Intel Teases Lunar Lake At Intel Vision 2024: 100+ TOPS Overall, 45 TOPS From NPU Alone
During the main keynote at Intel Vision 2024, Intel CEO Pat Gelsinger flashed a completed Lunar Lake chip off, much like EVP and General Manager of Intel's Client Computing Group (CCG) Michelle Johnston Holthaus did back at CES 2024. The contrast between the two glimpses of the Lunar Lake chip is that Pat Gelsinger gave us something juicier than just a photo op. He clarified and claimed the levels of AI performance we can expect to see when Lunar Lake launches.
According to Intel's CEO Pat Gelsinger, Lunar Lake, scheduled to be launched towards the end of this year, is set to raise the bar even further regarding on-chip AI capabilities and performance. At Intel's own Vision event, aptly named Intel Vision, current CEO of Intel Pat Gelsinger stated during his presentation that Lunar Lake will be the 'flagship SoC' for the next generation of AI PCs. Intel claims that Lunar Lake will have 3X the AI performance of their current Meteor Lake SoC, which is impressive as Meteor Lake is estimated to be running around 34 TOPS combined with the NPU, GPU, and CPU.
Factoring in the NPU within Meteor Lake, 11 of the 34 TOPS come solely from the NPU. Still, Intel claims that the NPU on Lunar Lake will hit a large 45 TOPs, akin to the Hailo-10 add-in card and similar to Qualcomm's Snapdragon X Elite processor. Factoring in the integrated graphics and the compute cores, Intel is claiming a combined total of over 100 TOPS, and with Microsoft's self-imposed guidelines of what constitutes an 'AI PC' coming in at 40 TOPS, Intel's NPU fits the bill.
Intel also alludes to how they are gaining a load of TOPS performance from the NPU, whether that be with new technologies; the NPU will likely be built in a more advanced node, perhaps Intel 18A. Another thing Intel didn't highlight was how they were measuring the TOPS performance, whether that be INT8 or INT4.
Still, one thing is clear: Intel wants to increase on-chip AI capabilities in desktop PCs and notebooks with each generation. Intel is also attempting to leverage more AI performance to help boost its goal to ship 100 million AI PCs by the end of 2025. Intel has already announced that it's shipped 5 million thus far and plans to sell another 40 million units by the end of the year.
CPUs
Posted by The Techinical Support
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
Storage
The Endorfy Fortis 5 Dual Fan CPU Cooler Review: Towering Value Standard CPU coolers, while adequate for managing basic thermal loads, often fall short in terms of noise reduction and superior cooling efficiency. This limitation drives advanced users and system builders to seek aftermarket solutions tailored to their specific needs. The high-end aftermarket cooler market is highly competitive, with manufacturers striving to offer products with exceptional performance.
Endorfy, previously known as SilentiumPC, is a Polish manufacturer that has undergone a significant transformation to expand its presence in global markets. The brand is known for delivering high-performance cooling solutions with a strong focus on balancing efficiency and affordability. By rebranding as Endorfy, the company aims to enter premium market segments while continuing to offer reliable, high-quality cooling products.
SilentiumPC became very popular in the value/mainstream segments of the PC market with their products, the spearhead of which probably was the Fera 5 cooler that we reviewed a little over two years ago and had a remarkable value for money. Today’s review places Endorfy’s largest CPU cooler, the Fortis 5 Dual Fan, on our laboratory test bench. The Fortis 5 is the largest CPU air cooler the company currently offers and is significantly more expensive than the Fera 5, yet it still is a single-tower cooler that strives to strike a balance between value, compatibility, and performance.
Cases/Cooling/PSUs
Samsung's 128 TB-Class BM1743 Enterprise SSD Displayed at FMS 2024
Samsung had quietly launched its BM1743 enterprise QLC SSD last month with a hefty 61.44 TB SKU. At FMS 2024, the company had the even larger 122.88 TB version of that SSD on display, alongside a few recorded benchmarking sessions. Compared to the previous generation, the BM1743 comes with a 4.1x improvement in I/O performance, improvement in data retention, and a 45% improvement in power efficiency for sequential writes.
The 128 TB-class QLC SSD boasts of sequential read speeds of 7.5 GBps and write speeds of 3 GBps. Random reads come in at 1.6 M IOPS, while 16 KB random writes clock in at 45K IOPS. Based on the quoted random write access granularity, it appears that Samsung is using a 16 KB indirection unit (IU) to optimize flash management. This is similar to the strategy adopted by Solidigm with IUs larger than 4K in their high-capacity SSDs.
A recorded benchmark session on the company's PM9D3a 8-channel Gen 5 SSD was also on display.
The SSD family is being promoted as a mainstream option for datacenters, and boasts of sequential reads up to 12 GBps and writes up to 6.8 GBps. Random reads clock in at 2 M IOPS, and random writes at 400 K IOPS.
Available in multiple form-factors up to 32 TB (M.2 tops out at 2 TB), the drive's firmware includes optional support for flexible data placement (FDP) to help address the write amplification aspect.
The PM1753 is the current enterprise SSD flagship in Samsung's lineup. With support for 16 NAND channels and capacities up to 32 TB, this U.2 / E3.S SSD has advertised sequential read and write speeds of 14.8 GBps and 11 GBps respectively. Random reads and writes for 4 KB accesses are listed at 3.4 M and 600 K IOPS.
Samsung claims a 1.7x performance improvement and a 1.7x power efficiency improvement over the previous generation (PM1743), making this TLC SSD suitable for AI servers.
The 9th Gen. V-NAND wafer was also available for viewing, though photography was prohibited. Mass production of this flash memory began in April 2024.
Storage
Intel Sells Its Arm Shares, Reduces Stakes in Other Companies
Intel has divested its entire stake in Arm Holdings during the second quarter, raising approximately $147 million. Alongside this, Intel sold its stake in cybersecurity firm ZeroFox and reduced its holdings in Astera Labs, all as part of a broader effort to manage costs and recover cash amid significant financial challenges.
The sale of Intel's 1.18 million shares in Arm Holdings, as reported in a recent SEC filing, comes at a time when the company is struggling with substantial financial losses. Despite the $147 million generated from the sale, Intel reported a $120 million net loss on its equity investments for the quarter, which is a part of a larger $1.6 billion loss that Intel faced during this period.
In addition to selling its stake in Arm, Intel also exited its investment in ZeroFox and reduced its involvement with Astera Labs, a company known for developing connectivity platforms for enterprise hardware. These moves are in line with Intel's strategy to reduce costs and stabilize its financial position as it faces ongoing market challenges.
Despite the divestment, Intel's past investment in Arm was likely driven by strategic considerations. Arm Holdings is a significant force in the semiconductor industry, with its designs powering most mobile devices, and, for obvious reasons, Intel would like to address these. Intel and Arm are also collaborating on datacenter platforms tailored for Intel's 18A process technology. Additionally, Arm might view Intel as a potential licensee for its technologies and a valuable partner for other companies that license Arm's designs.
Intel's investment in Astera Labs was also a strategic one as the company probably wanted to secure steady supply of smart retimers, smart cable modems, and CXL memory controller, which are used in volumes in datacenters and Intel is certainly interested in selling as many datacenter CPUs as possible.
Intel's financial struggles were highlighted earlier this month when the company released a disappointing earnings report, which led to a 33% drop in its stock value, erasing billions of dollars of capitalization. To counter these difficulties, Intel announced plans to cut 15,000 jobs and implement other expense reductions. The company has also suspended its dividend, signaling the depth of its efforts to conserve cash and focus on recovery. When it comes to divestment of Arm stock, the need for immediate financial stabilization has presumably taken precedence, leading to the decision.
CPUs
CXL Gathers Momentum at FMS 2024
![](https://twitter.com/share?url=https://compbuddey.blogspot.com/2024/04/intel-teases-lunar-lake-at-intel-vision_29.html&text=Intel Teases Lunar Lake At Intel Vision 2024: 100+ TOPS Overall, 45 TOPS From NPU Alone <p align="center"><a href="https://www.anandtech.com/show/21346/intel-teases-lunar-lake-at-intel-vision-2024-100-tops-overall-45-tops-from-npu-alone"><img src="https://images.anandtech.com/doci/21346/K9S4RdVcA8G6EvnE5Uib4A-970-80ss_575px.jpg" alt="" /></a></p><p><p>During the main keynote at Intel Vision 2024, Intel CEO Pat Gelsinger flashed a completed Lunar Lake chip off, much like EVP and General Manager of Intel's Client Computing Group (CCG) Michelle Johnston Holthaus did back at CES 2024. The contrast between the two glimpses of the Lunar Lake chip is that Pat Gelsinger gave us something juicier than just a photo op. He clarified and claimed the levels of AI performance we can expect to see when Lunar Lake launches.</p>
<p>According to Intel's CEO Pat Gelsinger, Lunar Lake, scheduled to be launched towards the end of this year, is set to raise the bar even further regarding on-chip AI capabilities and performance. At Intel's own Vision event, aptly named Intel Vision, current CEO of Intel Pat Gelsinger stated during his presentation that Lunar Lake will be the 'flagship SoC' for the next generation of AI PCs. Intel claims that Lunar Lake will have 3X the AI performance of their current Meteor Lake SoC, which is impressive as Meteor Lake is estimated to be running around 34 TOPS combined with the NPU, GPU, and CPU.</p>
<p align="center"><a href="https://www.anandtech.com/show/21346/intel-teases-lunar-lake-at-intel-vision-2024-100-tops-overall-45-tops-from-npu-alone"><img alt="" src="https://images.anandtech.com/doci/21346/GKvk0HjaAAA0jp7dd_575px.jpg" /></a></p>
<p>Factoring in the NPU within Meteor Lake, 11 of the 34 TOPS come solely from the NPU. Still, Intel claims that the NPU on Lunar Lake will hit a large 45 TOPs, akin to the Hailo-10 add-in card and similar to Qualcomm's Snapdragon X Elite processor. Factoring in the integrated graphics and the compute cores, Intel is claiming a combined total of over 100 TOPS, and with Microsoft's self-imposed guidelines of what constitutes an 'AI PC' coming in at 40 TOPS, Intel's NPU fits the bill.</p>
<p>Intel also alludes to how they are gaining a load of TOPS performance from the NPU, whether that be with new technologies; the NPU will likely be built in a more advanced node, perhaps Intel 18A. Another thing Intel didn't highlight was how they were measuring the TOPS performance, whether that be INT8 or INT4.</p>
<p>Still, one thing is clear: Intel wants to increase on-chip AI capabilities in desktop PCs and notebooks with each generation. Intel is also attempting to leverage more AI performance to help boost its goal to ship 100 million AI PCs by the end of 2025. Intel has already announced that it's shipped 5 million thus far and plans to sell another 40 million units by the end of the year.</p>
</p> CPUs){kind=link}
![](https://www.pinterest.com/pin/create/button/?url=https://compbuddey.blogspot.com/2024/04/intel-teases-lunar-lake-at-intel-vision_29.html&media=https://lh3.googleusercontent.com/blogger_img_proxy/AEn0k_sTXTMcwstdkvz1WQx7EPCGqbT2x1EZc4T1yqb0LNSD_RuHl53cUdfRXYgw-cDxew-ATX3wfMCFE8RL041pbHcUMEAMozXZ_hiwANNE9Av63zpRHK0U4krsulGjBPgtOPzcOswladmkB3HG4KWRn51UeShfKg&description=Intel Teases Lunar Lake At Intel Vision 2024: 100+ TOPS Overall, 45 TOPS From NPU Alone <p align="center"><a href="https://www.anandtech.com/show/21346/intel-teases-lunar-lake-at-intel-vision-2024-100-tops-overall-45-tops-from-npu-alone"><img src="https://images.anandtech.com/doci/21346/K9S4RdVcA8G6EvnE5Uib4A-970-80ss_575px.jpg" alt="" /></a></p><p><p>During the main keynote at Intel Vision 2024, Intel CEO Pat Gelsinger flashed a completed Lunar Lake chip off, much like EVP and General Manager of Intel's Client Computing Group (CCG) Michelle Johnston Holthaus did back at CES 2024. The contrast between the two glimpses of the Lunar Lake chip is that Pat Gelsinger gave us something juicier than just a photo op. He clarified and claimed the levels of AI performance we can expect to see when Lunar Lake launches.</p>
<p>According to Intel's CEO Pat Gelsinger, Lunar Lake, scheduled to be launched towards the end of this year, is set to raise the bar even further regarding on-chip AI capabilities and performance. At Intel's own Vision event, aptly named Intel Vision, current CEO of Intel Pat Gelsinger stated during his presentation that Lunar Lake will be the 'flagship SoC' for the next generation of AI PCs. Intel claims that Lunar Lake will have 3X the AI performance of their current Meteor Lake SoC, which is impressive as Meteor Lake is estimated to be running around 34 TOPS combined with the NPU, GPU, and CPU.</p>
<p align="center"><a href="https://www.anandtech.com/show/21346/intel-teases-lunar-lake-at-intel-vision-2024-100-tops-overall-45-tops-from-npu-alone"><img alt="" src="https://images.anandtech.com/doci/21346/GKvk0HjaAAA0jp7dd_575px.jpg" /></a></p>
<p>Factoring in the NPU within Meteor Lake, 11 of the 34 TOPS come solely from the NPU. Still, Intel claims that the NPU on Lunar Lake will hit a large 45 TOPs, akin to the Hailo-10 add-in card and similar to Qualcomm's Snapdragon X Elite processor. Factoring in the integrated graphics and the compute cores, Intel is claiming a combined total of over 100 TOPS, and with Microsoft's self-imposed guidelines of what constitutes an 'AI PC' coming in at 40 TOPS, Intel's NPU fits the bill.</p>
<p>Intel also alludes to how they are gaining a load of TOPS performance from the NPU, whether that be with new technologies; the NPU will likely be built in a more advanced node, perhaps Intel 18A. Another thing Intel didn't highlight was how they were measuring the TOPS performance, whether that be INT8 or INT4.</p>
<p>Still, one thing is clear: Intel wants to increase on-chip AI capabilities in desktop PCs and notebooks with each generation. Intel is also attempting to leverage more AI performance to help boost its goal to ship 100 million AI PCs by the end of 2025. Intel has already announced that it's shipped 5 million thus far and plans to sell another 40 million units by the end of the year.</p>
</p> CPUs){kind=link}
![](https://web.whatsapp.com/send?text=Intel Teases Lunar Lake At Intel Vision 2024: 100+ TOPS Overall, 45 TOPS From NPU Alone <p align="center"><a href="https://www.anandtech.com/show/21346/intel-teases-lunar-lake-at-intel-vision-2024-100-tops-overall-45-tops-from-npu-alone"><img src="https://images.anandtech.com/doci/21346/K9S4RdVcA8G6EvnE5Uib4A-970-80ss_575px.jpg" alt="" /></a></p><p><p>During the main keynote at Intel Vision 2024, Intel CEO Pat Gelsinger flashed a completed Lunar Lake chip off, much like EVP and General Manager of Intel's Client Computing Group (CCG) Michelle Johnston Holthaus did back at CES 2024. The contrast between the two glimpses of the Lunar Lake chip is that Pat Gelsinger gave us something juicier than just a photo op. He clarified and claimed the levels of AI performance we can expect to see when Lunar Lake launches.</p>
<p>According to Intel's CEO Pat Gelsinger, Lunar Lake, scheduled to be launched towards the end of this year, is set to raise the bar even further regarding on-chip AI capabilities and performance. At Intel's own Vision event, aptly named Intel Vision, current CEO of Intel Pat Gelsinger stated during his presentation that Lunar Lake will be the 'flagship SoC' for the next generation of AI PCs. Intel claims that Lunar Lake will have 3X the AI performance of their current Meteor Lake SoC, which is impressive as Meteor Lake is estimated to be running around 34 TOPS combined with the NPU, GPU, and CPU.</p>
<p align="center"><a href="https://www.anandtech.com/show/21346/intel-teases-lunar-lake-at-intel-vision-2024-100-tops-overall-45-tops-from-npu-alone"><img alt="" src="https://images.anandtech.com/doci/21346/GKvk0HjaAAA0jp7dd_575px.jpg" /></a></p>
<p>Factoring in the NPU within Meteor Lake, 11 of the 34 TOPS come solely from the NPU. Still, Intel claims that the NPU on Lunar Lake will hit a large 45 TOPs, akin to the Hailo-10 add-in card and similar to Qualcomm's Snapdragon X Elite processor. Factoring in the integrated graphics and the compute cores, Intel is claiming a combined total of over 100 TOPS, and with Microsoft's self-imposed guidelines of what constitutes an 'AI PC' coming in at 40 TOPS, Intel's NPU fits the bill.</p>
<p>Intel also alludes to how they are gaining a load of TOPS performance from the NPU, whether that be with new technologies; the NPU will likely be built in a more advanced node, perhaps Intel 18A. Another thing Intel didn't highlight was how they were measuring the TOPS performance, whether that be INT8 or INT4.</p>
<p>Still, one thing is clear: Intel wants to increase on-chip AI capabilities in desktop PCs and notebooks with each generation. Intel is also attempting to leverage more AI performance to help boost its goal to ship 100 million AI PCs by the end of 2025. Intel has already announced that it's shipped 5 million thus far and plans to sell another 40 million units by the end of the year.</p>
</p> CPUs | https://compbuddey.blogspot.com/2024/04/intel-teases-lunar-lake-at-intel-vision_29.html){kind=link}
![](mailto:?subject=Intel Teases Lunar Lake At Intel Vision 2024: 100+ TOPS Overall, 45 TOPS From NPU Alone <p align="center"><a href="https://www.anandtech.com/show/21346/intel-teases-lunar-lake-at-intel-vision-2024-100-tops-overall-45-tops-from-npu-alone"><img src="https://images.anandtech.com/doci/21346/K9S4RdVcA8G6EvnE5Uib4A-970-80ss_575px.jpg" alt="" /></a></p><p><p>During the main keynote at Intel Vision 2024, Intel CEO Pat Gelsinger flashed a completed Lunar Lake chip off, much like EVP and General Manager of Intel's Client Computing Group (CCG) Michelle Johnston Holthaus did back at CES 2024. The contrast between the two glimpses of the Lunar Lake chip is that Pat Gelsinger gave us something juicier than just a photo op. He clarified and claimed the levels of AI performance we can expect to see when Lunar Lake launches.</p>
<p>According to Intel's CEO Pat Gelsinger, Lunar Lake, scheduled to be launched towards the end of this year, is set to raise the bar even further regarding on-chip AI capabilities and performance. At Intel's own Vision event, aptly named Intel Vision, current CEO of Intel Pat Gelsinger stated during his presentation that Lunar Lake will be the 'flagship SoC' for the next generation of AI PCs. Intel claims that Lunar Lake will have 3X the AI performance of their current Meteor Lake SoC, which is impressive as Meteor Lake is estimated to be running around 34 TOPS combined with the NPU, GPU, and CPU.</p>
<p align="center"><a href="https://www.anandtech.com/show/21346/intel-teases-lunar-lake-at-intel-vision-2024-100-tops-overall-45-tops-from-npu-alone"><img alt="" src="https://images.anandtech.com/doci/21346/GKvk0HjaAAA0jp7dd_575px.jpg" /></a></p>
<p>Factoring in the NPU within Meteor Lake, 11 of the 34 TOPS come solely from the NPU. Still, Intel claims that the NPU on Lunar Lake will hit a large 45 TOPs, akin to the Hailo-10 add-in card and similar to Qualcomm's Snapdragon X Elite processor. Factoring in the integrated graphics and the compute cores, Intel is claiming a combined total of over 100 TOPS, and with Microsoft's self-imposed guidelines of what constitutes an 'AI PC' coming in at 40 TOPS, Intel's NPU fits the bill.</p>
<p>Intel also alludes to how they are gaining a load of TOPS performance from the NPU, whether that be with new technologies; the NPU will likely be built in a more advanced node, perhaps Intel 18A. Another thing Intel didn't highlight was how they were measuring the TOPS performance, whether that be INT8 or INT4.</p>
<p>Still, one thing is clear: Intel wants to increase on-chip AI capabilities in desktop PCs and notebooks with each generation. Intel is also attempting to leverage more AI performance to help boost its goal to ship 100 million AI PCs by the end of 2025. Intel has already announced that it's shipped 5 million thus far and plans to sell another 40 million units by the end of the year.</p>
</p> CPUs&body=https://compbuddey.blogspot.com/2024/04/intel-teases-lunar-lake-at-intel-vision_29.html){kind=link}
The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had announced v3.0 of the CXL specifications. This was followed by CXL 3.1's introduction at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly subsumed other competing standards such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on the device side. At FMS 2024, CXL had a prime position in the booth demos of many vendors.
The migration of server platforms from DDR4 to DDR5, along with the rise of workloads demanding large RAM capacity (but not particularly sensitive to either memory bandwidth or latency), has opened up memory expansion modules as one of the first set of widely available CXL devices. Over the last couple of years, we have had product announcements from Samsung and Micron in this area.
SK hynix CMM-DDR5 CXL Memory Module and HMSDK
At FMS 2024, SK hynix was showing off their DDR5-based CMM-DDR5 CXL memory module with a 128 GB capacity. The company was also detailing their associated Heterogeneous Memory Software Development Kit (HMSDK) - a set of libraries and tools at both the kernel and user levels aimed at increasing the ease of use of CXL memory. This is achieved in part by considering the memory pyramid / hierarchy and relocating the data between the server's main memory (DRAM) and the CXL device based on usage frequency.
The CMM-DDR5 CXL memory module comes in the SDFF form-factor (E3.S 2T) with a PCIe 3.0 x8 host interface. The internal memory is based on 1α technology DRAM, and the device promises DDR5-class bandwidth and latency within a single NUMA hop. As these memory modules are meant to be used in datacenters and enterprises, the firmware includes features for RAS (reliability, availability, and serviceability) along with secure boot and other management features.
SK hynix was also demonstrating Niagara 2.0 - a hardware solution (currently based on FPGAs) to enable memory pooling and sharing - i.e, connecting multiple CXL memories to allow different hosts (CPUs and GPUs) to optimally share their capacity. The previous version only allowed capacity sharing, but the latest version enables sharing of data also. SK hynix had presented these solutions at the CXL DevCon 2024 earlier this year, but some progress seems to have been made in finalizing the specifications of the CMM-DDR5 at FMS 2024.
Microchip and Micron Demonstrate CZ120 CXL Memory Expansion Module
Micron had unveiled the CZ120 CXL Memory Expansion Module last year based on the Microchip SMC 2000 series CXL memory controller. At FMS 2024, Micron and Microchip had a demonstration of the module on a Granite Rapids server.
Additional insights into the SMC 2000 controller were also provided.
The CXL memory controller also incorporates DRAM die failure handling, and Microchip also provides diagnostics and debug tools to analyze failed modules. The memory controller also supports ECC, which forms part of the enterprise... Storage
Lorem Ipsum is simply dummy text of the printing and typesetting industry. Lorem Ipsum has been the industry's.
Kioxia Details BiCS 8 NAND at FMS 2024: 218 Layers With Superior Scaling
Kioxia's booth at FMS 2024 was a busy one with multiple technology demonstrations keeping visitors occupied. A walk-through of the BiCS 8 manufacturing process was the first to grab my attention. Kioxia and Western Digital announced the sampling of BiCS 8 in March 2023. We had touched briefly upon its CMOS Bonded Array (CBA) scheme in our coverage of Kioxial's 2Tb QLC NAND device and coverage of Western Digital's 128 TB QLC enterprise SSD proof-of-concept demonstration. At Kioxia's booth, we got more insights.
Traditionally, fabrication of flash chips involved placement of the associate logic circuitry (CMOS process) around the periphery of the flash array. The process then moved on to putting the CMOS under the cell array, but the wafer development process was serialized with the CMOS logic getting fabricated first followed by the cell array on top. However, this has some challenges because the cell array requires a high-temperature processing step to ensure higher reliability that can be detrimental to the health of the CMOS logic. Thanks to recent advancements in wafer bonding techniques, the new CBA process allows the CMOS wafer and cell array wafer to be processed independently in parallel and then pieced together, as shown in the models above.
The BiCS 8 3D NAND incorporates 218 layers, compared to 112 layers in BiCS 5 and 162 layers in BiCS 6. The company decided to skip over BiCS 7 (or, rather, it was probably a short-lived generation meant as an internal test vehicle). The generation retains the four-plane charge trap structure of BiCS 6. In its TLC avatar, it is available as a 1 Tbit device. The QLC version is available in two capacities - 1 Tbit and 2 Tbit.
Kioxia also noted that while the number of layers (218) doesn't compare favorably with the latest layer counts from the competition, its lateral scaling / cell shrinkage has enabled it to be competitive in terms of bit density as well as operating speeds (3200 MT/s). For reference, the latest shipping NAND from Micron - the G9 - has 276 layers with a bit density in TLC mode of 21 Gbit/mm2, and operates at up to 3600 MT/s. However, its 232L NAND operates only up to 2400 MT/s and has a bit density of 14.6 Gbit/mm2.
It must be noted that the CBA hybrid bonding process has advantages over the current processes used by other vendors - including Micron's CMOS under array (CuA) and SK hynix's 4D PUC (periphery-under-chip) developed in the late 2010s. It is expected that other NAND vendors will also move eventually to some variant of the hybrid bonding scheme used by Kioxia.
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