The Intel Computex 2024 Keynote Live Blog (8:00pm PT/03:00 UTC)
Closing out the last of the major PC-focused keynotes at Computex 2024 this evening, we have Intel. The long-reigning leader of the PC CPU market, Intel is in the middle of executing its plans to get back on track on both the manufacturing and chip design aspects of the business. Tonight’s keynote, being helmed by the highly-animated Pat Gelsinger, is titled “Bringing AI Everywhere.” And, like so many other Computex presentations and announcements this week, AI hardware is going to play a big part, as Intel outlines a full stack of products for client and server computing.
Of the four great PC chip vendors at the show, Intel has been the most up-front about what to expect from their hour-long presentation. The company’s Computex 2024 page already outlines their four major topics: AI PCs, Xeon 6 Processors, Gaudi AI accelerators, and Intel’s OpenVINO software ecosystem.
On the consumer hardware front, the company set the table with a significant teaser earlier this month about their forthcoming mobile PC SoC, Lunar Lake. The next generation of Core Ultra processors, Intel is touting significant energy efficiency gains for the mobile-focused chip, with new architectures driving their Performance and Efficiency CPU cores, Xe2 GPU, and a much faster 45+ TOPS (INT8) NPU. While the Lunar Lake announcement is coming relatively soon after the Meteor Lake launch, Intel has made it clear that it’s not going to hold back on shipping future products; they are looking to make up for lost time. Still, Lunar Lake devices are not expected to hit retail shelves until Q4 of this year, so this announcement is coming months in advance of the hardware itself.
On the server front, Intel has been publicly prepping for the launch of a new generation of Xeons with the Xeon 6 platform. The most notable part of this being the release of the company’s first Efficiency-core Xeon, Sierra Forest. Sierra Forest is set to be the first Xeon 6 chip out the door this year, and will offer up to 288 E cores on a single chip, allowing Intel to tap into the many (many) core CPU markets that AMD and Arm-based rivals have been unopposed at thus far.
Finally, the company has fully pivoted its server AI accelerator strategy to its Gaudi accelerators. Gaudi 3 was introduced back in April, and while it isn’t expected to go toe-to-toe with NVIDIA’s top accelerators in every workload, Intel is betting that they can beat NVIDIA on critical workloads, all while undercutting them significantly in pricing. The first Gaudi 3 parts are set to be released in the second half of this year, so hopefully we’ll be hearing a bit more about Intel’s plans as part of their keynote.
As always, the AnandTech crew is live and in person to catch this final Computex keynote. So please come join us at 8:00pm PT / 11:00pm ET / 03:00 UTC to get all the details.
Live Blog
Posted by The Techinical Support
Samsung Foundry Unveils Updated Roadmap: BSPDN and 2nm Evolution Through 2027 
Samsung this week has unveiled its latest process technologies roadmap at the company's Samsung Foundry Forum (SFF) U.S. The new plan covers the evolution of Samsung's 2nm-class production nodes through 2027, including a process technology with a backside power delivery, re-emphasizing plans to bring out a 1.4nm-class node in 2027, and the introduction of a 'high value' 4nm-class manufacturing tech.
Samsung Foundry's key announcements for today are clearly focused on the its 2nm-class process technologies, which are set to enter production in 2025 and will span to 2027, when the company's 1.4-nm class production node is set to enter the scene. Samsung is also adding (or rather, renaming) another 2nm-class node to their roadmap with SF2, which was previously disclosed by Samsung as SF3P and aimed at high-performance devices.
"We have refined and improved the SF3P, resulting in what we now refer to as SF2," a Samsung spokesperson told AnandTech. "This enhanced node incorporates various process design improvements, delivering notable power, performance, and area (PPA) benefits."
| Samsung Foundry for Leading-Edge Nodes Announced on June 12, 2024 Compiled by AnandTech |
||||||||
| HVM Start | 2023 | 2024 | 2025 | 2026 | 2027 | 2027 | ||
| Process | SF3E | SF3 | SF2 (aka SF3P) |
SF2P/SF2X | SF2Z | SF1.4 | ||
| FET | GAAFET | |||||||
| Power Delivery | Frontside | Backside (BSPDN) | ? | |||||
| EUV | 0.33 NA EUV | ? | ? | ? | ? | |||
This is another example of a rebranding of leading-edge fabrication nodes in the recent years by a major chipmaker. Samsung Foundry is not disclosing any specific PPA improvements SF3P has over SF2, and for now is only stating in high-level terms that it will be a better-performing node than the planned SF3P.
Meanwhile, this week's announcement also includes new information on Samsung's next batch of process nodes, which are planned for 2026 and 2027. In 2026 Samsung will have SF2P, a further refinement of SF2 which incorporates 'faster' yet less dense transistors. That will be followed up in 2027 with SF2Z, which adds backside power delivery to the mix for better and higher quality power delivery. In particular, Samsung is targetting voltate drop (aka IR drop) here, which is an ongoing concern in chip design.
Finally, SF1.4, a 1.4nm-class node, is on track for 2027 as well. Interestingly, however, it looks like it does not feature a backside power delivery. Which, per current roadmaps, would have Samsung as the only foundry not using BSPDN for their first 1.4nm/14Å-class node.
"We have optimized BSPDN and incorporated it for the first time in the SF2Z node we announced today," the spokesperso... Semiconductors
NVIDIA Closes Above $135, Becomes World’s Most Valuable Company 
Thanks to the success of the burgeoning market for AI accelerators, NVIDIA has been on a tear this year. And the only place that’s even more apparent than the company’s rapidly growing revenues is in the company’s stock price and market capitalization. After breaking into the top 5 most valuable companies only earlier this year, NVIDIA has reached the apex of Wall Street, closing out today as the world’s most valuable company.
With a closing price of $135.58 on a day that saw NVIDIA’s stock pop up another 3.5%, NVIDIA has topped both Microsoft and Apple in valuation, reaching a market capitalization of $3.335 trillion. This follows a rapid rise in the company’s stock price, which has increased by 47% in the last month alone – particularly on the back of NVIDIA’s most recent estimates-beating earnings report – as well as a recent 10-for-1 stock split. And looking at the company’s performance over a longer time period, NVIDIA’s stock jumped a staggering 218% over the last year, or a mere 3,474% over the last 5 years.
NVIDIA’s ascension continues a trend over the last several years of tech companies all holding the top spots in the market capitalization rankings. Though this is the first time in quite a while that the traditional tech leaders of Apple and Microsoft have been pushed aside.
| Market Capitalization Rankings | ||
| Market Cap | Stock Price | |
| NVIDIA | $3.335T | $135.58 |
| Microsoft | $3.317T | $446.34 |
| Apple | $3.285T | $214.29 |
| Alphabet | $2.170T | $176.45 |
| Amazon | $1.902T | $182.81 |
Driving the rapid growth of NVIDIA and its market capitalization has been demand for AI accelerators from NVIDIA, particularly the company’s server-grade H100, H200, and GH200 accelerators for AI training. As the demand for these products has spiked, NVIDIA has been scaling up accordingly, repeatedly beating market expectations for how many of the accelerators they can ship – and what price they can charge. And despite all that growth, orders for NVIDIA’s high-end accelerators are still backlogged, underscoring how NVIDIA still isn’t meeting the full demands of hyperscalers and other enterprises.
Consequently, NVIDIA’s stock price and market capitalization have been on a tear on the basis of these future expectations. With a price-to-earnings (P/E) ratio of 76.7 – more than twice that of Microsoft or Apple – NVIDIA is priced more like a start-up than a 30-year-old tech company. But then it goes without saying that most 30-year-old tech companies aren’t tripling their revenue in a single year, placing NVIDIA in a rather unique situation at this time.
Like the stock market itself, market capitalizations are highly volatile. And historically speaking, it’s far from guaranteed that NVIDIA will be able to hold the top spot for long, never mind day-to-day fluctuations. NVIDIA, Apple, and Microsoft’s valuations are all within $50 billion (1.%) of each other, so for the moment at least, it’s still a tight race between all three companies. But no matter what happens from here, NVIDIA gets the exceptionally rare claim of having been the most valuable company in the world at some point.
(Carousel image courtesy MSN Money)
GPUs
U.S. Signs $1.5B in CHIPS Act Agreements With Amkor and SKhynix for Chip Packaging Plants 
Under the CHIPS & Science Act, the U.S. government provided tens of billions of dollars in grants and loans to the world's leading maker of chips, such as Intel, Samsung, and TSMC, which will significantly expand the country's semiconductor production industry in the coming years. However, most chips are typically tested, assembled, and packaged in Asia, which has left the American supply chain incomplete. Addressing this last gap in the government's domestic chip production plans, these past couple of weeks the U.S. government signed memorandums of understanding worth about $1.5 billion with Amkor and SK hynix to support their efforts to build chip packaging facilities in the U.S.
Amkor to Build Advanced Packaging Facility with Apple in Mind
Amkor plans to build a $2 billion advanced packaging facility near Peoria, Arizona, to test and assemble chips produced by TSMC at its Fab 21 near Phoenix, Arizona. The company signed a MOU that offers $400 million in direct funding and access to $200 million in loans under the CHIPS & Science Act. In addition, the company plans to take advantage of a 25% investment tax credit on eligible capital expenditures.
Set to be strategically positioned near TSMC's upcoming Fab 21 complex in Arizona, Amkor's Peoria facility will occupy 55 acres and, when fully completed, will feature over 500,000 square feet (46,451 square meters) of cleanroom space, more than twice the size of Amkor's advanced packaging site in Vietnam. Although the company has not disclosed the exact capacity or the specific technologies the facility will support, it is expected to cater to a wide range of industries, including automotive, high-performance computing, and mobile technologies. This suggests the new plant will offer diverse packaging solutions, including traditional, 2.5D, and 3D technologies.
Amkor has collaborated extensively with Apple on the vision and initial setup of the Peoria facility, as Apple is slated to be the facility's first and largest customer, marking a significant commitment from the tech giant. This partnership highlights the importance of the new facility in reinforcing the U.S. semiconductor supply chain and positioning Amkor as a key partner for companies relying on TSMC's manufacturing capabilities. The project is expected to generate around 2,000 jobs and is scheduled to begin operations in 2027.
SK hynix to Build HBM4 in the U.S.
This week SK hynix also signed a preliminary agreement with the U.S. government to receive up to $450 million in direct funding and $500 million in loans to build an advanced memory packaging facility in West Lafayette, Indiana.
The proposed facility is scheduled to begin operations in 2028, which means that it will assemble HBM4 or HBM4E memory. Meanwhile, DRAM devices for high bandwidth memory (HBM) stacks will still be produced in South Korea. Nonetheless, packing finished HBM4/HBM4E in the U.S. and possibly integrating these memory modules with high-end processors is a big deal.
In addition to building its packaging plant, SK hynix plans to collaborate with Purdue University and other local research institutions to advance semiconductor technology and packaging innovations. This partnership is intended to bolster research and development in the region, positioning the facility as a hub for AI technology and skilled employment.
Semiconductors
Samsung Foundry Unveils Updated Roadmap: BSPDN and 2nm Evolution Through 2027
Samsung this week has unveiled its latest process technologies roadmap at the company's Samsung Foundry Forum (SFF) U.S. The new plan covers the evolution of Samsung's 2nm-class production nodes through 2027, including a process technology with a backside power delivery, re-emphasizing plans to bring out a 1.4nm-class node in 2027, and the introduction of a 'high value' 4nm-class manufacturing tech.
Samsung Foundry's key announcements for today are clearly focused on the its 2nm-class process technologies, which are set to enter production in 2025 and will span to 2027, when the company's 1.4-nm class production node is set to enter the scene. Samsung is also adding (or rather, renaming) another 2nm-class node to their roadmap with SF2, which was previously disclosed by Samsung as SF3P and aimed at high-performance devices.
"We have refined and improved the SF3P, resulting in what we now refer to as SF2," a Samsung spokesperson told AnandTech. "This enhanced node incorporates various process design improvements, delivering notable power, performance, and area (PPA) benefits."
| Samsung Foundry for Leading-Edge Nodes Announced on June 12, 2024 Compiled by AnandTech |
||||||||
| HVM Start | 2023 | 2024 | 2025 | 2026 | 2027 | 2027 | ||
| Process | SF3E | SF3 | SF2 (aka SF3P) |
SF2P/SF2X | SF2Z | SF1.4 | ||
| FET | GAAFET | |||||||
| Power Delivery | Frontside | Backside (BSPDN) | ? | |||||
| EUV | 0.33 NA EUV | ? | ? | ? | ? | |||
This is another example of a rebranding of leading-edge fabrication nodes in the recent years by a major chipmaker. Samsung Foundry is not disclosing any specific PPA improvements SF3P has over SF2, and for now is only stating in high-level terms that it will be a better-performing node than the planned SF3P.
Meanwhile, this week's announcement also includes new information on Samsung's next batch of process nodes, which are planned for 2026 and 2027. In 2026 Samsung will have SF2P, a further refinement of SF2 which incorporates 'faster' yet less dense transistors. That will be followed up in 2027 with SF2Z, which adds backside power delivery to the mix for better and higher quality power delivery. In particular, Samsung is targetting voltate drop (aka IR drop) here, which is an ongoing concern in chip design.
Finally, SF1.4, a 1.4nm-class node, is on track for 2027 as well. Interestingly, however, it looks like it does not feature a backside power delivery. Which, per current roadmaps, would have Samsung as the only foundry not using BSPDN for their first 1.4nm/14Å-class node.
"We have optimized BSPDN and incorporated it for the first time in the SF2Z node we announced today," the spokesperso... Semiconductors
NVIDIA Closes Above $135, Becomes World’s Most Valuable Company
Thanks to the success of the burgeoning market for AI accelerators, NVIDIA has been on a tear this year. And the only place that’s even more apparent than the company’s rapidly growing revenues is in the company’s stock price and market capitalization. After breaking into the top 5 most valuable companies only earlier this year, NVIDIA has reached the apex of Wall Street, closing out today as the world’s most valuable company.
With a closing price of $135.58 on a day that saw NVIDIA’s stock pop up another 3.5%, NVIDIA has topped both Microsoft and Apple in valuation, reaching a market capitalization of $3.335 trillion. This follows a rapid rise in the company’s stock price, which has increased by 47% in the last month alone – particularly on the back of NVIDIA’s most recent estimates-beating earnings report – as well as a recent 10-for-1 stock split. And looking at the company’s performance over a longer time period, NVIDIA’s stock jumped a staggering 218% over the last year, or a mere 3,474% over the last 5 years.
NVIDIA’s ascension continues a trend over the last several years of tech companies all holding the top spots in the market capitalization rankings. Though this is the first time in quite a while that the traditional tech leaders of Apple and Microsoft have been pushed aside.
| Market Capitalization Rankings | ||
| Market Cap | Stock Price | |
| NVIDIA | $3.335T | $135.58 |
| Microsoft | $3.317T | $446.34 |
| Apple | $3.285T | $214.29 |
| Alphabet | $2.170T | $176.45 |
| Amazon | $1.902T | $182.81 |
Driving the rapid growth of NVIDIA and its market capitalization has been demand for AI accelerators from NVIDIA, particularly the company’s server-grade H100, H200, and GH200 accelerators for AI training. As the demand for these products has spiked, NVIDIA has been scaling up accordingly, repeatedly beating market expectations for how many of the accelerators they can ship – and what price they can charge. And despite all that growth, orders for NVIDIA’s high-end accelerators are still backlogged, underscoring how NVIDIA still isn’t meeting the full demands of hyperscalers and other enterprises.
Consequently, NVIDIA’s stock price and market capitalization have been on a tear on the basis of these future expectations. With a price-to-earnings (P/E) ratio of 76.7 – more than twice that of Microsoft or Apple – NVIDIA is priced more like a start-up than a 30-year-old tech company. But then it goes without saying that most 30-year-old tech companies aren’t tripling their revenue in a single year, placing NVIDIA in a rather unique situation at this time.
Like the stock market itself, market capitalizations are highly volatile. And historically speaking, it’s far from guaranteed that NVIDIA will be able to hold the top spot for long, never mind day-to-day fluctuations. NVIDIA, Apple, and Microsoft’s valuations are all within $50 billion (1.%) of each other, so for the moment at least, it’s still a tight race between all three companies. But no matter what happens from here, NVIDIA gets the exceptionally rare claim of having been the most valuable company in the world at some point.
(Carousel image courtesy MSN Money)
GPUs
U.S. Signs $1.5B in CHIPS Act Agreements With Amkor and SKhynix for Chip Packaging Plants
Under the CHIPS & Science Act, the U.S. government provided tens of billions of dollars in grants and loans to the world's leading maker of chips, such as Intel, Samsung, and TSMC, which will significantly expand the country's semiconductor production industry in the coming years. However, most chips are typically tested, assembled, and packaged in Asia, which has left the American supply chain incomplete. Addressing this last gap in the government's domestic chip production plans, these past couple of weeks the U.S. government signed memorandums of understanding worth about $1.5 billion with Amkor and SK hynix to support their efforts to build chip packaging facilities in the U.S.
Amkor to Build Advanced Packaging Facility with Apple in Mind
Amkor plans to build a $2 billion advanced packaging facility near Peoria, Arizona, to test and assemble chips produced by TSMC at its Fab 21 near Phoenix, Arizona. The company signed a MOU that offers $400 million in direct funding and access to $200 million in loans under the CHIPS & Science Act. In addition, the company plans to take advantage of a 25% investment tax credit on eligible capital expenditures.
Set to be strategically positioned near TSMC's upcoming Fab 21 complex in Arizona, Amkor's Peoria facility will occupy 55 acres and, when fully completed, will feature over 500,000 square feet (46,451 square meters) of cleanroom space, more than twice the size of Amkor's advanced packaging site in Vietnam. Although the company has not disclosed the exact capacity or the specific technologies the facility will support, it is expected to cater to a wide range of industries, including automotive, high-performance computing, and mobile technologies. This suggests the new plant will offer diverse packaging solutions, including traditional, 2.5D, and 3D technologies.
Amkor has collaborated extensively with Apple on the vision and initial setup of the Peoria facility, as Apple is slated to be the facility's first and largest customer, marking a significant commitment from the tech giant. This partnership highlights the importance of the new facility in reinforcing the U.S. semiconductor supply chain and positioning Amkor as a key partner for companies relying on TSMC's manufacturing capabilities. The project is expected to generate around 2,000 jobs and is scheduled to begin operations in 2027.
SK hynix to Build HBM4 in the U.S.
This week SK hynix also signed a preliminary agreement with the U.S. government to receive up to $450 million in direct funding and $500 million in loans to build an advanced memory packaging facility in West Lafayette, Indiana.
The proposed facility is scheduled to begin operations in 2028, which means that it will assemble HBM4 or HBM4E memory. Meanwhile, DRAM devices for high bandwidth memory (HBM) stacks will still be produced in South Korea. Nonetheless, packing finished HBM4/HBM4E in the U.S. and possibly integrating these memory modules with high-end processors is a big deal.
In addition to building its packaging plant, SK hynix plans to collaborate with Purdue University and other local research institutions to advance semiconductor technology and packaging innovations. This partnership is intended to bolster research and development in the region, positioning the facility as a hub for AI technology and skilled employment.
Semiconductors
Western Digital Introduces 4 TB microSDUC, 8 TB SDUC, and 16 TB External SSDs 
Western Digital's BiCS8 218-layer 3D NAND is being put to good use in a wide range of client and enterprise platforms, including WD's upcoming Gen 5 client SSDs and 128 TB-class datacenter SSD. On the external storage front, the company demonstrated four different products: for card-based media, 4 TB microSDUC and 8 TB SDUC cards with UHS-I speeds, and on the portable SSD front we had two 16 TB drives. One will be a SanDisk Desk Drive with external power, and the other in the SanDisk Extreme Pro housing with a lanyard opening in the case.
All of these are using BiCS8 QLC NAND, though I did hear booth talk (as I was taking leave) that they were not supposed to divulge the use of QLC in these products. The 4 TB microSDUC and 8 TB SDUC cards are rated for UHS-I speeds. They are being marketed under the SanDisk Ultra branding.
The SanDisk Desk Drive is an external SSD with a 18W power adapter, and it has been in the market for a few months now. Initially launched in capacities up to 8 TB, Western Digital had promised a 16 TB version before the end of the year. It appears that the product is coming to retail quite soon. One aspect to note is that this drive has been using TLC for the SKUs that are currently in the market, so it appears unlikely that the 16 TB version would be QLC. The units (at least up to the 8 TB capacity point) come with two SN850XE drives. Given the recent introduction of the 8 TB SN850X, an 'E' version with tweaked firmware is likely to be present in the 16 TB Desk Drive.
The 16 TB portable SSD in the SanDisk Extreme housing was a technology demonstration. It is definitely the highest capacity bus-powered portable SSD demonstrated by any vendor at any trade show thus far. Given the 16 TB Desk Drive's imminent market introduction, it is just a matter of time before the technology demonstration of the bus-powered version becomes a retail reality.
Storage
 <p>Closing out the last of the major PC-focused keynotes at Computex 2024 this evening, we have Intel. The long-reigning leader of the PC CPU market, Intel is in the middle of executing its plans to get back on track on both the manufacturing and chip design aspects of the business. Tonight’s keynote, being helmed by the highly-animated Pat Gelsinger, is titled “Bringing AI Everywhere.” And, like so many other Computex presentations and announcements this week, AI hardware is going to play a big part, as Intel outlines a full stack of products for client and server computing.</p>
<p>Of the four great PC chip vendors at the show, Intel has been the most up-front about what to expect from their hour-long presentation. The company’s Computex 2024 page already outlines their four major topics: AI PCs, Xeon 6 Processors, Gaudi AI accelerators, and Intel’s OpenVINO software ecosystem.</p>
<p>On the consumer hardware front, the company set the table with a significant teaser earlier this month about their forthcoming mobile PC SoC, <a href="https://www.anandtech.com/show/21396/intel-teases-lunar-lake-ahead-of-computex-transformative-power-efficiency">Lunar Lake</a>. The next generation of Core Ultra processors, Intel is touting significant energy efficiency gains for the mobile-focused chip, with new architectures driving their Performance and Efficiency CPU cores, Xe2 GPU, and a much faster 45+ TOPS (INT8) NPU. While the Lunar Lake announcement is coming relatively soon after the Meteor Lake launch, Intel has made it clear that it’s not going to hold back on shipping future products; they are looking to make up for lost time. Still, Lunar Lake devices are not expected to hit retail shelves until Q4 of this year, so this announcement is coming months in advance of the hardware itself.</p>
<p align="center"><a href="https://www.anandtech.com/show/21427/the-intel-computex-2024-keynote-live-blog"><img alt="" src="https://images.anandtech.com/doci/21427/Intel%20Lunar%20Lake%20Preview_02.jpg" style="width: 100%;" /></a></p>
<p>On the server front, Intel has been publicly prepping for the launch of a new generation of Xeons with the <a href="https://www.anandtech.com/show/21339/intel-unveils-new-branding-for-6th-generation-xeon-processors-intel-xeon-6">Xeon 6 platform</a>. The most notable part of this being the release of the company’s first Efficiency-core Xeon, Sierra Forest. Sierra Forest is set to be the first Xeon 6 chip out the door this year, and will offer up to 288 E cores on a single chip, allowing Intel to tap into the many (many) core CPU markets that AMD and Arm-based rivals have been unopposed at thus far.</p>
<p>Finally, the company has fully pivoted its server AI accelerator strategy to its Gaudi accelerators. <a href="https://www.anandtech.com/show/21342/intel-introduces-gaudi-3-accelerator-going-bigger-and-aiming-higher">Gaudi 3 was introduced back in April</a>, and while it isn’t expected to go toe-to-toe with NVIDIA’s top accelerators in every workload, Intel is betting that they can beat NVIDIA on critical workloads, all while undercutting them significantly in pricing. The first Gaudi 3 parts are set to be released in the second half of this year, so hopefully we’ll be hearing a bit more about Intel’s plans as part of their keynote.</p>
<p>As always, the AnandTech crew is live and in person to catch this final Computex keynote. So please come join us at 8:00pm PT / 11:00pm ET / 03:00 UTC to get all the details.</p>
Live Blog){kind=link}
 <p>Closing out the last of the major PC-focused keynotes at Computex 2024 this evening, we have Intel. The long-reigning leader of the PC CPU market, Intel is in the middle of executing its plans to get back on track on both the manufacturing and chip design aspects of the business. Tonight’s keynote, being helmed by the highly-animated Pat Gelsinger, is titled “Bringing AI Everywhere.” And, like so many other Computex presentations and announcements this week, AI hardware is going to play a big part, as Intel outlines a full stack of products for client and server computing.</p>
<p>Of the four great PC chip vendors at the show, Intel has been the most up-front about what to expect from their hour-long presentation. The company’s Computex 2024 page already outlines their four major topics: AI PCs, Xeon 6 Processors, Gaudi AI accelerators, and Intel’s OpenVINO software ecosystem.</p>
<p>On the consumer hardware front, the company set the table with a significant teaser earlier this month about their forthcoming mobile PC SoC, <a href="https://www.anandtech.com/show/21396/intel-teases-lunar-lake-ahead-of-computex-transformative-power-efficiency">Lunar Lake</a>. The next generation of Core Ultra processors, Intel is touting significant energy efficiency gains for the mobile-focused chip, with new architectures driving their Performance and Efficiency CPU cores, Xe2 GPU, and a much faster 45+ TOPS (INT8) NPU. While the Lunar Lake announcement is coming relatively soon after the Meteor Lake launch, Intel has made it clear that it’s not going to hold back on shipping future products; they are looking to make up for lost time. Still, Lunar Lake devices are not expected to hit retail shelves until Q4 of this year, so this announcement is coming months in advance of the hardware itself.</p>
<p align="center"><a href="https://www.anandtech.com/show/21427/the-intel-computex-2024-keynote-live-blog"><img alt="" src="https://images.anandtech.com/doci/21427/Intel%20Lunar%20Lake%20Preview_02.jpg" style="width: 100%;" /></a></p>
<p>On the server front, Intel has been publicly prepping for the launch of a new generation of Xeons with the <a href="https://www.anandtech.com/show/21339/intel-unveils-new-branding-for-6th-generation-xeon-processors-intel-xeon-6">Xeon 6 platform</a>. The most notable part of this being the release of the company’s first Efficiency-core Xeon, Sierra Forest. Sierra Forest is set to be the first Xeon 6 chip out the door this year, and will offer up to 288 E cores on a single chip, allowing Intel to tap into the many (many) core CPU markets that AMD and Arm-based rivals have been unopposed at thus far.</p>
<p>Finally, the company has fully pivoted its server AI accelerator strategy to its Gaudi accelerators. <a href="https://www.anandtech.com/show/21342/intel-introduces-gaudi-3-accelerator-going-bigger-and-aiming-higher">Gaudi 3 was introduced back in April</a>, and while it isn’t expected to go toe-to-toe with NVIDIA’s top accelerators in every workload, Intel is betting that they can beat NVIDIA on critical workloads, all while undercutting them significantly in pricing. The first Gaudi 3 parts are set to be released in the second half of this year, so hopefully we’ll be hearing a bit more about Intel’s plans as part of their keynote.</p>
<p>As always, the AnandTech crew is live and in person to catch this final Computex keynote. So please come join us at 8:00pm PT / 11:00pm ET / 03:00 UTC to get all the details.</p>
Live Blog){kind=link}
 <p>Closing out the last of the major PC-focused keynotes at Computex 2024 this evening, we have Intel. The long-reigning leader of the PC CPU market, Intel is in the middle of executing its plans to get back on track on both the manufacturing and chip design aspects of the business. Tonight’s keynote, being helmed by the highly-animated Pat Gelsinger, is titled “Bringing AI Everywhere.” And, like so many other Computex presentations and announcements this week, AI hardware is going to play a big part, as Intel outlines a full stack of products for client and server computing.</p>
<p>Of the four great PC chip vendors at the show, Intel has been the most up-front about what to expect from their hour-long presentation. The company’s Computex 2024 page already outlines their four major topics: AI PCs, Xeon 6 Processors, Gaudi AI accelerators, and Intel’s OpenVINO software ecosystem.</p>
<p>On the consumer hardware front, the company set the table with a significant teaser earlier this month about their forthcoming mobile PC SoC, <a href="https://www.anandtech.com/show/21396/intel-teases-lunar-lake-ahead-of-computex-transformative-power-efficiency">Lunar Lake</a>. The next generation of Core Ultra processors, Intel is touting significant energy efficiency gains for the mobile-focused chip, with new architectures driving their Performance and Efficiency CPU cores, Xe2 GPU, and a much faster 45+ TOPS (INT8) NPU. While the Lunar Lake announcement is coming relatively soon after the Meteor Lake launch, Intel has made it clear that it’s not going to hold back on shipping future products; they are looking to make up for lost time. Still, Lunar Lake devices are not expected to hit retail shelves until Q4 of this year, so this announcement is coming months in advance of the hardware itself.</p>
<p align="center"><a href="https://www.anandtech.com/show/21427/the-intel-computex-2024-keynote-live-blog"><img alt="" src="https://images.anandtech.com/doci/21427/Intel%20Lunar%20Lake%20Preview_02.jpg" style="width: 100%;" /></a></p>
<p>On the server front, Intel has been publicly prepping for the launch of a new generation of Xeons with the <a href="https://www.anandtech.com/show/21339/intel-unveils-new-branding-for-6th-generation-xeon-processors-intel-xeon-6">Xeon 6 platform</a>. The most notable part of this being the release of the company’s first Efficiency-core Xeon, Sierra Forest. Sierra Forest is set to be the first Xeon 6 chip out the door this year, and will offer up to 288 E cores on a single chip, allowing Intel to tap into the many (many) core CPU markets that AMD and Arm-based rivals have been unopposed at thus far.</p>
<p>Finally, the company has fully pivoted its server AI accelerator strategy to its Gaudi accelerators. <a href="https://www.anandtech.com/show/21342/intel-introduces-gaudi-3-accelerator-going-bigger-and-aiming-higher">Gaudi 3 was introduced back in April</a>, and while it isn’t expected to go toe-to-toe with NVIDIA’s top accelerators in every workload, Intel is betting that they can beat NVIDIA on critical workloads, all while undercutting them significantly in pricing. The first Gaudi 3 parts are set to be released in the second half of this year, so hopefully we’ll be hearing a bit more about Intel’s plans as part of their keynote.</p>
<p>As always, the AnandTech crew is live and in person to catch this final Computex keynote. So please come join us at 8:00pm PT / 11:00pm ET / 03:00 UTC to get all the details.</p>
Live Blog | https://compbuddey.blogspot.com/2024/06/the-intel-computex-2024-keynote-live_9.html){kind=link}
 <p>Closing out the last of the major PC-focused keynotes at Computex 2024 this evening, we have Intel. The long-reigning leader of the PC CPU market, Intel is in the middle of executing its plans to get back on track on both the manufacturing and chip design aspects of the business. Tonight’s keynote, being helmed by the highly-animated Pat Gelsinger, is titled “Bringing AI Everywhere.” And, like so many other Computex presentations and announcements this week, AI hardware is going to play a big part, as Intel outlines a full stack of products for client and server computing.</p>
<p>Of the four great PC chip vendors at the show, Intel has been the most up-front about what to expect from their hour-long presentation. The company’s Computex 2024 page already outlines their four major topics: AI PCs, Xeon 6 Processors, Gaudi AI accelerators, and Intel’s OpenVINO software ecosystem.</p>
<p>On the consumer hardware front, the company set the table with a significant teaser earlier this month about their forthcoming mobile PC SoC, <a href="https://www.anandtech.com/show/21396/intel-teases-lunar-lake-ahead-of-computex-transformative-power-efficiency">Lunar Lake</a>. The next generation of Core Ultra processors, Intel is touting significant energy efficiency gains for the mobile-focused chip, with new architectures driving their Performance and Efficiency CPU cores, Xe2 GPU, and a much faster 45+ TOPS (INT8) NPU. While the Lunar Lake announcement is coming relatively soon after the Meteor Lake launch, Intel has made it clear that it’s not going to hold back on shipping future products; they are looking to make up for lost time. Still, Lunar Lake devices are not expected to hit retail shelves until Q4 of this year, so this announcement is coming months in advance of the hardware itself.</p>
<p align="center"><a href="https://www.anandtech.com/show/21427/the-intel-computex-2024-keynote-live-blog"><img alt="" src="https://images.anandtech.com/doci/21427/Intel%20Lunar%20Lake%20Preview_02.jpg" style="width: 100%;" /></a></p>
<p>On the server front, Intel has been publicly prepping for the launch of a new generation of Xeons with the <a href="https://www.anandtech.com/show/21339/intel-unveils-new-branding-for-6th-generation-xeon-processors-intel-xeon-6">Xeon 6 platform</a>. The most notable part of this being the release of the company’s first Efficiency-core Xeon, Sierra Forest. Sierra Forest is set to be the first Xeon 6 chip out the door this year, and will offer up to 288 E cores on a single chip, allowing Intel to tap into the many (many) core CPU markets that AMD and Arm-based rivals have been unopposed at thus far.</p>
<p>Finally, the company has fully pivoted its server AI accelerator strategy to its Gaudi accelerators. <a href="https://www.anandtech.com/show/21342/intel-introduces-gaudi-3-accelerator-going-bigger-and-aiming-higher">Gaudi 3 was introduced back in April</a>, and while it isn’t expected to go toe-to-toe with NVIDIA’s top accelerators in every workload, Intel is betting that they can beat NVIDIA on critical workloads, all while undercutting them significantly in pricing. The first Gaudi 3 parts are set to be released in the second half of this year, so hopefully we’ll be hearing a bit more about Intel’s plans as part of their keynote.</p>
<p>As always, the AnandTech crew is live and in person to catch this final Computex keynote. So please come join us at 8:00pm PT / 11:00pm ET / 03:00 UTC to get all the details.</p>
Live Blog&body=https://compbuddey.blogspot.com/2024/06/the-intel-computex-2024-keynote-live_9.html){kind=link}
JEDEC Plans LPDDR6-Based CAMM, DDR5 MRDIMM Specifications 
Following a relative lull in the desktop memory industry in the previous decade, the past few years have seen a flurry of new memory standards and form factors enter development. Joining the traditional DIMM/SO-DIMM form factors, we've seen the introduction of space-efficient DDR5 CAMM2s, their LPDDR5-based counterpart the LPCAMM2, and the high-clockspeed optimized CUDIMM. But JEDEC, the industry organization behind these efforts, is not done there. In a press release sent out at the start of the week, the group announced that it is working on standards for DDR5 Multiplexed Rank DIMMs (MRDIMM) for servers, as well as an updated LPCAMM standard to go with next-generation LPDDR6 memory.
Just last week Micron introduced the industry's first DDR5 MRDIMMs, which are timed to launch alongside Intel's Xeon 6 server platforms. But while Intel and its partners are moving full steam ahead on MRDIMMs, the MRDIMM specification has not been fully ratified by JEDEC itself. All told, it's not unusual to see Intel pushing the envelope here on new memory technologies (the company is big enough to bootstrap its own ecosystem). But as MRDIMMs are ultimately meant to be more than just a tool for Intel, a proper industry standard is still needed – even if that takes a bit longer.
Under the hood, MRDIMMs continue to use DDR5 components, form-factor, pinout, SPD, power management ICs (PMICs), and thermal sensors. The major change with the technology is the introduction of multiplexing, which combines multiple data signals over a single channel. The MRDIMM standard also adds RCD/DB logic in a bid to boost performance, increase capacity of memory modules up to 256 GB (for now), shrink latencies, and reduce power consumption of high-end memory subsystems. And, perhaps key to MRDIMM adoption, the standard is being implemented as a backwards-compatible extension to traditional DDR5 RDIMMs, meaning that MRDIMM-capable servers can use either RDIMMs or MRDIMMs, depending on how the operator opts to configure the system.
The MRDIMM standard aims to double the peak bandwidth to 12.8 Gbps, increasing pin speed and supporting more than two ranks. Additionally, a "Tall MRDIMM" form factor is in the works (and pictured above), which is designed to allow for higher capacity DIMMs by providing more area for laying down memory chips. Currently, ultra high capacity DIMMs require using expensive, multi-layer DRAM packages that use through-silicon vias (3DS packaging) to attach the individual DRAM dies; a Tall MRDIMM, on the other hand, can just use a larger number of commodity DRAM chips. Overall, the Tall MRDIMM form factor enables twice the number of DRAM single-die packages on the DIMM.
Meanwhile, this week's announcement from JEDEC offers the first significant insight into what to expect from LPDDR6 CAMMs. And despite LPDDR5 CAMMs having barely made it out the door, some significant shifts with LPDDR6 itself means that JEDEC will need to make some major changes to the CAMM standard to accommodate the newer memory type.
JEDEC Presentation: The CAMM2 Journey and Future Potential
Besides the higher memory clockspeeds allowed by LPDDR6 – JEDEC is targeting data transfer rates of 14.4 GT/s and higher – the new memory form-factor will also incorporate an altogether new connector array. This is to accommodate LPDDR6's wider memory bus, which sees the channel width of an individual memory chip grow from 16-bits wide to 24-bits wide. As a result, the current LPCAMM design, which is intended to match the PC standard of a cumulative 128-bit (16x8) design needs to be reconfigured to match LPDDR6's alterations.
Ultimately, JEDEC is targeting a 24-bit subhannel/48-bit channel design, which will result in a 192-bit wide LPCAMM. While the LPCAMM connector itself is set to grow from 14 rows of pins to possibly as high as 20. New memory technologies typically require new DIMMs to begin with, so it's important to clarify that this is not unexpected, but at th... Memory
JEDEC Presentation: The CAMM2 Journey and Future Potential
Intel Sells Its Arm Shares, Reduces Stakes in Other Companies 
Intel has divested its entire stake in Arm Holdings during the second quarter, raising approximately $147 million. Alongside this, Intel sold its stake in cybersecurity firm ZeroFox and reduced its holdings in Astera Labs, all as part of a broader effort to manage costs and recover cash amid significant financial challenges.
The sale of Intel's 1.18 million shares in Arm Holdings, as reported in a recent SEC filing, comes at a time when the company is struggling with substantial financial losses. Despite the $147 million generated from the sale, Intel reported a $120 million net loss on its equity investments for the quarter, which is a part of a larger $1.6 billion loss that Intel faced during this period.
In addition to selling its stake in Arm, Intel also exited its investment in ZeroFox and reduced its involvement with Astera Labs, a company known for developing connectivity platforms for enterprise hardware. These moves are in line with Intel's strategy to reduce costs and stabilize its financial position as it faces ongoing market challenges.
Despite the divestment, Intel's past investment in Arm was likely driven by strategic considerations. Arm Holdings is a significant force in the semiconductor industry, with its designs powering most mobile devices, and, for obvious reasons, Intel would like to address these. Intel and Arm are also collaborating on datacenter platforms tailored for Intel's 18A process technology. Additionally, Arm might view Intel as a potential licensee for its technologies and a valuable partner for other companies that license Arm's designs.
Intel's investment in Astera Labs was also a strategic one as the company probably wanted to secure steady supply of smart retimers, smart cable modems, and CXL memory controller, which are used in volumes in datacenters and Intel is certainly interested in selling as many datacenter CPUs as possible.
Intel's financial struggles were highlighted earlier this month when the company released a disappointing earnings report, which led to a 33% drop in its stock value, erasing billions of dollars of capitalization. To counter these difficulties, Intel announced plans to cut 15,000 jobs and implement other expense reductions. The company has also suspended its dividend, signaling the depth of its efforts to conserve cash and focus on recovery. When it comes to divestment of Arm stock, the need for immediate financial stabilization has presumably taken precedence, leading to the decision.
CPUs
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Samsung Foundry Unveils Updated Roadmap: BSPDN and 2nm Evolution Through 2027
Samsung this week has unveiled its latest process technologies roadmap at the company's Samsung Foundry Forum (SFF) U.S. The new plan covers the evolution of Samsung's 2nm-class production nodes through 2027, including a process technology with a backside power delivery, re-emphasizing plans to bring out a 1.4nm-class node in 2027, and the introduction of a 'high value' 4nm-class manufacturing tech.
Samsung Foundry's key announcements for today are clearly focused on the its 2nm-class process technologies, which are set to enter production in 2025 and will span to 2027, when the company's 1.4-nm class production node is set to enter the scene. Samsung is also adding (or rather, renaming) another 2nm-class node to their roadmap with SF2, which was previously disclosed by Samsung as SF3P and aimed at high-performance devices.
"We have refined and improved the SF3P, resulting in what we now refer to as SF2," a Samsung spokesperson told AnandTech. "This enhanced node incorporates various process design improvements, delivering notable power, performance, and area (PPA) benefits."
| Samsung Foundry for Leading-Edge Nodes Announced on June 12, 2024 Compiled by AnandTech |
||||||||
| HVM Start | 2023 | 2024 | 2025 | 2026 | 2027 | 2027 | ||
| Process | SF3E | SF3 | SF2 (aka SF3P) |
SF2P/SF2X | SF2Z | SF1.4 | ||
| FET | GAAFET | |||||||
| Power Delivery | Frontside | Backside (BSPDN) | ? | |||||
| EUV | 0.33 NA EUV | ? | ? | ? | ? | |||
This is another example of a rebranding of leading-edge fabrication nodes in the recent years by a major chipmaker. Samsung Foundry is not disclosing any specific PPA improvements SF3P has over SF2, and for now is only stating in high-level terms that it will be a better-performing node than the planned SF3P.
Meanwhile, this week's announcement also includes new information on Samsung's next batch of process nodes, which are planned for 2026 and 2027. In 2026 Samsung will have SF2P, a further refinement of SF2 which incorporates 'faster' yet less dense transistors. That will be followed up in 2027 with SF2Z, which adds backside power delivery to the mix for better and higher quality power delivery. In particular, Samsung is targetting voltate drop (aka IR drop) here, which is an ongoing concern in chip design.
Finally, SF1.4, a 1.4nm-class node, is on track for 2027 as well. Interestingly, however, it looks like it does not feature a backside power delivery. Which, per current roadmaps, would have Samsung as the only foundry not using BSPDN for their first 1.4nm/14Å-class node.
"We have optimized BSPDN and incorporated it for the first time in the SF2Z node we announced today," the spokesperso... Semiconductors
NVIDIA Closes Above $135, Becomes World’s Most Valuable Company
Thanks to the success of the burgeoning market for AI accelerators, NVIDIA has been on a tear this year. And the only place that’s even more apparent than the company’s rapidly growing revenues is in the company’s stock price and market capitalization. After breaking into the top 5 most valuable companies only earlier this year, NVIDIA has reached the apex of Wall Street, closing out today as the world’s most valuable company.
With a closing price of $135.58 on a day that saw NVIDIA’s stock pop up another 3.5%, NVIDIA has topped both Microsoft and Apple in valuation, reaching a market capitalization of $3.335 trillion. This follows a rapid rise in the company’s stock price, which has increased by 47% in the last month alone – particularly on the back of NVIDIA’s most recent estimates-beating earnings report – as well as a recent 10-for-1 stock split. And looking at the company’s performance over a longer time period, NVIDIA’s stock jumped a staggering 218% over the last year, or a mere 3,474% over the last 5 years.
NVIDIA’s ascension continues a trend over the last several years of tech companies all holding the top spots in the market capitalization rankings. Though this is the first time in quite a while that the traditional tech leaders of Apple and Microsoft have been pushed aside.
| Market Capitalization Rankings | ||
| Market Cap | Stock Price | |
| NVIDIA | $3.335T | $135.58 |
| Microsoft | $3.317T | $446.34 |
| Apple | $3.285T | $214.29 |
| Alphabet | $2.170T | $176.45 |
| Amazon | $1.902T | $182.81 |
Driving the rapid growth of NVIDIA and its market capitalization has been demand for AI accelerators from NVIDIA, particularly the company’s server-grade H100, H200, and GH200 accelerators for AI training. As the demand for these products has spiked, NVIDIA has been scaling up accordingly, repeatedly beating market expectations for how many of the accelerators they can ship – and what price they can charge. And despite all that growth, orders for NVIDIA’s high-end accelerators are still backlogged, underscoring how NVIDIA still isn’t meeting the full demands of hyperscalers and other enterprises.
Consequently, NVIDIA’s stock price and market capitalization have been on a tear on the basis of these future expectations. With a price-to-earnings (P/E) ratio of 76.7 – more than twice that of Microsoft or Apple – NVIDIA is priced more like a start-up than a 30-year-old tech company. But then it goes without saying that most 30-year-old tech companies aren’t tripling their revenue in a single year, placing NVIDIA in a rather unique situation at this time.
Like the stock market itself, market capitalizations are highly volatile. And historically speaking, it’s far from guaranteed that NVIDIA will be able to hold the top spot for long, never mind day-to-day fluctuations. NVIDIA, Apple, and Microsoft’s valuations are all within $50 billion (1.%) of each other, so for the moment at least, it’s still a tight race between all three companies. But no matter what happens from here, NVIDIA gets the exceptionally rare claim of having been the most valuable company in the world at some point.
(Carousel image courtesy MSN Money)
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