that its 7<sup>th</sup> Gen V-NAND 'has the potential to accommodate up to 122.88 TB,' </p>
<p>Samsung plans to offer the BM1743 in two form factors: U.2 for PCIe 4.0 x4 to address traditional servers and E3.S for PCIe 5.0 x4 interfaces to address machines designed to offer maximum storage density. BM1743 can address various applications, including AI training and inference, content delivery networks, and read-intensive workloads. To that end, its write endurance is 0.26 drive writes per day (DWPD) over five years.</p>
<p>Regarding performance, Samsung's BM1743 is hardly a champion compared to high-end drives for gaming machines and workstations. The drive can sustainably achieve sequential read speeds of 7,200 MB/s and write speeds of 2,000 MB/s. It can handle up to 1.6 million 4K random reads and 110,000 4K random writes for random operations.</p>
<p>Power consumption details for the BM1743 have not been disclosed, though it is expected to be high. Meanwhile, the drive's key selling point is its massive storage density, which likely outweighs concerns over its absolute power efficiency for intended applications, as a 60 TB SSD still consumes less than multiple storage devices offering similar capacity and performance.</p>
<p>As noted above, Samsung's BM1743 61.44 TB faces limited competition in the market, so its price will be quite high. For example, Solidigm's D5-P5336 61.44 TB SSD costs <a href="https://www.shopblt.com/item/solidigm-d5-p5336-61.44tb-2.5in-pcie/750y_sbfpf2bv614t001.html">$6,905</a>. Other companies, such as Kioxia, Micron, and SK Hynix, have not yet introduced their 60TB-class SSDs, which gives Samsung and Solidigm an edge for now.</p>
</p> SSDs){kind=link}
![](https://www.pinterest.com/pin/create/button/?url=https://compbuddey.blogspot.com/2024/07/samsung-joins-60-tb-ssd-club-looking_13.html&media=https://lh3.googleusercontent.com/blogger_img_proxy/AEn0k_t3ZvD-dL4U4GjPh550KS1FqbJKoE4xOKRPrpbJInZtTk3FNeTc2VP8wED_Y3XBfNCS7u7zDsRqpBVbSZZBuhPjluiRov7I2iSo2eBQaffsXF42KnZIC5jhieDkkaCSFtJyTEVWbXMhbXFJ9A&description=Samsung Joins The 60 TB SSD Club, Looking Forward To 120 TB Drives <p align="center"><a href="https://www.anandtech.com/show/21465/samsung-joins-the-60-tb-ssd-club-looking-forward-to-120-tb-drives"><img src="https://images.anandtech.com/doci/21465/samsung-ssd-bm1743-678_575px.jpg" alt="" /></a></p><p><p>Multiple companies offer high-capacity SSDs, but until recently, only two companies offered high-performance 60 TB-class drives with a PCIe interface: Solidigm and Western Digital. As our colleagues from <a href="https://blocksandfiles.com/2024/07/02/samsung-bm1743-qlc-flash/">Blocks & Files</a> discovered, Samsung quietly rolled out its BM1743 61.44 TB solid-state drive in mid-June and now envisions 120 TB-class SSDs based on the same platform.</p>
<p>Samsung's BM1743 61.44 TB features a proprietary controller and relies on Samsung's 7<sup>th</sup> Generation V-NAND (3D NAND) QLC memory. Moreover, Samsung believes that its 7<sup>th</sup> Gen V-NAND 'has the potential to accommodate up to 122.88 TB,' </p>
<p>Samsung plans to offer the BM1743 in two form factors: U.2 for PCIe 4.0 x4 to address traditional servers and E3.S for PCIe 5.0 x4 interfaces to address machines designed to offer maximum storage density. BM1743 can address various applications, including AI training and inference, content delivery networks, and read-intensive workloads. To that end, its write endurance is 0.26 drive writes per day (DWPD) over five years.</p>
<p>Regarding performance, Samsung's BM1743 is hardly a champion compared to high-end drives for gaming machines and workstations. The drive can sustainably achieve sequential read speeds of 7,200 MB/s and write speeds of 2,000 MB/s. It can handle up to 1.6 million 4K random reads and 110,000 4K random writes for random operations.</p>
<p>Power consumption details for the BM1743 have not been disclosed, though it is expected to be high. Meanwhile, the drive's key selling point is its massive storage density, which likely outweighs concerns over its absolute power efficiency for intended applications, as a 60 TB SSD still consumes less than multiple storage devices offering similar capacity and performance.</p>
<p>As noted above, Samsung's BM1743 61.44 TB faces limited competition in the market, so its price will be quite high. For example, Solidigm's D5-P5336 61.44 TB SSD costs <a href="https://www.shopblt.com/item/solidigm-d5-p5336-61.44tb-2.5in-pcie/750y_sbfpf2bv614t001.html">$6,905</a>. Other companies, such as Kioxia, Micron, and SK Hynix, have not yet introduced their 60TB-class SSDs, which gives Samsung and Solidigm an edge for now.</p>
</p> SSDs){kind=link}
![](https://web.whatsapp.com/send?text=Samsung Joins The 60 TB SSD Club, Looking Forward To 120 TB Drives <p align="center"><a href="https://www.anandtech.com/show/21465/samsung-joins-the-60-tb-ssd-club-looking-forward-to-120-tb-drives"><img src="https://images.anandtech.com/doci/21465/samsung-ssd-bm1743-678_575px.jpg" alt="" /></a></p><p><p>Multiple companies offer high-capacity SSDs, but until recently, only two companies offered high-performance 60 TB-class drives with a PCIe interface: Solidigm and Western Digital. As our colleagues from <a href="https://blocksandfiles.com/2024/07/02/samsung-bm1743-qlc-flash/">Blocks & Files</a> discovered, Samsung quietly rolled out its BM1743 61.44 TB solid-state drive in mid-June and now envisions 120 TB-class SSDs based on the same platform.</p>
<p>Samsung's BM1743 61.44 TB features a proprietary controller and relies on Samsung's 7<sup>th</sup> Generation V-NAND (3D NAND) QLC memory. Moreover, Samsung believes that its 7<sup>th</sup> Gen V-NAND 'has the potential to accommodate up to 122.88 TB,' </p>
<p>Samsung plans to offer the BM1743 in two form factors: U.2 for PCIe 4.0 x4 to address traditional servers and E3.S for PCIe 5.0 x4 interfaces to address machines designed to offer maximum storage density. BM1743 can address various applications, including AI training and inference, content delivery networks, and read-intensive workloads. To that end, its write endurance is 0.26 drive writes per day (DWPD) over five years.</p>
<p>Regarding performance, Samsung's BM1743 is hardly a champion compared to high-end drives for gaming machines and workstations. The drive can sustainably achieve sequential read speeds of 7,200 MB/s and write speeds of 2,000 MB/s. It can handle up to 1.6 million 4K random reads and 110,000 4K random writes for random operations.</p>
<p>Power consumption details for the BM1743 have not been disclosed, though it is expected to be high. Meanwhile, the drive's key selling point is its massive storage density, which likely outweighs concerns over its absolute power efficiency for intended applications, as a 60 TB SSD still consumes less than multiple storage devices offering similar capacity and performance.</p>
<p>As noted above, Samsung's BM1743 61.44 TB faces limited competition in the market, so its price will be quite high. For example, Solidigm's D5-P5336 61.44 TB SSD costs <a href="https://www.shopblt.com/item/solidigm-d5-p5336-61.44tb-2.5in-pcie/750y_sbfpf2bv614t001.html">$6,905</a>. Other companies, such as Kioxia, Micron, and SK Hynix, have not yet introduced their 60TB-class SSDs, which gives Samsung and Solidigm an edge for now.</p>
</p> SSDs | https://compbuddey.blogspot.com/2024/07/samsung-joins-60-tb-ssd-club-looking_13.html){kind=link}
![](mailto:?subject=Samsung Joins The 60 TB SSD Club, Looking Forward To 120 TB Drives <p align="center"><a href="https://www.anandtech.com/show/21465/samsung-joins-the-60-tb-ssd-club-looking-forward-to-120-tb-drives"><img src="https://images.anandtech.com/doci/21465/samsung-ssd-bm1743-678_575px.jpg" alt="" /></a></p><p><p>Multiple companies offer high-capacity SSDs, but until recently, only two companies offered high-performance 60 TB-class drives with a PCIe interface: Solidigm and Western Digital. As our colleagues from <a href="https://blocksandfiles.com/2024/07/02/samsung-bm1743-qlc-flash/">Blocks & Files</a> discovered, Samsung quietly rolled out its BM1743 61.44 TB solid-state drive in mid-June and now envisions 120 TB-class SSDs based on the same platform.</p>
<p>Samsung's BM1743 61.44 TB features a proprietary controller and relies on Samsung's 7<sup>th</sup> Generation V-NAND (3D NAND) QLC memory. Moreover, Samsung believes that its 7<sup>th</sup> Gen V-NAND 'has the potential to accommodate up to 122.88 TB,' </p>
<p>Samsung plans to offer the BM1743 in two form factors: U.2 for PCIe 4.0 x4 to address traditional servers and E3.S for PCIe 5.0 x4 interfaces to address machines designed to offer maximum storage density. BM1743 can address various applications, including AI training and inference, content delivery networks, and read-intensive workloads. To that end, its write endurance is 0.26 drive writes per day (DWPD) over five years.</p>
<p>Regarding performance, Samsung's BM1743 is hardly a champion compared to high-end drives for gaming machines and workstations. The drive can sustainably achieve sequential read speeds of 7,200 MB/s and write speeds of 2,000 MB/s. It can handle up to 1.6 million 4K random reads and 110,000 4K random writes for random operations.</p>
<p>Power consumption details for the BM1743 have not been disclosed, though it is expected to be high. Meanwhile, the drive's key selling point is its massive storage density, which likely outweighs concerns over its absolute power efficiency for intended applications, as a 60 TB SSD still consumes less than multiple storage devices offering similar capacity and performance.</p>
<p>As noted above, Samsung's BM1743 61.44 TB faces limited competition in the market, so its price will be quite high. For example, Solidigm's D5-P5336 61.44 TB SSD costs <a href="https://www.shopblt.com/item/solidigm-d5-p5336-61.44tb-2.5in-pcie/750y_sbfpf2bv614t001.html">$6,905</a>. Other companies, such as Kioxia, Micron, and SK Hynix, have not yet introduced their 60TB-class SSDs, which gives Samsung and Solidigm an edge for now.</p>
</p> SSDs&body=https://compbuddey.blogspot.com/2024/07/samsung-joins-60-tb-ssd-club-looking_13.html){kind=link}
Kioxia Demonstrates Optical Interface SSDs for Data Centers
A few years back, the Japanese government's New Energy and Industrial Technology Development Organization (NEDO ) allocated funding for the development of green datacenter technologies. With the aim to obtain up to 40% savings in overall power consumption, several Japanese companies have been developing an optical interface for their enterprise SSDs. And at this year's FMS, Kioxia had their optical interface on display.
For this demonstration, Kioxia took its existing CM7 enterprise SSD and created an optical interface for it. A PCIe card with on-board optics developed by Kyocera is installed in the server slot. An optical interface allows data transfer over long distances (it was 40m in the demo, but Kioxia promises lengths of up to 100m for the cable in the future). This allows the storage to be kept in a separate room with minimal cooling requirements compared to the rack with the CPUs and GPUs. Disaggregation of different server components will become an option as very high throughput interfaces such as PCIe 7.0 (with 128 GT/s rates) become available.
The demonstration of the optical SSD showed a slight loss in IOPS performance, but a significant advantage in the latency metric over the shipping enterprise SSD behind a copper network link. Obviously, there are advantages in wiring requirements and signal integrity maintenance with optical links.
Being a proof-of-concept demonstration, we do see the requirement for an industry-standard approach if this were to gain adoption among different datacenter vendors. The PCI-SIG optical workgroup will need to get its act together soon to create a standards-based approach to this problem.
Storage
U.S. Signs $1.5B in CHIPS Act Agreements With Amkor and SKhynix for Chip Packaging Plants 
Under the CHIPS & Science Act, the U.S. government provided tens of billions of dollars in grants and loans to the world's leading maker of chips, such as Intel, Samsung, and TSMC, which will significantly expand the country's semiconductor production industry in the coming years. However, most chips are typically tested, assembled, and packaged in Asia, which has left the American supply chain incomplete. Addressing this last gap in the government's domestic chip production plans, these past couple of weeks the U.S. government signed memorandums of understanding worth about $1.5 billion with Amkor and SK hynix to support their efforts to build chip packaging facilities in the U.S.
Amkor to Build Advanced Packaging Facility with Apple in Mind
Amkor plans to build a $2 billion advanced packaging facility near Peoria, Arizona, to test and assemble chips produced by TSMC at its Fab 21 near Phoenix, Arizona. The company signed a MOU that offers $400 million in direct funding and access to $200 million in loans under the CHIPS & Science Act. In addition, the company plans to take advantage of a 25% investment tax credit on eligible capital expenditures.
Set to be strategically positioned near TSMC's upcoming Fab 21 complex in Arizona, Amkor's Peoria facility will occupy 55 acres and, when fully completed, will feature over 500,000 square feet (46,451 square meters) of cleanroom space, more than twice the size of Amkor's advanced packaging site in Vietnam. Although the company has not disclosed the exact capacity or the specific technologies the facility will support, it is expected to cater to a wide range of industries, including automotive, high-performance computing, and mobile technologies. This suggests the new plant will offer diverse packaging solutions, including traditional, 2.5D, and 3D technologies.
Amkor has collaborated extensively with Apple on the vision and initial setup of the Peoria facility, as Apple is slated to be the facility's first and largest customer, marking a significant commitment from the tech giant. This partnership highlights the importance of the new facility in reinforcing the U.S. semiconductor supply chain and positioning Amkor as a key partner for companies relying on TSMC's manufacturing capabilities. The project is expected to generate around 2,000 jobs and is scheduled to begin operations in 2027.
SK hynix to Build HBM4 in the U.S.
This week SK hynix also signed a preliminary agreement with the U.S. government to receive up to $450 million in direct funding and $500 million in loans to build an advanced memory packaging facility in West Lafayette, Indiana.
The proposed facility is scheduled to begin operations in 2028, which means that it will assemble HBM4 or HBM4E memory. Meanwhile, DRAM devices for high bandwidth memory (HBM) stacks will still be produced in South Korea. Nonetheless, packing finished HBM4/HBM4E in the U.S. and possibly integrating these memory modules with high-end processors is a big deal.
In addition to building its packaging plant, SK hynix plans to collaborate with Purdue University and other local research institutions to advance semiconductor technology and packaging innovations. This partnership is intended to bolster research and development in the region, positioning the facility as a hub for AI technology and skilled employment.
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XPG Demos "Nia" Handheld Gaming PC With Foveated Rendering, Swappable DRAM
With the rise of the handheld gaming PC market, we've seen PC vendors and their partners toy with a number of tricks and tweaks to improve improve framerates in games, with some of their latest efforts on display at this year's Computex trade show. Perhaps the most interesting find thus far comes from ADATA sub-brand XPG, who is demoing their prototype "Nia" handheld PC, which uses eye tracking and dynamic foveated rendering to further improve their rendering performance.
For those unfamiliar, dynamic foveated rendering is a graphics technique that is sometimes used to boost performance in virtual reality (VR) and augmented reality (AR) applications by taking advantage of how human vision works. Typically, humans can only perceive detailed imagery in the relatively small central area of our vision called the fovea, while our peripheral vision is much less detailed. Dynamic foveated rendering, in turn, exploits this by using real-time eye tracking to determine where the user is looking, and then rendering just that area in high/full resolution, while rendering the peripheral areas in lower resolution. The net result is that only a fraction of the screen is rendered at full detail, which cuts down on the total amount of rendering work required and boosting framerates on performance-limited devices.
As stated before, this technology is sometimes used in high-end AR/VR headsets, where high resolution displays are placed mere inches from one's face. This ends up being an ideal use case for the technique, since at those distances, only a small fraction of the screen is within the fovea.
Using dynamic foveated rendering for a handheld, on the other hand, is a more novel application. All of the same visual principles apply, but the resolutions at play are lower, and the screen is farther from the users' eyes. This makes a handheld device a less ideal use case, at least on paper, as a larger portion of the screen is going to be in the fovea, and thus will need to be rendered at full resolution. None the less, it will be interesting to see how XPG's efforts pan out, and if dynamic foveated rendering is beneficial enough for handheld PCs. As we sometimes see with trade show demos, not everything makes it out of the prototype stage.
According to a press release put out by ADATA ahead of the trade show, the eye tracking technology is being provided by AMD collaborator Eyeware. Notably, their software-based approach runs on top of standard webcams, rather than requiring IR cameras. So the camera hardware itself should be pretty straight-forward.
Foveated rendering aside, XPG is making sure that the Nia won't be a one-trick pony. The handheld's other major claim to fame is its hardware swappability. The prototype handheld not only features a removable M.2-2230 SSD, but the company is also taking advantage of the recently-introduced LPCAMM2 memory module standard to introduce removable DRAM. Via a hatch in the back of the handheld, device owners would be able to swap out LPCAMM2 LPDDR5X modules for higher capacity versions. This would give the handheld an additional degree of future-proofness over current handhelds, which use non-replaceable soldered-down memory.
Rounding out the package, the current prototype is based on an AMD's Zen 4 Phoenix APU, which is used across both of the company's current mobile lines (Ryzen Mobile 7000/8000 and Ryzen Z1). Meanwhile, the unit's display is adjustable, allowing it to be angled away from the body of the handheld.
Assuming all goes well with the prototype, XPG aims to release a finished product in 2025.
ADATA
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