The Eurocom 780W AC Power Adapter Review: Big Power For Big Laptops
While desktop PC power supplies receive the bulk of enthusiasts’ attention for good reasons – not the least of which being the vast selection of options that comes from being a standardized part – power supplies as a whole aren’t just a concern for big PCs. With the majority of PC sales having flipped to notebook sales some years ago, notebook power supplies already lead the market in volume. And while most laptops don’t need the kind of massively powered PSUs that dominate the desktop space, even that is slowly changing as desktop replacement-class laptops increasingly grow in performance and power consumption.
Perhaps the poster-child for the high-performance, high-powered laptop is Eurocom, who has a long history of developing heavy-duty DTR laptops that are all but portable desktop systems. Following recent trends in GPU power consumption and in GPU popularity for both gaming and AI workloads, the company has been selling a range of “mobile supercomputers”, which are practically large, tailor-made laptops that rival even the best of desktop computers – and have the power requirements to match.
In order to power their own high-end laptops, Eurocom has developed a rather unusual 780W AC adapter for high-performance laptops. Intended to power the most powerful of powerful laptops, their latest power adapter can supply over three-quarters of a kilowatt of DC power; a desktop-like wattage for a desktop-like device. It’s a laptop power adapter that’s unique in its scale, and with some room to scale up even further.
| Eurocom 780W AC Adapter Power specifications |
|
| RAIL | +20V |
| MAX OUTPUT | 39A |
| 780W | |
| DIMENSIONS | 325 x 110 x 40mm, 1.38kg |
| AC INPUT | 90 - 264 VAC, 50 - 60 Hz |
| MSRP | PSU: $299, Cable: $129+ |
Eurocom has offered this adapter for a few years now. But it’s taken on a new life as more laptops have been released that use such a large adapter (or two smaller 300W-ish power adapters). And, critically, Eurocom has made additional DC cable/connector sets for other manufactuers’ laptops, significantly increasing the number of systems it’s compatible with. Currently, Eurocom offers DC cables for the following laptops:
- Alienware M17x M18x; 1x DC Cable ; w/ barrel AW connector; 193cm/6.4ft
- Alienware AREA 51m; 1x DC Cable + Splitter Box w/ 2x barrel AW connectors; 152cm/5ft
- ASUS ROG G18 Strix; GX501V; GM501; GM501GM; GX531GM; 1x DC Cable; w/ barrel ROG connector
- ASUS G703GX, GZ700GX; 1x DC Cable w/ 2x ROG barrel connectors; 152cm/5ft
- CLEVO, OriginPC, Sager, XMG, EUROCOM laptops; 1x DC Cable; w/ 4-pin round connector; 182cm / 6ft
- CLEVO X370SNx; 1x DC Cable; w/ square connector; 120cm / 3.8ft
- CLEVO X170SM/X170KM; 1x DC Cable; w/ dual square connectors; 152cm / 5ft
- Dell Precision 7720/7710; 1x DC Cable; w/ barrel Dell connector; 120cm / 3.8ft
- MSI GE76, GT76, GT77, GE78HX Raider, Titan 18HX 1x DC Cable; w/ single square connector; 120cm / 3.8ft
- MSI laptops & MSI Trident AS Gaming Desktops; 1x DC Cable; w/ 4-pin round connector; 182cm / 6ft
The Eurocom 780W AC Adapter
Externally, the Eurocom 780W AC adapter looks like a hybrid between a PC PSU and a laptop adapter. It is shaped like an oversized laptop AC adapter but has a metallic body and cooling vents/fans. Eurocom advertises that it weighs “only 1.34kg”, which is the weight of an entire 14-inch laptop by comparison, but is relatively lightweight for a PSU with that kind of power output. The company logo is debossed across the top side of the adapter, with four round anti-slip pads found at its bottom. Care needs to be taken while moving it around because the metallic edges and weight can spell trouble for wooden surfaces.
Eurocom installed a small information display on the AC adapter, which shows the current, voltage, and power output, as well as the temperature of the adapter. It is not perfectly accur... Cases/Cooling/PSUs
Posted by The Techinical Support
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling 
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
![](https://twitter.com/share?url=https://compbuddey.blogspot.com/2024/05/the-eurocom-780w-ac-power-adapter_13.html&text=The Eurocom 780W AC Power Adapter Review: Big Power For Big Laptops <p>While desktop PC power supplies receive the bulk of enthusiasts’ attention for good reasons – not the least of which being the vast selection of options that comes from being a standardized part – power supplies as a whole aren’t just a concern for big PCs. With the majority of PC sales having flipped to notebook sales some years ago, notebook power supplies already lead the market in volume. And while <em>most</em> laptops don’t need the kind of massively powered PSUs that dominate the desktop space, even that is slowly changing as desktop replacement-class laptops increasingly grow in performance and power consumption.</p>
<p>Perhaps the poster-child for the high-performance, high-powered laptop is Eurocom, who has a long history of developing heavy-duty DTR laptops that are all but portable desktop systems. Following recent trends in GPU power consumption and in GPU popularity for both gaming and AI workloads, the company has been selling a range of “mobile supercomputers”, which are practically large, tailor-made laptops that rival even the best of desktop computers – and have the power requirements to match.</p>
<p>In order to power their own high-end laptops, Eurocom has developed a rather unusual 780W AC adapter for high-performance laptops. Intended to power the most powerful of powerful laptops, their latest power adapter can supply over three-quarters of a kilowatt of DC power; a desktop-like wattage for a desktop-like device. It’s a laptop power adapter that’s unique in its scale, and with some room to scale up even further.</p>
<table border="0" style="text-align:center" width="88%">
<tbody>
<tr class="tgrey">
<td colspan="2">Eurocom 780W AC Adapter<br />
Power specifications</td>
</tr>
<tr class="tlblue">
<td>RAIL</td>
<td>+20V</td>
</tr>
<tr>
<td class="tlgrey" rowspan="2">MAX OUTPUT</td>
<td>39A</td>
</tr>
<tr>
<td>780W</td>
</tr>
<tr>
<td class="tlgrey">DIMENSIONS</td>
<td>325 x 110 x 40mm, 1.38kg</td>
</tr>
<tr>
<td class="tlgrey">AC INPUT</td>
<td>90 - 264 VAC, 50 - 60 Hz</td>
</tr>
<tr>
<td class="tlgrey">MSRP</td>
<td>PSU: <a href="https://eurocom.com/ec/configure(2,404,0)780W">$299</a>, Cable: <a href="https://eurocom.com/ec/pricelist(2,404)780W">$129+</a></td>
</tr>
</tbody>
</table>
<p>Eurocom has offered this adapter for a few years now. But it’s taken on a new life as more laptops have been released that use such a large adapter (or two smaller 300W-ish power adapters). And, critically, Eurocom has <a href="https://eurocom.com/ec/release(409)ec">made additional DC cable/connector sets for other manufactuers’ laptops</a>, significantly increasing the number of systems it’s compatible with. Currently, Eurocom offers DC cables for the following laptops:</p>
<ul>
<li>Alienware M17x M18x; 1x DC Cable ; w/ barrel AW connector; 193cm/6.4ft </li>
<li>Alienware AREA 51m; 1x DC Cable + Splitter Box w/ 2x barrel AW connectors; 152cm/5ft </li>
<li>ASUS ROG G18 Strix; GX501V; GM501; GM501GM; GX531GM; 1x DC Cable; w/ barrel ROG connector </li>
<li>ASUS G703GX, GZ700GX; 1x DC Cable w/ 2x ROG barrel connectors; 152cm/5ft </li>
<li>CLEVO, OriginPC, Sager, XMG, EUROCOM laptops; 1x DC Cable; w/ 4-pin round connector; 182cm / 6ft </li>
<li>CLEVO X370SNx; 1x DC Cable; w/ square connector; 120cm / 3.8ft </li>
<li>CLEVO X170SM/X170KM; 1x DC Cable; w/ dual square connectors; 152cm / 5ft </li>
<li>Dell Precision 7720/7710; 1x DC Cable; w/ barrel Dell connector; 120cm / 3.8ft </li>
<li>MSI GE76, GT76, GT77, GE78HX Raider, Titan 18HX 1x DC Cable; w/ single square connector; 120cm / 3.8ft </li>
<li>MSI laptops & MSI Trident AS Gaming Desktops; 1x DC Cable; w/ 4-pin round connector; 182cm / 6ft </li>
</ul>
<h2>The Eurocom 780W AC Adapter</h2>
<p>Externally, the Eurocom 780W AC adapter looks like a hybrid between a PC PSU and a laptop adapter. It is shaped like an oversized laptop AC adapter but has a metallic body and cooling vents/fans. Eurocom advertises that it weighs “only 1.34kg”, which is the weight of an entire 14-inch laptop by comparison, but is relatively lightweight for a PSU with that kind of power output. The company logo is debossed across the top side of the adapter, with four round anti-slip pads found at its bottom. Care needs to be taken while moving it around because the metallic edges and weight can spell trouble for wooden surfaces.</p>
<p align="center"><a href="https://www.anandtech.com/show/21331/the-eurocom-780w-ac-power-adapter-review-big-power-for-big-laptops"><img alt="" src="https://images.anandtech.com/doci/21331/EUROCOM_780W_AC_DC_ADAPTER_01b_575px.jpg" /></a></p>
<p>Eurocom installed a small information display on the AC adapter, which shows the current, voltage, and power output, as well as the temperature of the adapter. It is not perfectly accur... Cases/Cooling/PSUs){kind=link}
![](https://www.pinterest.com/pin/create/button/?url=https://compbuddey.blogspot.com/2024/05/the-eurocom-780w-ac-power-adapter_13.html&media=https://lh3.googleusercontent.com/blogger_img_proxy/AEn0k_vnpcjWTxAkRm2x-BalF1AZ1ocOTLIWVIKZqBFEc7w97x9AtlnnlHjeOh53a0RabLs_6ieGDXWtsOgWPPTU_S-RMDqcM_qkVQNmrFoMPPpglv5NhrtNBjzRdOlHC7m1eakTINqIsVvySctwija0yHifDrFX&description=The Eurocom 780W AC Power Adapter Review: Big Power For Big Laptops <p>While desktop PC power supplies receive the bulk of enthusiasts’ attention for good reasons – not the least of which being the vast selection of options that comes from being a standardized part – power supplies as a whole aren’t just a concern for big PCs. With the majority of PC sales having flipped to notebook sales some years ago, notebook power supplies already lead the market in volume. And while <em>most</em> laptops don’t need the kind of massively powered PSUs that dominate the desktop space, even that is slowly changing as desktop replacement-class laptops increasingly grow in performance and power consumption.</p>
<p>Perhaps the poster-child for the high-performance, high-powered laptop is Eurocom, who has a long history of developing heavy-duty DTR laptops that are all but portable desktop systems. Following recent trends in GPU power consumption and in GPU popularity for both gaming and AI workloads, the company has been selling a range of “mobile supercomputers”, which are practically large, tailor-made laptops that rival even the best of desktop computers – and have the power requirements to match.</p>
<p>In order to power their own high-end laptops, Eurocom has developed a rather unusual 780W AC adapter for high-performance laptops. Intended to power the most powerful of powerful laptops, their latest power adapter can supply over three-quarters of a kilowatt of DC power; a desktop-like wattage for a desktop-like device. It’s a laptop power adapter that’s unique in its scale, and with some room to scale up even further.</p>
<table border="0" style="text-align:center" width="88%">
<tbody>
<tr class="tgrey">
<td colspan="2">Eurocom 780W AC Adapter<br />
Power specifications</td>
</tr>
<tr class="tlblue">
<td>RAIL</td>
<td>+20V</td>
</tr>
<tr>
<td class="tlgrey" rowspan="2">MAX OUTPUT</td>
<td>39A</td>
</tr>
<tr>
<td>780W</td>
</tr>
<tr>
<td class="tlgrey">DIMENSIONS</td>
<td>325 x 110 x 40mm, 1.38kg</td>
</tr>
<tr>
<td class="tlgrey">AC INPUT</td>
<td>90 - 264 VAC, 50 - 60 Hz</td>
</tr>
<tr>
<td class="tlgrey">MSRP</td>
<td>PSU: <a href="https://eurocom.com/ec/configure(2,404,0)780W">$299</a>, Cable: <a href="https://eurocom.com/ec/pricelist(2,404)780W">$129+</a></td>
</tr>
</tbody>
</table>
<p>Eurocom has offered this adapter for a few years now. But it’s taken on a new life as more laptops have been released that use such a large adapter (or two smaller 300W-ish power adapters). And, critically, Eurocom has <a href="https://eurocom.com/ec/release(409)ec">made additional DC cable/connector sets for other manufactuers’ laptops</a>, significantly increasing the number of systems it’s compatible with. Currently, Eurocom offers DC cables for the following laptops:</p>
<ul>
<li>Alienware M17x M18x; 1x DC Cable ; w/ barrel AW connector; 193cm/6.4ft </li>
<li>Alienware AREA 51m; 1x DC Cable + Splitter Box w/ 2x barrel AW connectors; 152cm/5ft </li>
<li>ASUS ROG G18 Strix; GX501V; GM501; GM501GM; GX531GM; 1x DC Cable; w/ barrel ROG connector </li>
<li>ASUS G703GX, GZ700GX; 1x DC Cable w/ 2x ROG barrel connectors; 152cm/5ft </li>
<li>CLEVO, OriginPC, Sager, XMG, EUROCOM laptops; 1x DC Cable; w/ 4-pin round connector; 182cm / 6ft </li>
<li>CLEVO X370SNx; 1x DC Cable; w/ square connector; 120cm / 3.8ft </li>
<li>CLEVO X170SM/X170KM; 1x DC Cable; w/ dual square connectors; 152cm / 5ft </li>
<li>Dell Precision 7720/7710; 1x DC Cable; w/ barrel Dell connector; 120cm / 3.8ft </li>
<li>MSI GE76, GT76, GT77, GE78HX Raider, Titan 18HX 1x DC Cable; w/ single square connector; 120cm / 3.8ft </li>
<li>MSI laptops & MSI Trident AS Gaming Desktops; 1x DC Cable; w/ 4-pin round connector; 182cm / 6ft </li>
</ul>
<h2>The Eurocom 780W AC Adapter</h2>
<p>Externally, the Eurocom 780W AC adapter looks like a hybrid between a PC PSU and a laptop adapter. It is shaped like an oversized laptop AC adapter but has a metallic body and cooling vents/fans. Eurocom advertises that it weighs “only 1.34kg”, which is the weight of an entire 14-inch laptop by comparison, but is relatively lightweight for a PSU with that kind of power output. The company logo is debossed across the top side of the adapter, with four round anti-slip pads found at its bottom. Care needs to be taken while moving it around because the metallic edges and weight can spell trouble for wooden surfaces.</p>
<p align="center"><a href="https://www.anandtech.com/show/21331/the-eurocom-780w-ac-power-adapter-review-big-power-for-big-laptops"><img alt="" src="https://images.anandtech.com/doci/21331/EUROCOM_780W_AC_DC_ADAPTER_01b_575px.jpg" /></a></p>
<p>Eurocom installed a small information display on the AC adapter, which shows the current, voltage, and power output, as well as the temperature of the adapter. It is not perfectly accur... Cases/Cooling/PSUs){kind=link}
![](https://web.whatsapp.com/send?text=The Eurocom 780W AC Power Adapter Review: Big Power For Big Laptops <p>While desktop PC power supplies receive the bulk of enthusiasts’ attention for good reasons – not the least of which being the vast selection of options that comes from being a standardized part – power supplies as a whole aren’t just a concern for big PCs. With the majority of PC sales having flipped to notebook sales some years ago, notebook power supplies already lead the market in volume. And while <em>most</em> laptops don’t need the kind of massively powered PSUs that dominate the desktop space, even that is slowly changing as desktop replacement-class laptops increasingly grow in performance and power consumption.</p>
<p>Perhaps the poster-child for the high-performance, high-powered laptop is Eurocom, who has a long history of developing heavy-duty DTR laptops that are all but portable desktop systems. Following recent trends in GPU power consumption and in GPU popularity for both gaming and AI workloads, the company has been selling a range of “mobile supercomputers”, which are practically large, tailor-made laptops that rival even the best of desktop computers – and have the power requirements to match.</p>
<p>In order to power their own high-end laptops, Eurocom has developed a rather unusual 780W AC adapter for high-performance laptops. Intended to power the most powerful of powerful laptops, their latest power adapter can supply over three-quarters of a kilowatt of DC power; a desktop-like wattage for a desktop-like device. It’s a laptop power adapter that’s unique in its scale, and with some room to scale up even further.</p>
<table border="0" style="text-align:center" width="88%">
<tbody>
<tr class="tgrey">
<td colspan="2">Eurocom 780W AC Adapter<br />
Power specifications</td>
</tr>
<tr class="tlblue">
<td>RAIL</td>
<td>+20V</td>
</tr>
<tr>
<td class="tlgrey" rowspan="2">MAX OUTPUT</td>
<td>39A</td>
</tr>
<tr>
<td>780W</td>
</tr>
<tr>
<td class="tlgrey">DIMENSIONS</td>
<td>325 x 110 x 40mm, 1.38kg</td>
</tr>
<tr>
<td class="tlgrey">AC INPUT</td>
<td>90 - 264 VAC, 50 - 60 Hz</td>
</tr>
<tr>
<td class="tlgrey">MSRP</td>
<td>PSU: <a href="https://eurocom.com/ec/configure(2,404,0)780W">$299</a>, Cable: <a href="https://eurocom.com/ec/pricelist(2,404)780W">$129+</a></td>
</tr>
</tbody>
</table>
<p>Eurocom has offered this adapter for a few years now. But it’s taken on a new life as more laptops have been released that use such a large adapter (or two smaller 300W-ish power adapters). And, critically, Eurocom has <a href="https://eurocom.com/ec/release(409)ec">made additional DC cable/connector sets for other manufactuers’ laptops</a>, significantly increasing the number of systems it’s compatible with. Currently, Eurocom offers DC cables for the following laptops:</p>
<ul>
<li>Alienware M17x M18x; 1x DC Cable ; w/ barrel AW connector; 193cm/6.4ft </li>
<li>Alienware AREA 51m; 1x DC Cable + Splitter Box w/ 2x barrel AW connectors; 152cm/5ft </li>
<li>ASUS ROG G18 Strix; GX501V; GM501; GM501GM; GX531GM; 1x DC Cable; w/ barrel ROG connector </li>
<li>ASUS G703GX, GZ700GX; 1x DC Cable w/ 2x ROG barrel connectors; 152cm/5ft </li>
<li>CLEVO, OriginPC, Sager, XMG, EUROCOM laptops; 1x DC Cable; w/ 4-pin round connector; 182cm / 6ft </li>
<li>CLEVO X370SNx; 1x DC Cable; w/ square connector; 120cm / 3.8ft </li>
<li>CLEVO X170SM/X170KM; 1x DC Cable; w/ dual square connectors; 152cm / 5ft </li>
<li>Dell Precision 7720/7710; 1x DC Cable; w/ barrel Dell connector; 120cm / 3.8ft </li>
<li>MSI GE76, GT76, GT77, GE78HX Raider, Titan 18HX 1x DC Cable; w/ single square connector; 120cm / 3.8ft </li>
<li>MSI laptops & MSI Trident AS Gaming Desktops; 1x DC Cable; w/ 4-pin round connector; 182cm / 6ft </li>
</ul>
<h2>The Eurocom 780W AC Adapter</h2>
<p>Externally, the Eurocom 780W AC adapter looks like a hybrid between a PC PSU and a laptop adapter. It is shaped like an oversized laptop AC adapter but has a metallic body and cooling vents/fans. Eurocom advertises that it weighs “only 1.34kg”, which is the weight of an entire 14-inch laptop by comparison, but is relatively lightweight for a PSU with that kind of power output. The company logo is debossed across the top side of the adapter, with four round anti-slip pads found at its bottom. Care needs to be taken while moving it around because the metallic edges and weight can spell trouble for wooden surfaces.</p>
<p align="center"><a href="https://www.anandtech.com/show/21331/the-eurocom-780w-ac-power-adapter-review-big-power-for-big-laptops"><img alt="" src="https://images.anandtech.com/doci/21331/EUROCOM_780W_AC_DC_ADAPTER_01b_575px.jpg" /></a></p>
<p>Eurocom installed a small information display on the AC adapter, which shows the current, voltage, and power output, as well as the temperature of the adapter. It is not perfectly accur... Cases/Cooling/PSUs | https://compbuddey.blogspot.com/2024/05/the-eurocom-780w-ac-power-adapter_13.html){kind=link}
![](mailto:?subject=The Eurocom 780W AC Power Adapter Review: Big Power For Big Laptops <p>While desktop PC power supplies receive the bulk of enthusiasts’ attention for good reasons – not the least of which being the vast selection of options that comes from being a standardized part – power supplies as a whole aren’t just a concern for big PCs. With the majority of PC sales having flipped to notebook sales some years ago, notebook power supplies already lead the market in volume. And while <em>most</em> laptops don’t need the kind of massively powered PSUs that dominate the desktop space, even that is slowly changing as desktop replacement-class laptops increasingly grow in performance and power consumption.</p>
<p>Perhaps the poster-child for the high-performance, high-powered laptop is Eurocom, who has a long history of developing heavy-duty DTR laptops that are all but portable desktop systems. Following recent trends in GPU power consumption and in GPU popularity for both gaming and AI workloads, the company has been selling a range of “mobile supercomputers”, which are practically large, tailor-made laptops that rival even the best of desktop computers – and have the power requirements to match.</p>
<p>In order to power their own high-end laptops, Eurocom has developed a rather unusual 780W AC adapter for high-performance laptops. Intended to power the most powerful of powerful laptops, their latest power adapter can supply over three-quarters of a kilowatt of DC power; a desktop-like wattage for a desktop-like device. It’s a laptop power adapter that’s unique in its scale, and with some room to scale up even further.</p>
<table border="0" style="text-align:center" width="88%">
<tbody>
<tr class="tgrey">
<td colspan="2">Eurocom 780W AC Adapter<br />
Power specifications</td>
</tr>
<tr class="tlblue">
<td>RAIL</td>
<td>+20V</td>
</tr>
<tr>
<td class="tlgrey" rowspan="2">MAX OUTPUT</td>
<td>39A</td>
</tr>
<tr>
<td>780W</td>
</tr>
<tr>
<td class="tlgrey">DIMENSIONS</td>
<td>325 x 110 x 40mm, 1.38kg</td>
</tr>
<tr>
<td class="tlgrey">AC INPUT</td>
<td>90 - 264 VAC, 50 - 60 Hz</td>
</tr>
<tr>
<td class="tlgrey">MSRP</td>
<td>PSU: <a href="https://eurocom.com/ec/configure(2,404,0)780W">$299</a>, Cable: <a href="https://eurocom.com/ec/pricelist(2,404)780W">$129+</a></td>
</tr>
</tbody>
</table>
<p>Eurocom has offered this adapter for a few years now. But it’s taken on a new life as more laptops have been released that use such a large adapter (or two smaller 300W-ish power adapters). And, critically, Eurocom has <a href="https://eurocom.com/ec/release(409)ec">made additional DC cable/connector sets for other manufactuers’ laptops</a>, significantly increasing the number of systems it’s compatible with. Currently, Eurocom offers DC cables for the following laptops:</p>
<ul>
<li>Alienware M17x M18x; 1x DC Cable ; w/ barrel AW connector; 193cm/6.4ft </li>
<li>Alienware AREA 51m; 1x DC Cable + Splitter Box w/ 2x barrel AW connectors; 152cm/5ft </li>
<li>ASUS ROG G18 Strix; GX501V; GM501; GM501GM; GX531GM; 1x DC Cable; w/ barrel ROG connector </li>
<li>ASUS G703GX, GZ700GX; 1x DC Cable w/ 2x ROG barrel connectors; 152cm/5ft </li>
<li>CLEVO, OriginPC, Sager, XMG, EUROCOM laptops; 1x DC Cable; w/ 4-pin round connector; 182cm / 6ft </li>
<li>CLEVO X370SNx; 1x DC Cable; w/ square connector; 120cm / 3.8ft </li>
<li>CLEVO X170SM/X170KM; 1x DC Cable; w/ dual square connectors; 152cm / 5ft </li>
<li>Dell Precision 7720/7710; 1x DC Cable; w/ barrel Dell connector; 120cm / 3.8ft </li>
<li>MSI GE76, GT76, GT77, GE78HX Raider, Titan 18HX 1x DC Cable; w/ single square connector; 120cm / 3.8ft </li>
<li>MSI laptops & MSI Trident AS Gaming Desktops; 1x DC Cable; w/ 4-pin round connector; 182cm / 6ft </li>
</ul>
<h2>The Eurocom 780W AC Adapter</h2>
<p>Externally, the Eurocom 780W AC adapter looks like a hybrid between a PC PSU and a laptop adapter. It is shaped like an oversized laptop AC adapter but has a metallic body and cooling vents/fans. Eurocom advertises that it weighs “only 1.34kg”, which is the weight of an entire 14-inch laptop by comparison, but is relatively lightweight for a PSU with that kind of power output. The company logo is debossed across the top side of the adapter, with four round anti-slip pads found at its bottom. Care needs to be taken while moving it around because the metallic edges and weight can spell trouble for wooden surfaces.</p>
<p align="center"><a href="https://www.anandtech.com/show/21331/the-eurocom-780w-ac-power-adapter-review-big-power-for-big-laptops"><img alt="" src="https://images.anandtech.com/doci/21331/EUROCOM_780W_AC_DC_ADAPTER_01b_575px.jpg" /></a></p>
<p>Eurocom installed a small information display on the AC adapter, which shows the current, voltage, and power output, as well as the temperature of the adapter. It is not perfectly accur... Cases/Cooling/PSUs&body=https://compbuddey.blogspot.com/2024/05/the-eurocom-780w-ac-power-adapter_13.html){kind=link}
HighPoint Updates NVMe RAID Cards for PCIe 5.0: 50 GBps+ Direct-Attached SSD Storage 
HighPoint Technologies has updated their NVMe switch and RAID solutions with PCIe 5.0, and supporting up to eight NVMe drives. The new HighPoint Rocket 1600 (switch add-in card) and 7600 series (RAID adapters) are the successors to the SSD SSD7500 series adapter cards introduced in 2020. Similar to its predecessors, the new Rocket series cards are also based on a Broadcom PCIe switch (PEX 89048). The Rocket 7600 series runs the RAID stack on the integrated ARM processor (dual-core Cortex A15)
The PEX 89048 supports up to 48 PCIe 5.0 lanes, out of which 16 are dedicated to the host connection in the Rocket adapters. The use of a true PCIe switch means that the product doesn't rely on PCIe lane bifurcation support in the host platform.
HighPoint's Gen 5 stack currently has two products each in the switch and RAID lineups - an add-in card with support for M.2 drives, and a RAID adapter with four 5.0 x8 SFF-TA-1016 (Mini Cool Edge IO or MCIO) connectors for use with backplanes / setups involving U.2 / U.3 / EDSFF drives.
The RAID adapters require HighPoint's drivers (available for Linux, macOS, and Windows), and supports RAID 0, RAID 1, and RAID 10 arrays. On the other hand, the AIC requires no custom drivers. RAID configurations with the AIC will need to be handled by software running on the host OS. On the hardware side, all members of the Rocket series come with an external power connector (as the solution can consume upwards of 75W) and integrate a heatsink. The M.2 version is actively cooled, as the drives are housed within the full-height / full-length cards.
The solution can theoretically support up to 64 GBps of throughput, but real-world performance is limited to around 56 GBps using Gen 5 drives. It must be noted that even Gen 4 drives can take advantage of the new platform and deliver better performance with the new Rocket series compared to the older SSD7500 series.
The cards are shipping now, with pricing ranging from $1500 (add-in card) to $2000 (RAID adapters). HighPoint is not alone in targeting this HEDT / workstation market. Sabrent has been teasing their Apex Gen 5.0 x16 solution involving eight M.2 SSDs for a few months now (involving a Microchip PCIe switch. Until that solution comes to the market, HighPoint appears to be the only game in town for workstation users requiring access to direct-attached storage capable of delivering 50 GBps+ speeds.
SSDs
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
HighPoint Updates NVMe RAID Cards for PCIe 5.0: 50 GBps+ Direct-Attached SSD Storage
HighPoint Technologies has updated their NVMe switch and RAID solutions with PCIe 5.0, and supporting up to eight NVMe drives. The new HighPoint Rocket 1600 (switch add-in card) and 7600 series (RAID adapters) are the successors to the SSD SSD7500 series adapter cards introduced in 2020. Similar to its predecessors, the new Rocket series cards are also based on a Broadcom PCIe switch (PEX 89048). The Rocket 7600 series runs the RAID stack on the integrated ARM processor (dual-core Cortex A15)
The PEX 89048 supports up to 48 PCIe 5.0 lanes, out of which 16 are dedicated to the host connection in the Rocket adapters. The use of a true PCIe switch means that the product doesn't rely on PCIe lane bifurcation support in the host platform.
HighPoint's Gen 5 stack currently has two products each in the switch and RAID lineups - an add-in card with support for M.2 drives, and a RAID adapter with four 5.0 x8 SFF-TA-1016 (Mini Cool Edge IO or MCIO) connectors for use with backplanes / setups involving U.2 / U.3 / EDSFF drives.
The RAID adapters require HighPoint's drivers (available for Linux, macOS, and Windows), and supports RAID 0, RAID 1, and RAID 10 arrays. On the other hand, the AIC requires no custom drivers. RAID configurations with the AIC will need to be handled by software running on the host OS. On the hardware side, all members of the Rocket series come with an external power connector (as the solution can consume upwards of 75W) and integrate a heatsink. The M.2 version is actively cooled, as the drives are housed within the full-height / full-length cards.
The solution can theoretically support up to 64 GBps of throughput, but real-world performance is limited to around 56 GBps using Gen 5 drives. It must be noted that even Gen 4 drives can take advantage of the new platform and deliver better performance with the new Rocket series compared to the older SSD7500 series.
The cards are shipping now, with pricing ranging from $1500 (add-in card) to $2000 (RAID adapters). HighPoint is not alone in targeting this HEDT / workstation market. Sabrent has been teasing their Apex Gen 5.0 x16 solution involving eight M.2 SSDs for a few months now (involving a Microchip PCIe switch. Until that solution comes to the market, HighPoint appears to be the only game in town for workstation users requiring access to direct-attached storage capable of delivering 50 GBps+ speeds.
SSDs
TSMC: Performance and Yields of 2nm on Track, Mass Production To Start In 2025 
In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, TSMC also shared progress of its N2 node as part of its Symposiums 2024. The company's first 2nm-class fabrication node, and predominantly featuring gate-all-around transistors, according to TSMC N2 has almost achieved its target performance and yield goals, which places it on track to enter high-volume manufacturing in the second half of 2025.
TSMC states that 'N2 development is well on track and N2P is next.' In particular, gate-all-around nanosheet devices currently achieve over 90% of their expected performance, whereas yields of 256 Mb SRAM (32 MB) devices already exceeds 80%, depending on the batch. All of this for a node that is over a year away from mass production.
Meanwhile, average yield of a 256 Mb SRAM was around 70% as of March, 2024, up from around 35% in April, 2023. Device performance has also been improving with higher frequencies being achieved while keeping power consumption in check.
Chip designer interest towards TSMC's first 2nm-class gate-all-around nanosheet transistor-based technology is significant, too. The number of new tape-outs (NTOs) in the first year of N2 is over two-times higher than it was for N5. Though with that said, given TSMC's close working relationship with a handful of high-volume vendors – most notably Appe – NTOs can be a very misleading figure since the first year of a new node at TSMC is capacity constrained, and consequently the bulk of that capacity goes to TSMC's priority partners.
Meanwhile, there were considerably more N5 tapeouts in its second year (some where N5P, of course) and N2 promises to have 2.6X more NTOs in its second year. So the node indeed looks quite promising. In fact, based on TSMC's slides (which we're unfortunately not able to republish), N2 is more popular than N3 in terms of NTOs both in the first and the second years of existence.
When it comes to the second year of N2, in the second half of 2026 TSMC plans to roll out its N2P technology, which promises additional performance and power benefits. N2P is expected to improve frequency by 15% - 20%, reduce power consumption by 30% - 40%, and increase chip density by over 1.15 times compared to N3E, significant benefits to move to all-new GAA nanosheet transistors.
Finally, for those companies that need the best in performance, power, and density, TSMC is poised to offer their A16 process in 2026. That node will also bring in backside power delivery, which will add costs, but is expected to greatly improve performance efficiency and scaling.
Semiconductors
Fadu's FC5161 SSD Controller Breaks Cover in Western Digital's PCIe Gen5 Enterprise Drives 
When Western Digital introduced its Ultrastar DC SN861 SSDs earlier this year, the company did not disclose which controller it used for these drives, which made many observers presume that WD was using an in-house controller. But a recent teardown of the drive shows that is not the case; instead, the company is using a controller from Fadu, a South Korean company founded in 2015 that specializes on enterprise-grade turnkey SSD solutions.
The Western Digital Ultrastar DC SN861 SSD is aimed at performance-hungry hyperscale datacenters and enterprise customers which are adopting PCIe Gen5 storage devices these days. And, as uncovered in photos from a recent Storage Review article, the drive is based on Fadu's FC5161 NVMe 2.0-compliant controller. The FC5161 utilizes 16 NAND channels supporting an ONFi 5.0 2400 MT/s interface, and features a combination of enterprise-grade capabilities (OCP Cloud Spec 2.0, SR-IOV, up to 512 name spaces for ZNS support, flexible data placement, NVMe-MI 1.2, advanced security, telemetry, power loss protection) not available on other off-the-shelf controllers – or on any previous Western Digital controllers.
The Ultrastar DC SN861 SSD offers sequential read speeds up to 13.7 GB/s as well as sequential write speeds up to 7.5 GB/s. As for random performance, it boasts with an up to 3.3 million random 4K read IOPS and up to 0.8 million random 4K write IOPS. The drives are available in capacities between 1.6 TB and 7.68 TB with one or three drive writes per day (DWPD) over five years rating as well as in U.2 and E1.S form-factors.
While the two form factors of the SN861 share a similar technical design, Western Digital has tailored each version for distinct workloads: the E1.S supports FDP and performance enhancements specifically for cloud environments. By contrast, the U.2 model is geared towards high-performance enterprise tasks and emerging applications like AI.
Without any doubts, Western Digital's Ultrastar DC SN861 is a feature-rich high-performance enterprise-grade SSD. It has another distinctive feature: a 5W idle power consumption, which is rather low by the standards of enterprise-grade drives (e.g., it is 1W lower compared to the SN840). While the difference with predecessors may be just 1W, hyperscalers deploy thousands of drives and for their TCO every watt counts.
Western Digital's Ultrastar DC SN861 SSDs are now available for purchase to select customers (such as Meta) and to interested parties. Prices are unknown, but they will depend on such factors as volumes.
Sources: Fadu, Storage Review
Storage
Fadu's FC5161 SSD Controller Breaks Cover in Western Digital's PCIe Gen5 Enterprise Drives
When Western Digital introduced its Ultrastar DC SN861 SSDs earlier this year, the company did not disclose which controller it used for these drives, which made many observers presume that WD was using an in-house controller. But a recent teardown of the drive shows that is not the case; instead, the company is using a controller from Fadu, a South Korean company founded in 2015 that specializes on enterprise-grade turnkey SSD solutions.
The Western Digital Ultrastar DC SN861 SSD is aimed at performance-hungry hyperscale datacenters and enterprise customers which are adopting PCIe Gen5 storage devices these days. And, as uncovered in photos from a recent Storage Review article, the drive is based on Fadu's FC5161 NVMe 2.0-compliant controller. The FC5161 utilizes 16 NAND channels supporting an ONFi 5.0 2400 MT/s interface, and features a combination of enterprise-grade capabilities (OCP Cloud Spec 2.0, SR-IOV, up to 512 name spaces for ZNS support, flexible data placement, NVMe-MI 1.2, advanced security, telemetry, power loss protection) not available on other off-the-shelf controllers – or on any previous Western Digital controllers.
The Ultrastar DC SN861 SSD offers sequential read speeds up to 13.7 GB/s as well as sequential write speeds up to 7.5 GB/s. As for random performance, it boasts with an up to 3.3 million random 4K read IOPS and up to 0.8 million random 4K write IOPS. The drives are available in capacities between 1.6 TB and 7.68 TB with one or three drive writes per day (DWPD) over five years rating as well as in U.2 and E1.S form-factors.
While the two form factors of the SN861 share a similar technical design, Western Digital has tailored each version for distinct workloads: the E1.S supports FDP and performance enhancements specifically for cloud environments. By contrast, the U.2 model is geared towards high-performance enterprise tasks and emerging applications like AI.
Without any doubts, Western Digital's Ultrastar DC SN861 is a feature-rich high-performance enterprise-grade SSD. It has another distinctive feature: a 5W idle power consumption, which is rather low by the standards of enterprise-grade drives (e.g., it is 1W lower compared to the SN840). While the difference with predecessors may be just 1W, hyperscalers deploy thousands of drives and for their TCO every watt counts.
Western Digital's Ultrastar DC SN861 SSDs are now available for purchase to select customers (such as Meta) and to interested parties. Prices are unknown, but they will depend on such factors as volumes.
Sources: Fadu, Storage Review
Storage
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
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Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
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