As sales of GPU-based AI accelerators remain as strong as ever, the immense demand for these cards has led to some server builders going off the beaten path in order to get the hardware they want at a lower price. While both NVIDIA and AMD offer official card configurations for servers, the correspondingly high price of these cards makes them a significant financial outlay that some customers either can't afford, or don't want to pay.
Instead, these groups have been turning to buying up consumer graphics cards, which although they come with additional limitations, are also a fraction of the cost of a "proper" server card. And this week, ASRock has removed another one of those limitations for would-be AMD Radeon users, with the introduction of a set of compact, passively-cooled Radeon RX 7900 XTX and RX 7900 XT video cards that are designed to go in servers.
Without any doubts, ASRock's AMD Radeon RX 7900 XTX Passive 24GB and AMD Radeon RX 7900 XT Passive 20GB AIBs are indeed graphics cards with four display outputs and based on the Navi 31 graphics processor (with 6144 and 5376 stream processors, respectively), so they can output graphics and work both with games and professional applications. And with TGPs of 355W and 315W respectively, these cards aren't underclocked in any way compared to traditional desktop cards. However, unlike a typical desktop card, the cooler on these cards is a dual-slot heatsink without any kind of fan attached, which is meant to be used with high-airflow forced-air cooling.
All-told, ASRock's passive cooler is pretty capable, as well; it's not just a simple aluminum heatsink. Beneath the fins, ASRock has gone with a vapor chamber and multiple heat pipes to distribute heat to the rest of the sink. Even with forced-air cooling in racked servers, the heatsink itself still needs to be efficient to keep a 300W+ card cool with only a dual-slot cooler – and especially so when upwards of four of these cards are installed side-by-side with each other. To make the boards even more server friendly, these cards are equipped with a 12V-2×6 power connector, a first for the Radeon RX 7900 series, simplifying installation by reducing cable clutter.
Driving the demand for these cards in particular is their memory configuration. With 24GB for the 7900 XTX and 20GB for the 7900 XT is half as much (or less) memory than can be found on AMD and NVIDIA's high-end professional and server cards, AMD is the only vendor offering consumer cards with this much memory for less than $1000. So for a memory-intensive AI inference cluster built on a low budget, the cheapest 24GB card available starts looking like a tantalizing option.
Otherwise, ASRock's Radeon RX 7900 Passive cards distinguish themselves from AMD's formal professional and server cards by what they're not capable of doing: namely, remote professional graphics or other applications that need things like GPU partitioning. These parts look to be aimed at one application only, artificial intelligence, and are meant to process huge amounts of data. For this purpose, their passive coolers will do the job and the lack of ProViz or VDI-oriented drives ensure that AMD will leave these lucrative markets for itself.
GPUsTwo Is Better Than One: LG Starts Production of 13-inch Tandem OLED Display for Laptops OLED panels have a number of advantages, including deep blacks, fast response times, and energy efficiency; most of these stemming from the fact that they do not need backlighting. However they also have drawbacks, as well, as trying to drive them to be as bright as a high-tier LCD will quickly wear out the organic material used. Researchers have been spending the past couple of decades developing ways to prolong the lifespans of OLED materials, and recently LG has put together a novel (if brute force) solution: halve the work by doubling the number of pixels. This is the basis of the company's new tandem OLED technology, which has recently gone into mass production. The Tandem OLED technology introduced by LG Display uses two stacks of red, green, and blue (RGB) organic light-emitting layers, which are layered on top fo each other, essentially reducing how bright each layer needs to individually be in order to hit a specific cumulative brightness. By combining multiple OLED pixels running at a lower brightness, tandem OLED displays are intended to offer higher brightness and durability than traditional single panel OLED displays, reducing the wear on the organic materials in normal situations – and by extension, making it possible to crank up the brightness of the panels well beyond what a single panel could sustain without cooking itself. Overall, LG claims that tandem panels can hit over three-times the brightness of standard OLED panels. The switch to tandem panels also comes with energy efficiency benefits, as the power consumption of OLED pixels is not linear with the output brightness. According to LG, their tandem panels consume up to 40% less power. More interesting from the manufacturing side of matters, LG's tandem panel stack is 40% thinner (and 28%) lighter than existing OLED laptop screens, despite having to get a whole second layer of pixels in there. In terms of specifications, the 13-inch tandem OLED panel feature a WQXGA+ (2880×1800) resolution and can cover 100% of the DCI-P3 color gamut. The panel is also certified to meet VESA's Display HDR True Black 500 requirements, which among other things, requires that it can hit 500 nits of brightness. And given that this tech is meant to go into tablets and laptops, it shouldn't come as any surprise that the display panel is also touch sensitive, as well. "We will continue to strengthen the competitiveness of OLED products for IT applications and offer differentiated customer value based on distinctive strengths of Tandem OLED, such as long life, high brightness, and low power consumption," said Jae-Won Jang, Vice President and Head of the Medium Display Product Planning Division at LG Display. Without any doubts, LG's Tandem OLED display panel looks impressive. The company is banking on it doing well in the high-end laptop and tablet markets, where manufacturers have been somewhat hesitant to embrace OLED displays due to power concerns. The technology has already been adopted by Apple for their most recent iPad Pro tablets, and now LG is making it available to a wider group of OEMs. What remains to be seen is the technology's cost. Computer-grade OLED panels are already a more expensive option, and this one ups the ante with two layers of OLED pixels. So it isn't a question of whether it will be reserved for premium, high-margin devices, but a matter of just how much it will add to the final price tag. For now, LG Display does not disclose which PC OEMs are set to use its 13-inch Tandem OLED panel, though as the company is a supplier to virtually all of the PC OEMs, there's little doubt it should crop up in multiple laptops soon enough. Displays
Micron: U.S. Fabs Will Start Operating in 2026 - 2029 When Micron announced plans to build two new fabs in the U.S. in 2022, the company vaguely said both would come online by the decade's end. Then, in 2023, it began to optimize its spending, which pushed production at these fabrication facilities. This week, the company outlined more precise timeframes for when its fabs in Idaho and New York will start operations: this will happen from calendar 2026 to calendar 2029. "These fab construction investments are necessary to support supply growth for the latter half of this decade," a statement by Micron in its Q3 FY2024 financial results report reads. "This Idaho fab will not contribute to meaningful bit supply until fiscal 2027 and the New York construction capex is not expected to contribute to bit supply growth until fiscal 2028 or later. The timing of future [wafer fab equipment] spend in these fabs will be managed to align supply growth with expected demand growth." Micron's fiscal year 2027 starts in September 2026, so the new fab near Boise, Idaho, is set to start operations between September 2026 and September 2027. The company's fiscal 2028 starts in September 2027, so the fab will likely begin operations in calendar 2028 or later, probably depending on the demand for DRAM memory in the coming years. That said, Micron's U.S. memory fabs will begin operations between late 2026 and 2029, which aligns with the company's original plans. Construction of the fab in Idaho is well underway. In contrast, construction of the New York facility has yet to begin as the company is working on regulatory and permitting processes in the state. Micron's capital expenditure (CaPex) plan for FY2024 is approximately $8.0 billion, with a decrease in year-over-year spending on wafer fabrication equipment (WFE). In Q4 FY2024, the company will spend around $3 billion on fab construction, new wafer fab tools, and various expansions/upgrades. Looking ahead to FY2025, the company plans a substantial increase in capex, targeting a mid-30s percentage of revenue to support various technological and facility advancements. In particular, it expects its quarterly CapEx to average above the $3 billion level seen in the fourth quarter of FY2024, which means that it plans to spend about $12 billion in its fiscal 2025, which begins in late September. Half or more of the total CapEx increase in FY2025 (i.e., over $2 billion) will be allocated to constructing new fabs in Idaho and New York. Meanwhile, the FY2025 CapEx will significantly rise to fund high-bandwidth memory (HBM) assembly and testing and the construction of fabrication and back-end facilities. This increase also includes investments in technology transitions to meet growing demand. "Fab construction in Idaho is underway, and we are working diligently to complete the regulatory and permitting processes in New York," said Sanjay Mehrotra, chief executive officer of Micron, at the company's conference call with investors and financial analysts (via SeekingAlpha). "This additional leading-edge greenfield capacity, along with continued technology transition investments in our Asia facilities, is required to meet long-term demand in the second half of this decade and beyond. These investments support our objective to maintain our current bit share over time and to grow our memory bit supply in line with long-term industry bit demand." Memory
G.Skill on Tuesday introduced its ultra-low-latency DDR5-6400 memory modules that feature a CAS latency of 30 clocks, which appears to be the industry's most aggressive timings yet for DDR5-6400 sticks. The modules will be available for both AMD and Intel CPU-based systems.
With every new generation of DDR memory comes an increase in data transfer rates and an extension of relative latencies. While for the vast majority of applications, the increased bandwidth offsets the performance impact of higher timings, there are applications that favor low latencies. However, shrinking latencies is sometimes harder than increasing data transfer rates, which is why low-latency modules are rare.
Nonetheless, G.Skill has apparently managed to cherry-pick enough DDR5 memory chips and build appropriate printed circuit boards to produce DDR5-6400 modules with CL30 timings, which are substantially lower than the CL46 timings recommended by JEDEC for this speed bin. This means that while JEDEC-standard modules have an absolute latency of 14.375 ns, G.Skill's modules can boast a latency of just 9.375 ns – an approximately 35% decrease.
G.Skill's DDR5-6400 CL30 39-39-102 modules have a capacity of 16 GB and will be available in 32 GB dual-channel kits, though the company does not disclose voltages, which are likely considerably higher than those standardized by JEDEC.
The company plans to make its DDR5-6400 modules available both for AMD systems with EXPO profiles (Trident Z5 Neo RGB and Trident Z5 Royal Neo) and for Intel-powered PCs with XMP 3.0 profiles (Trident Z5 RGB and Trident Z5 Royal). For AMD AM5 systems that have a practical limitation of 6000 MT/s – 6400 MT/s for DDR5 memory (as this is roughly as fast as AMD's Infinity Fabric can operate at with a 1:1 ratio), the new modules will be particularly beneficial for AMD's Ryzen 7000 and Ryzen 9000-series processors.
G.Skill notes that since its modules are non-standard, they will not work with all systems but will operate on high-end motherboards with properly cooled CPUs.
The new ultra-low-latency memory kits will be available worldwide from G.Skill's partners starting in late August 2024. The company did not disclose the pricing of these modules, but since we are talking about premium products that boast unique specifications, they are likely to be priced accordingly.
MemoryMicrochip recently announced the availability of their second PCIe Gen 5 enterprise SSD controller - the Flashtec 5016. Like the 4016, this is also a 16-channel controller, but there are some key updates:
Microchip's enterprise SSD controllers provide a high level of flexibility to SSD vendors by providing them with significant horsepower and accelerators. The 5016 includes Cortex-A53 cores for SSD vendors to run custom applications relevant to SSD management. However, compared to the Gen4 controllers, there are two additional cores in the CPU cluster. The DRAM subsystem includes ECC support (both out-of-band and inline, as desired by the SSD vendor).
At FMS 2024, the company demonstrated an application of the neural network engines embedded in the Gen5 controllers. Controllers usually employ a 'read-retry' operation with altered read-out voltages for flash reads that do not complete successfully. Microchip implemented a machine learning approach to determine the read-out voltage based on the health history of the NAND block using the NN engines in the controller. This approach delivers tangible benefits for read latency and power consumption (thanks to a smaller number of errors on the first read).
The 4016 and 5016 come with a single-chip root of trust implementation for hardware security. A secure boot process with dual-signature authentication ensures that the controller firmware is not maliciously altered in the field. The company also brought out the advantages of their controller's implementation of SR-IOV, flexible data placement, and zoned namespaces along with their 'credit engine' scheme for multi-tenant cloud workloads. These aspects were also brought out in other demonstrations.
Microchip's press release included quotes from the usual NAND vendors - Solidigm, Kioxia, and Micron. On the customer front, Longsys has been using Flashtec controllers in their enterprise offerings along with YMTC NAND. It is likely that this collaboration will continue further using the new 5016 controller.
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